20UPGPQ4810360

MODULE/GRAVEYARD

Component Information

Serial Number 20UPGPQ4810360
ProdDB ID  0e9e46…dd9ad5
LocalDB ID 6814e9c7d10b377693beec68
Component Type MODULE_PCB
Parents 20UPGM24810360 
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer Tecnomec
PCB design version readonly 4
PCB vendor technology readonly 8
PCB BOM version 22
SMD population vendor Norbit EMS AS

 Comments


Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date a month ago
component ObjectId 6814e9c7d10b377693beec68
Stage PCB_RECEPTION_MODULE_SITE
Test Type VISUAL_INSPECTION
Institute ObjectId
User Name ThomasNaquin
ObjectId of this record 6992fad8fdfa7d87232439a9
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat vNone
INSTRUMENT None
OPERATOR None
COMPONENT_MISALIGNMENT_GRADE N/A
DATA_CONNECTOR_ASSEMBLY_GRADE N/A
HV_LV_CONNECTOR_ASSEMBLY_GRADE N/A
OBSERVATION N/A
OPENS_TOMBSTONING_GRADE N/A
OVERALL_GRADE 1
PARTICULATE_CONTAMINATION_GRADE 1
SCRATCHES_GRADE N/A
SHORTS_OR_CLOSE_PROXIMITY_GRADE N/A
SOLDERMASK_IRREGULARITIES_GRADE N/A
SOLDER_SPILLS_GRADE N/A
TRACES_GRADE N/A
WATERMARKS_GRADE 1
WIREBOND_PADS_CONTAMINATION_GRADE 1

ProductionDB Record

id6992fad8fdfa7d87232439a9
stateready
stateTs2026-02-16T11:09:12.738Z
stateUserIdentity8769-4020-1
date2026-02-16T11:08:00.000Z
testType
id5f644fba928ccc000ad1215f
codeVISUAL_INSPECTION
nameVisual Inspection
stateactive
institution
id5d372a3becb4750009835557
codeIJCLAB
nameLaboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)
user
id66e9329c0fc5b30042e7f088
userIdentity8769-4020-1
firstNameThomas
middleName
lastNameNaquin
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis versionstringsingleFalseNoneNoneNone
INSTRUMENTInstrumentstringsingleFalseNoneNoneNone
OPERATOROperatorstringsingleFalseNoneNoneNone
results
  • codeCOMPONENT_MISALIGNMENT_GRADE
    nameComponent misalignment (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeDATA_CONNECTOR_ASSEMBLY_GRADE
    nameData connector assembly issue (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeHV_LV_CONNECTOR_ASSEMBLY_GRADE
    nameHV LV connector assembly issue (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeOBSERVATION
    nameObservation
    dataTypestring
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeOPENS_TOMBSTONING_GRADE
    nameOpens or tombstoning, where one end of the component lifts from a pad of the PCB during the soldering process, (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    valueNone
    associateChildNone
  • codeOVERALL_GRADE
    nameOverall grade (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codePARTICULATE_CONTAMINATION_GRADE
    nameParticulate contamination on the PCB including pick-up points (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeSCRATCHES_GRADE
    nameScratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeSHORTS_OR_CLOSE_PROXIMITY_GRADE
    nameShorts/close proximity of components due to misalignment (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeSOLDERMASK_IRREGULARITIES_GRADE
    nameSoldermask irregularity/cracks grade (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeSOLDER_SPILLS_GRADE
    nameSolder spills as part of assembly process on wirebonding pads (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNone
    associateChildNone
  • codeTRACES_GRADE
    nameIssues seen on traces like spurious copper, spur, mousebit, pin hole, short, breakout etc. that reduce/cut the copper traces width (grade 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    valueNone
    associateChildNone
  • codeWATERMARKS_GRADE
    nameWatermarks on the PCB (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeWIREBOND_PADS_CONTAMINATION_GRADE
    nameWirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
cts2026-02-16T11:09:12.738Z
sys
cts2026-02-16T11:09:12.738Z
mts2026-02-16T11:09:12.738Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6814e9c7d10b377693beec680e9e462377ce7e2a78d7c4801fdd9ad5ready2025-05-02T15:50:31.605Z7680-5063-1FalseFalseNoneNoneFalseNoneNone20UPGPQ4810360None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueTecnomec
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueProduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueTecnomec (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codePCB_BOM_VERSION
    namePCB BOM version
    dataTypecodeTable
    requiredFalse
    defaultFalse
    valueV2 L2
    codeTable
    codevalue
    10V1.1 L0
    11V1.1 L1
    12V1.1 L2
    20V2 L0
    21V2 L1
    22V2 L2
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueNorbit EMS AS
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order13
initialFalse
finalFalse
codeGL
nameGlasgow University

 Current Stage: Modules damaged, impossible to recover

Past QC Stages and Results

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test Local Result ProdDB Record
Mass
(MASS)		 Registered Registered
Metrology
(METROLOGY)		 Registered Registered
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)		 No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 Registered Registered
LV and HV Test
(HV_LV_TEST)		 Registered Registered
Tab cutting and gross defect inspection
(QUICK_TAB_CUTTING_INSPECTION)		 Registered Registered

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)		 Registered Registered
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 Registered Registered
Image capture test
(IMAGE_CAPTURE_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 Registered Registered
Metrology
(METROLOGY)		 No result N/A
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)		 No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
6992fb…965515 PCB_RECEPTION_MODULE_SITE METROLOGY ThomasNaquin N/A a month ago No tags Selected
6992fa…2439a9 PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION ThomasNaquin N/A a month ago No tags Selected
6992fa…9d92ef PCB_RECEPTION_MODULE_SITE MASS ThomasNaquin N/A a month ago No tags Selected
684983…cedfec PCB_RECEPTION LAYER_THICKNESS SnehaAmogh Naik N/A 10 months ago No tags Selected
68481d…ab043d PCB_RECEPTION DOWEL_TOLERANCE_CHECK SnehaAmogh Naik N/A 10 months ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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