20UPGB43200364

MODULE/QC_CROSSCHECK

Component Information

Serial Number 20UPGB43200364
ProdDB ID  92d9a2…edaa5e
LocalDB ID 6810f23e54aadc8e96c6f24d
Component Type BARE_MODULE
Parents 20UPGM24210577 
Children 20UPGFC0146775 FE Chip 20UPGFC0146872 FE Chip 20UPGFC0146891 FE Chip 20UPGFC0146778 FE Chip 20UPGS33304726 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 3
Sensor Type 5
Vendor code readonly 2
Thickness of FE chips (RD53A) None

 Comments


Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 4 months ago
component ObjectId 6810f23e54aadc8e96c6f24d
Stage BAREMODULERECEPTION
Test Type QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name Simpson,Liana Rae
ObjectId of this record 68afd5721c401c65b5fda341
ObjectId of RAW record None
Tags No tags

Results

Key Data
BARE_MODULE_THICKNESS 344.4
BARE_MODULE_THICKNESS_STD_DEVIATION 3.4
FECHIPS_X 42.24441
FECHIPS_Y 40.27667
FECHIP_THICKNESS 173
FECHIP_THICKNESS_STD_DEVIATION 4
SENSOR_X 39.52982
SENSOR_Y 41.11102

ProductionDB Record

id68afd5721c401c65b5fda341
stateready
stateTs2025-08-28T04:05:06.824Z
stateUserIdentity1294-8027-1
date2025-07-11T15:56:12.000Z
testType
id5f87e63950d75e000a335aac
codeQUAD_BARE_MODULE_METROLOGY
name Quad Bare Module Metrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id6797ca0f2ffbf908f24868f9
userIdentity1294-8027-1
firstNameSimpson,
middleName
lastNameLiana Rae
runNumber1
passedTrue
problemsFalse
properties
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
BARE_MODULE_THICKNESSAverage bare module thickness [µm]floatsingleNoneFalse344.4None
BARE_MODULE_THICKNESS_STD_DEVIATIONStd deviation of bare module thickness [µm]floatsingleNoneFalse3.4None
FECHIPS_XFE chips x dimension [mm]floatsingle1False42.24441None
FECHIPS_YFE chips y dimension [mm]floatsingle1False40.27667None
FECHIP_THICKNESSAverage FE chip thickness [µm]floatsingleNoneFalse173None
FECHIP_THICKNESS_STD_DEVIATIONStd deviation of FE chip thickness [µm]floatsingleNoneFalse4None
SENSOR_XSensor dimension in x [mm]floatsingleNoneFalse39.52982None
SENSOR_YSensor dimension in y [mm]floatsingleNoneFalse41.11102None
cts2025-08-28T04:05:06.824Z
sys
cts2025-08-28T04:05:06.824Z
mts2025-08-28T04:05:06.824Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6810f23e54aadc8e96c6f24d92d9a2640a95fa48498949ba97edaa5eready2025-04-29T15:37:34.257Z23-6780-1FalseFalseNoneNoneFalseNoneNone20UPGB43200364None
parent
component
id689ce4f6e945399df1ed713b
codee7fc973881c738c84c94246a4286c796
stateready
stateTs2025-08-13T19:18:14.270Z
stateUserIdentity1294-8027-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM24210577
alternativeIdentifierANL_ITkPix_126
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INIT
nameInitial state to associate flex to bare module
highestLevelParent
component
id689ce4f6e945399df1ed713b
codee7fc973881c738c84c94246a4286c796
stateready
stateTs2025-08-13T19:18:14.270Z
stateUserIdentity1294-8027-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM24210577
alternativeIdentifierANL_ITkPix_126
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INIT
nameInitial state to associate flex to bare module
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v2
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseIZM
codevalue
0Advacam
1Leonardo
2IZM
3HPK (in-kind)
4HPK (CERN order)
5RAL (in-house)
6Glasgow (in-house)
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeIZM
nameFraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

 Current Stage: QC cross-check (module swapping)

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)		 Registered Registered
Flatness
(FLATNESS)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 Registered Registered
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)		 Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
68b096…fbdeb7 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV Simpson,Liana Rae N/A 4 months ago No tags Selected
68afdc…488b74 BAREMODULERECEPTION MASS_MEASUREMENT Simpson,Liana Rae N/A 4 months ago No tags Selected
68afd5…fda341 BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY Simpson,Liana Rae N/A 4 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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