20UPIM13602053

MODULE/PARYLENE_MASKING

View QC Summary

Component Information

Serial Number 20UPIM13602053
ProdDB ID  8ba02e…1db33c
LocalDB ID 67f66cae73b21e313576ff17
Component Type MODULE
Parents No match.
Children 20UPGB43000051 Bare Module 20UPGPQ3602053 PCB 20UPGFC0156298 FE Chip 20UPGFC0156299 FE Chip 20UPGFC0156301 FE Chip 20UPGFC0156300 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
PCB-Bare Orientation isNormal True
FE chip version 3
Wirebond protection roof presence False
Alternative ID None
Rank None

 Comments


Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)


Result of Wirebond Pull Test

Scan

Key Data
component id 67f66cae73b21e313576ff17
Stage MODULE/WIREBONDING
test Type WIREBOND_PULL_TEST
institute 64657cef8d79bac1f3f00581
user AnnaRaquel Petri

Result

Key Data
properties {'ANALYSIS_VERSION': 'in webApp', 'INSTRUMENT': 'Dage', 'MEASUREMENT_DATE': '2025-04-24T12:13Z', 'OPERATOR_IDENTITY': 'Riccardo Zanzottera'} g
BOND_PEEL 0 g
DATA_UNAVAILABLE False g
HEEL_BREAKS_ON_FE_CHIP 12 g
HEEL_BREAKS_ON_PCB 88 g
LIFT_OFFS_LESS_THAN_7G 0 g
PULL_STRENGTH 10.572000000000001 g
PULL_STRENGTH_DATA [[[11, 1, 1], [10.7, 1, 1], [10.7, 1, 1], [9.3, 1, 1], [10.6, 1, 1], [11.4, 1, 1], [10.6, 1, 1], [11, 1, 1], [11, 1, 1], [10.9, 1, 1], [10.6, 1, 1], [10.3, 1, 1], [10.9, 1, 1], [10.9, 1, 1], [10.8, 1, 1], [10.4, 2, 2], [10.3, 2, 2], [10.1, 1, 1], [10.3, 1, 1], [10.4, 1, 1], [9.4, 2, 2], [10.4, 1, 1], [10.8, 1, 1], [10.8, 1, 1], [10.7, 1, 1]]] g
PULL_STRENGTH_ERROR 0.46950328362359006 g
PULL_STRENGTH_MAX 11.4 g
PULL_STRENGTH_MIN 9.3 g
WIRE_BREAKS_5G 0 g
WIRE_PULLS 25 g

ProductionDB Record

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 Current Stage: Parylene Masking

Test Type Local Result
Visual Inspection
(VISUAL_INSPECTION)		 No TestRun!
Parylene (de-)masking
(DE_MASKING)		 No TestRun!

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
680a0f…9d9345 WIREBOND_PULL_TEST Pass AnnaRaquel Petri N/A 8 months ago in webApp No tags Selected

Past QC Stages and Results

Initial Cold (MODULE/INITIAL_COLD)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No result N/A
IV measurement
(IV_MEASURE)		 No result N/A

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 Registered Registered
IV measurement
(IV_MEASURE)		 Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered
Wirebond pull test
(WIREBOND_PULL_TEST)		 Registered Registered
Wirebonding Information
(WIREBONDING)		 No result N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)		 No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)		 Registered Registered
Mass Measurement
(MASS_MEASUREMENT)		 Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)		 Registered Registered
Triplet Module Metrology
(TRIPLET_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
67fe82…9c4540 MODULE/INITIAL_WARM IV_MEASURE AnnaRaquel Petri 8 months ago 8 months ago No tags Selected
67ff6b…9c4a0c MODULE/INITIAL_WARM E_SUMMARY AnnaRaquel Petri N/A 8 months ago No tags Selected
680a0f…9d9345 MODULE/WIREBONDING WIREBOND_PULL_TEST AnnaRaquel Petri N/A 8 months ago No tags Selected
680a08…77debe MODULE/ASSEMBLY QUAD_MODULE_METROLOGY AnnaRaquel Petri N/A 8 months ago No tags Selected
680a0a…9c5d27 MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH AnnaRaquel Petri 8 months ago 8 months ago No tags Selected
680a0b…9c5d2a MODULE/ASSEMBLY MASS_MEASUREMENT AnnaRaquel Petri 8 months ago 8 months ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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