20UPGPQ4220429

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number	20UPGPQ4220429
ProdDB ID	9afa99…f1ca16
LocalDB ID	67f4ba2e73b21e31356e38c7
Component Type	MODULE_PCB
Parents	20UPGM24220429
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	NCAB
PCB design version readonly	4
PCB vendor technology readonly	2
SMD population vendor	Garner Osborne Circuits
PCB BOM version	22

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	67f4ba2e73b21e31356e38c7
Stage	PCB_RECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	SnehaAmogh Naik
ObjectId of this record	681f02019f4d7e6ede8e036a
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
OPERATOR	Pratik
ANALYSIS_VERSION	mqat v1.0
OVERALL_GRADE	1
WIREBOND_PADS_CONTAMINATION_GRADE	1
PARTICULATE_CONTAMINATION_GRADE	1
WATERMARKS_GRADE	1
SCRATCHES_GRADE	1
TRACES_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	2
HV_LV_CONNECTOR_ASSEMBLY_GRADE	-999
DATA_CONNECTOR_ASSEMBLY_GRADE	-999
SOLDER_SPILLS_GRADE	-999
COMPONENT_MISALIGNMENT_GRADE	-999
SHORTS_OR_CLOSE_PROXIMITY_GRADE	-999
OPENS_TOMBSTONING_GRADE	-999
OBSERVATION	nan

ProductionDB Record

Expand ProductionDB Record

681f02019f4d7e6ede8e036a

state

ready

stateTs

2025-05-10T07:36:33.601Z

stateUserIdentity

7680-5063-1

date

2025-04-22T00:00:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	59d60ee4ed67730005160cd9
code	GL
name	Glasgow University

user

id	61ba17b23be1da000a981c71
userIdentity	7680-5063-1
firstName	Sneha
middleName
lastName	Amogh Naik

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
OPERATOR	Operator	string	single	False	Pratik	None	None
ANALYSIS_VERSION	Analysis version	string	single	False	1.0	None	None

results

code OVERALL_GRADE
name Overall grade (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value 1
associateChild None

code	WIREBOND_PADS_CONTAMINATION_GRADE
name	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	1
associateChild	None

code PARTICULATE_CONTAMINATION_GRADE
name Particulate contamination on the PCB including pick-up points (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value 1
associateChild None
code WATERMARKS_GRADE
name Watermarks on the PCB (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value 1
associateChild None

code	SCRATCHES_GRADE
name	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	1
associateChild	None

code	TRACES_GRADE
name	Issues seen on traces like spurious copper, spur, mousebit, pin hole, short, breakout etc. that reduce/cut the copper traces width (grade 1-3)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
rangeMin	None
rangeMax	None
value	1
associateChild	None

code SOLDERMASK_IRREGULARITIES_GRADE
name Soldermask irregularity/cracks grade (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None
code HV_LV_CONNECTOR_ASSEMBLY_GRADE
name HV LV connector assembly issue (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value -999
associateChild None
code DATA_CONNECTOR_ASSEMBLY_GRADE
name Data connector assembly issue (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value -999
associateChild None
code SOLDER_SPILLS_GRADE
name Solder spills as part of assembly process on wirebonding pads (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value -999
associateChild None
code COMPONENT_MISALIGNMENT_GRADE
name Component misalignment (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value -999
associateChild None
code SHORTS_OR_CLOSE_PROXIMITY_GRADE
name Shorts/close proximity of components due to misalignment (scale 1-3)
dataType integer
valueType single
arrayDimensions None
additional False
value -999
associateChild None

code	OPENS_TOMBSTONING_GRADE
name	Opens or tombstoning, where one end of the component lifts from a pad of the PCB during the soldering process, (scale 1-3)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
rangeMin	None
rangeMax	None
value	-999
associateChild	None

code OBSERVATION
name Observation
dataType string
valueType single
arrayDimensions None
additional False
value nan
associateChild None

cts

2025-05-10T07:36:33.601Z

sys

cts	2025-05-10T07:36:33.601Z
mts	2025-05-10T07:36:33.601Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67f4ba2e73b21e31356e38c7

9afa99a4126abdb8a2842a86e8f1ca16

ready

2025-04-08T05:54:54.602Z

7680-5063-1

False

None

False

None

20UPGPQ4220429

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value NCAB

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

NCAB (100 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Garner Osborne Circuits
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION
name	Reception
order	1
initial	False
final	False

code	GL
name	Glasgow University

Current Stage: Post-Parylene Warm

No tests are allocated for this stage.

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	No result	N/A
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	Registered	Registered
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
681f02…8e036a	PCB_RECEPTION	VISUAL_INSPECTION	SnehaAmogh Naik	N/A	a year ago	No tags	Selected
68010a…97c094	PCB_RECEPTION	DOWEL_TOLERANCE_CHECK	SnehaAmogh Naik	N/A	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4220429

MODULE/POST_PARYLENE_WARM

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Post-Parylene Warm

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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