20UPGB43200264

MODULE/PARYLENE_COATING

Component Information

Serial Number	20UPGB43200264
ProdDB ID	ce71e3…2eb934
LocalDB ID	67e41738f1be53f1ec4d33dd
Component Type	BARE_MODULE
Parents	20UPGM23211410
Children	20UPGFC0147514 FE Chip 20UPGFC0147643 FE Chip 20UPGFC0147828 FE Chip 20UPGFC0147810 FE Chip 20UPGS33305254 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	7 months ago
component ObjectId	67e41738f1be53f1ec4d33dd
Stage	BAREMODULERECEPTION
Test Type	QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	AlessiaZuev
ObjectId of this record	682738abd71df4c277b7f0ab
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
MEASUREMENT_DATE	None
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	None
BARE_MODULE_THICKNESS	383
BARE_MODULE_THICKNESS_STD_DEVIATION	15
FECHIPS_X	42.27
FECHIPS_Y	40.29
FECHIP_THICKNESS	196
FECHIP_THICKNESS_STD_DEVIATION	22
SENSOR_THICKNESS	N/A
SENSOR_THICKNESS_STD_DEVIATION	N/A
SENSOR_X	39.51
SENSOR_Y	41.1

ProductionDB Record

Expand ProductionDB Record

682738abd71df4c277b7f0ab

state

ready

stateTs

2025-05-16T13:07:55.440Z

stateUserIdentity

6253-1808-1

date

2025-05-16T13:05:00.000Z

testType

id	5f87e63950d75e000a335aac
code	QUAD_BARE_MODULE_METROLOGY
name	Quad Bare Module Metrology
state	active

institution

id	5ecf2e4593e5ee000a0e5b19
code	SIEGEN
name	Universitaet Siegen

user

id	66755442ead3ed0035eb02eb
userIdentity	6253-1808-1
firstName	Alessia
middleName
lastName	Zuev

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	None	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	None	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
BARE_MODULE_THICKNESS	Average bare module thickness [µm]	float	single	None	False	383	None
BARE_MODULE_THICKNESS_STD_DEVIATION	Std deviation of bare module thickness [µm]	float	single	None	False	15	None
FECHIPS_X	FE chips x dimension [mm]	float	single	1	False	42.27	None
FECHIPS_Y	FE chips y dimension [mm]	float	single	1	False	40.29	None
FECHIP_THICKNESS	Average FE chip thickness [µm]	float	single	None	False	196	None
FECHIP_THICKNESS_STD_DEVIATION	Std deviation of FE chip thickness [µm]	float	single	None	False	22	None
SENSOR_THICKNESS	Average sensor thickness (if total height out of specifications) [µm]	float	single	None	False	None	None
SENSOR_THICKNESS_STD_DEVIATION	Std deviation of sensor thickness (if total height out of specifications) [µm]	float	single	None	False	None	None
SENSOR_X	Sensor dimension in x [mm]	float	single	None	False	39.51	None
SENSOR_Y	Sensor dimension in y [mm]	float	single	None	False	41.1	None

cts

2025-05-16T13:07:55.440Z

sys

cts	2025-05-16T13:07:55.440Z
mts	2025-05-16T13:07:55.440Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

67e41738f1be53f1ec4d33dd

ce71e3a7639d8d70cb5dbcbc452eb934

ready

2025-03-26T15:03:20.487Z

23-6780-1

False

None

False

None

20UPGB43200264

None

parent

component

6824678b9f4d7e6edeb37146

code

7cdbe066845e4598fe7dbd98ecca1002

state

ready

stateTs

2025-05-14T09:51:07.481Z

stateUserIdentity

6253-1808-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM23211410

alternativeIdentifier

Si030

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly

highestLevelParent

component

6824678b9f4d7e6edeb37146

code

7cdbe066845e4598fe7dbd98ecca1002

state

ready

stateTs

2025-05-14T09:51:07.481Z

stateUserIdentity

6253-1808-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM23211410

alternativeIdentifier

Si030

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Parylene Coating

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
682738…b7f0ab	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	AlessiaZuev	N/A	7 months ago	No tags	Selected
6825bc…bbe48c	BAREMODULERECEPTION	FLATNESS	JasonMuller	N/A	7 months ago	No tags	Selected
681a13…c674a5	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	NoahSiegemund	N/A	7 months ago	No tags
680b92…82cb01	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	LinaReifenberg	N/A	8 months ago	No tags	Selected
67f3b4…0e0460	BAREMODULERECEPTION	MASS_MEASUREMENT	NoahSiegemund	N/A	8 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200264

MODULE/PARYLENE_COATING

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Parylene Coating

Past QC Stages and Results

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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