Database for ITk Pixel Module

Serial Number	20UPGM23210402
ProdDB ID	ead9d7…c56a75
LocalDB ID	67e40465cd90d23537770385
Component Type	MODULE
Parents	No match.
Children	20UPGB43200198 Bare Module 20UPGPQ2210402 PCB 20UPGFC0142195 FE Chip 20UPGFC0142149 FE Chip 20UPGFC0142153 FE Chip 20UPGFC0142103 FE Chip
Flags	• Core Column issue

Item	Value
PCB-Bare Orientation isNormal	True
FE chip version	3
Wirebond protection roof presence	False
Alternative ID	None
Is preproduction module	True
Rank	None

Key	Data
QC Passed	False
Date	9 months ago
component ObjectId	67e40465cd90d23537770385
Stage	MODULE/ASSEMBLY
Test Type	QUAD_MODULE_METROLOGY
Institute ObjectId
User Name	JedrzejBukowski
ObjectId of this record	67e52ff9cd90d235377ec885
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat vNone
MEASUREMENT_DATE	2025-03-27T11:01+0000
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	Andy Bukowski
AVERAGE_THICKNESS	[664, 654, 663, 673]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT	[2271, 691]
DISTANCE_PCB_BARE_MODULE_TOP_LEFT	[2203, 654]
HV_CAPACITOR_THICKNESS	2414
STD_DEVIATION_THICKNESS	N/A
THICKNESS_INCLUDING_POWER_CONNECTOR	1998
THICKNESS_VARIATION_PICKUP_AREA	7.72

Expand ProductionDB Record

67e52ff9cd90d235377ec885

state

ready

stateTs

2025-03-27T11:01:13.114Z

stateUserIdentity

7075-9969-1

date

2025-03-27T11:00:56.194Z

testType

id	627a356dba163f000ab63233
code	QUAD_MODULE_METROLOGY
name	Quad Module Metrology
state	active

institution

id	59f1f092df054600056d35b2
code	LIV
name	University of Liverpool

user

id	65ba4dcc2808ba00428b8189
userIdentity	7075-9969-1
firstName	Jedrzej
middleName
lastName	Bukowski

runNumber

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-03-27T11:01+0000	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	Andy Bukowski	None	None

results

code AVERAGE_THICKNESS
name Average module thickness at FE chip pick-up areas, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value
664
654
663
673
associateChild None

code	DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT
name	Distance of PCB fiducial to bare module fiducial bottom right (x and y) [µm]
order	1
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2271 691
associateChild	None

code	DISTANCE_PCB_BARE_MODULE_TOP_LEFT
name	Distance of PCB fiducial to bare module fiducial top left (x and y) [µm]
order	1
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2203 654
associateChild	None

code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 2414
associateChild None
code STD_DEVIATION_THICKNESS
name Std deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value None
associateChild None

code	THICKNESS_INCLUDING_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [µm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	1998
associateChild	None

code THICKNESS_VARIATION_PICKUP_AREA
name Thickness variation of the 4 pick-up areas [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 7.72
associateChild None

cts

2025-03-27T11:01:13.114Z

sys

cts	2025-03-27T11:01:13.114Z
mts	2025-03-27T11:01:13.114Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67e40465cd90d23537770385

ead9d7e067c7bd1b0451883983c56a75

ready

2025-03-26T13:43:01.332Z

7075-9969-1

False

None

False

None

20UPGM23210402

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code ALTERNATIVE_IDENTIFIER
name Alternative ID
dataType string
required False
default True
value None
code IS_PREPRODUCTION_MODULE
name Is preproduction module
dataType boolean
required False
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	LIV
name	University of Liverpool

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!
Visual Inspection (VISUAL_INSPECTION)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
67e564…9b3d5d	GLUE_MODULE_FLEX_ATTACH	Pass	JedrzejBukowski	N/A	9 months ago		No tags	Selected
67e52f…7ec885	QUAD_MODULE_METROLOGY	Fail	JedrzejBukowski	N/A	9 months ago	None	No tags	Selected
67e524…7eaea8	MASS_MEASUREMENT	Pass	JedrzejBukowski	N/A	9 months ago	None	No tags	Selected

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	Registered	Registered
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68b5d7…7de612	MODULE/POST_PARYLENE_WARM	IV_MEASURE	JonTaylor	3 months ago	3 months ago	No tags	Selected
68b6ba…7ded39	MODULE/POST_PARYLENE_WARM	E_SUMMARY	JonTaylor	N/A	3 months ago	No tags	Selected
68c2d9…b84661	MODULE/FINAL_COLD	VISUAL_INSPECTION	Md ArifAbdullaSamy	N/A	3 months ago	No tags
68c15e…b2b56e	MODULE/FINAL_COLD	IV_MEASURE	Md ArifAbdullaSamy	3 months ago	3 months ago	No tags	Selected
68c295…b2c188	MODULE/FINAL_COLD	E_SUMMARY	Md ArifAbdullaSamy	N/A	3 months ago	No tags	Selected
68c138…b2a1cc	MODULE/FINAL_WARM	IV_MEASURE	Md ArifAbdullaSamy	3 months ago	3 months ago	No tags	Selected
68c15d…b2b518	MODULE/FINAL_WARM	E_SUMMARY	Md ArifAbdullaSamy	N/A	3 months ago	No tags	Selected
68c134…b2a14f	MODULE/THERMAL_CYCLES	THERMAL_CYCLING	Md ArifAbdullaSamy	3 months ago	3 months ago	No tags	Selected
684c31…4e99d8	MODULE/PARYLENE_UNMASKING	DE_MASKING	JonTaylor	N/A	3 months ago	No tags	Selected
686282…3bf0e7	MODULE/WIREBONDING	WIREBONDING	JedrzejBukowski	N/A	6 months ago	No tags	Selected
684c31…8fdb81	MODULE/PARYLENE_COATING	PARYLENE	JedrzejBukowski	N/A	6 months ago	No tags	Selected
684aaa…028a40	MODULE/PARYLENE_MASKING	DE_MASKING	JedrzejBukowski	N/A	6 months ago	No tags	Selected
684aaa…0289c2	MODULE/WIREBONDING	VISUAL_INSPECTION	JedrzejBukowski	N/A	6 months ago	No tags	Selected
67e693…969086	MODULE/WIREBONDING	WIREBOND_PULL_TEST	JonTaylor	N/A	6 months ago	No tags	Selected
67e564…9b3d5d	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	JedrzejBukowski	N/A	9 months ago	No tags	Selected
67e52f…7ec885	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	JedrzejBukowski	N/A	9 months ago	No tags	Selected
67e524…7eaea8	MODULE/ASSEMBLY	MASS_MEASUREMENT	JedrzejBukowski	N/A	9 months ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM23210402

MODULE/POST_PARYLENE_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_MODULE_METROLOGY QC Failed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Post-Parylene Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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