Database for ITk Pixel Module

Serial Number	20UPGM23211220
ProdDB ID	95f36c…d7fb39
LocalDB ID	67d2e9285ae416616e55d163
Component Type	MODULE
Parents	No match.
Children	20UPGB43200156 Bare Module 20UPGFC0143033 FE Chip 20UPGPQ2211220 PCB 20UPGFC0142939 FE Chip 20UPGFC0142984 FE Chip 20UPGFC0142941 FE Chip
Flags

Item	Value
FE chip version	3
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	67d2e9285ae416616e55d163
Stage	MODULE/ASSEMBLY
Test Type	GLUE_MODULE_FLEX_ATTACH
Institute ObjectId
User Name	AnnaRaquel Petri
ObjectId of this record	67dd355d37f5f3101f0a3487
ObjectId of RAW record	67dd355c37f5f3101f0a3486
Tags	No tags

Key	Data
BATCH_NUMBER	0
CURE_TIME	20
GLUE_TYPE	Aradilte
LOCATION_ASSEMBLY
MEASUREMENT_DATE	2025-03-13T09:03:00.000+00:00
OPERATOR_IDENTITY	Anna Petri
RATIO	0.5
TOOL_ID	54
TOOL_TYPE	None
HUMIDITY	50
TEMP	20

Expand ProductionDB Record

67dd3588cd90d2353752272e

state

ready

stateTs

2025-03-21T09:46:48.913Z

stateUserIdentity

3182-7646-1

date

2025-03-21T09:46:00.000Z

testType

id	5d13188702c38f00090aaad9
code	GLUE_MODULE_FLEX_ATTACH
name	Glue Information Module+Flex Attach
state	active

institution

id	5d41d8ddf6e07b000a559aee
code	INFN_MILANO
name	INFN Milano

user

id	60e59f40049e18000a3aec94
userIdentity	3182-7646-1
firstName	Anna
middleName	Raquel
lastName	Petri

runNumber

67dd355d37f5f3101f0a3487

passed

True

problems

False

properties

code BATCH_NUMBER
name Glue Batch Number
dataType string
valueType single
required True
value 0
code CURE_TIME
name Cure time [h]
dataType float
valueType None
required False
value 20
rangeMin None
rangeMax None
code GLUE_TYPE
name Glue type
dataType string
valueType single
required True
value Aradilte
code LOCATION_ASSEMBLY
name Location of assembly
dataType string
valueType None
required False
value
rangeMin None
rangeMax None
code MEASUREMENT_DATE
name Date of assembly
dataType datetime
valueType None
required False
value 2025-03-13T09:03:00.000+00:00
rangeMin None
rangeMax None
code OPERATOR_IDENTITY
name Operator identity
dataType string
valueType single
required False
value Anna Petri
rangeMin None
rangeMax None
code RATIO
name Ratio of epoxy mixture
dataType float
valueType single
required False
value 0.5
code TOOL_ID
name Tool ID
dataType integer
valueType single
required False
value 54
rangeMin None
rangeMax None
code TOOL_TYPE
name Tool type
dataType codeTable
valueType single
required False
value None
codeTable
code value
1 Common
2 Japan
3 Oxford
4 triplet

results

code	name	order	dataType	valueType	additional	rangeMin	rangeMax	value	associateChild
HUMIDITY	Humidity (%)	1	float	single	False	None	None	50	None
TEMP	Room Temperature (C)	1	float	single	False	None	None	20	None

cts

2025-03-21T09:46:48.913Z

sys

cts	2025-03-21T09:46:48.913Z
mts	2025-03-21T09:46:49.263Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

593d03a6720068cda4f356bca46dc9f2

2025-03-21T09:46:49.046Z

RAW

application/json

file

True

20UPGM23211220_MODULE__ASSEMBLY_GLUE_MODULE_FLEX_ATTACH_67dd3588cd90d2353752272e_67dd355c37f5f3101f0a3486.json

id	60e59f40049e18000a3aec94
userIdentity	3182-7646-1
firstName	Anna
middleName	Raquel
lastName	Petri

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67d2e9285ae416616e55d163

95f36c68a258daff8aa04437c5d7fb39

ready

2025-03-13T14:18:16.909Z

3182-7646-1

False

None

False

None

20UPGM23211220

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v2
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	INFN_MILANO
name	INFN Milano

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
67dd35…0a3487	GLUE_MODULE_FLEX_ATTACH	Pass	AnnaRaquel Petri	a year ago	a year ago		No tags	Selected
67dd35…0a346a	MASS_MEASUREMENT	Pass	AnnaRaquel Petri	a year ago	a year ago	2.4.0	No tags	Selected

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A
Wirebonding Information (WIREBONDING)	No result	N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	No result	N/A
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
67dd7f…0a3614	MODULE/INITIAL_WARM	IV_MEASURE	AnnaRaquel Petri	a year ago	a year ago	No tags	Selected
67dd7f…0a3616	MODULE/INITIAL_WARM	E_SUMMARY	AnnaRaquel Petri	N/A	a year ago	No tags	Selected
67dd35…0a3487	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	AnnaRaquel Petri	a year ago	a year ago	No tags	Selected
67dd35…0a346a	MODULE/ASSEMBLY	MASS_MEASUREMENT	AnnaRaquel Petri	a year ago	a year ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM23211220

MODULE/INITIAL_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: GLUE_MODULE_FLEX_ATTACH QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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