20UPGM23211220

MODULE/INITIAL_COLD

Component Information

Serial Number 20UPGM23211220
ProdDB ID  95f36c…d7fb39
LocalDB ID 67d2e9285ae416616e55d163
Component Type MODULE
Parents No match.
Children 20UPGB43200156 Bare Module 20UPGFC0143033 FE Chip 20UPGPQ2211220 PCB 20UPGFC0142939 FE Chip 20UPGFC0142984 FE Chip 20UPGFC0142941 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal True
Wirebond protection roof presence None
Alternative ID None
Rank None

 Comments


Test: MASS_MEASUREMENT QC Passed

(Stage: MODULE/ASSEMBLY)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 9 months ago
component ObjectId 67d2e9285ae416616e55d163
Stage MODULE/ASSEMBLY
Test Type MASS_MEASUREMENT
Institute ObjectId
User Name AnnaRaquel Petri
ObjectId of this record 67dd352f37f5f3101f0a346a
ObjectId of RAW record 67dd352f37f5f3101f0a3469
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat v2.4.0
MEASUREMENT_DATE 2025-03-13T09:03:00.000+00:00
OPERATOR_IDENTITY
SCALE_ACCURACY 1
MASS 3257

RAW Results Record

Download RAW
_id67dd352f37f5f3101f0a3469
raw
serialNumbertestTyperesultsstagecomponentdbVersionaddressusersys
20UPGM23211220MASS_MEASUREMENT
property
SCALE_ACCURACY1.0
ANALYSIS_VERSIONNone
MEASUREMENT_DATENone
OPERATOR_IDENTITY
comment
Measurements
MASS3257.0
Metadata
LocalDB version2.2.39
InstitutionINFN_MILANO
ModuleSN20UPGM23211220
TimeStart1741856580
TimeEnd1741856580
MODULE/ASSEMBLY67d2e9285ae416616e55d1631.0164657cef8d79bac1f3f00581admin
mts2025-03-21 09:45:19.150000
cts2025-03-21 09:45:19.150000
rev0
rawHashcb868c552190096943ff29fcf28d44b1
stageMODULE/ASSEMBLY

ProductionDB Record

id67dd358838d08a4ce766e539
stateready
stateTs2025-03-21T09:46:48.234Z
stateUserIdentity3182-7646-1
date2025-03-21T09:45:00.000Z
testType
id63fb5fdb6b1f270036833ce0
codeMASS_MEASUREMENT
nameMass Measurement
stateactive
institution
id5d41d8ddf6e07b000a559aee
codeINFN_MILANO
nameINFN Milano
user
id60e59f40049e18000a3aec94
userIdentity3182-7646-1
firstNameAnna
middleNameRaquel
lastNamePetri
runNumber67dd352f37f5f3101f0a346a
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse2.4.0NoneNone
MEASUREMENT_DATEDate measurement performeddatetimeNoneFalse2025-03-13T09:03:00.000+00:00NoneNone
OPERATOR_IDENTITYOperator identitystringsingleFalseNoneNone
SCALE_ACCURACYScale Accuracy [mg]floatsingleFalse1NoneNone
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
MASSMass [mg]floatsingleNoneFalse3257None
cts2025-03-21T09:46:48.235Z
sys
cts2025-03-21T09:46:48.235Z
mts2025-03-21T09:46:48.453Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypebinaryStoreg02filenameuser
a4aa485966b5d9e0dd8b0444b454cde32025-03-21T09:46:48.352ZRAWRAWapplication/jsonfileTrue20UPGM23211220_MODULE__ASSEMBLY_MASS_MEASUREMENT_67dd358838d08a4ce766e539_67dd352f37f5f3101f0a3469.json
id60e59f40049e18000a3aec94
userIdentity3182-7646-1
firstNameAnna
middleNameRaquel
lastNamePetri
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
67d2e9285ae416616e55d16395f36c68a258daff8aa04437c5d7fb39ready2025-03-13T14:18:16.909Z3182-7646-1FalseFalseNoneNoneFalseNoneNone20UPGM23211220None
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v2
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueTrue
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
order1
initialFalse
finalFalse
codeINFN_MILANO
nameINFN Milano

 Current Stage: Initial Cold

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun!
IV measurement
(IV_MEASURE)
No TestRun!

 Candidate TestRuns of this Stage

LDB ID TestRun Code QC Passed Inspector Measurement Date Analysis Date Analysis Version Tags QC Registration
67dd35…0a3487 GLUE_MODULE_FLEX_ATTACH Pass AnnaRaquel Petri 9 months ago 9 months ago No tags Selected
67dd35…0a346a MASS_MEASUREMENT Pass AnnaRaquel Petri 9 months ago 9 months ago 2.4.0 No tags Selected

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

Initial Warm (MODULE/INITIAL_WARM)

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)
No result N/A
Wirebonding Information
(WIREBONDING)
No result N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Registered
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
No result N/A
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
No result N/A

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
67dd7f…0a3614 MODULE/INITIAL_WARM IV_MEASURE AnnaRaquel Petri 9 months ago 9 months ago No tags Selected
67dd7f…0a3616 MODULE/INITIAL_WARM E_SUMMARY AnnaRaquel Petri N/A 9 months ago No tags Selected
67dd35…0a3487 MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH AnnaRaquel Petri 9 months ago 9 months ago No tags Selected
67dd35…0a346a MODULE/ASSEMBLY MASS_MEASUREMENT AnnaRaquel Petri 9 months ago 9 months ago No tags Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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