20UPGB43200208

MODULE/THERMAL_CYCLES

Component Information

Serial Number	20UPGB43200208
ProdDB ID	aac06a…256d26
LocalDB ID	67c71489ccae83c989e5dac3
Component Type	BARE_MODULE
Parents	20UPGM23211331
Children	20UPGFC0141634 FE Chip 20UPGFC0141635 FE Chip 20UPGFC0141732 FE Chip 20UPGFC0141620 FE Chip 20UPGS33303760 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: MASS_MEASUREMENT QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	6 months ago
component ObjectId	67c71489ccae83c989e5dac3
Stage	BAREMODULERECEPTION
Test Type	MASS_MEASUREMENT
Institute ObjectId
User Name	Simpson,Liana Rae
ObjectId of this record	683622eced9943e316bbb12d
ObjectId of RAW record	683622ebed9943e316bbb12c
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.4.1
MEASUREMENT_DATE	2025-05-07T20:05:00.000+00:00
OPERATOR_IDENTITY	Tim Cundiff
SCALE_ACCURACY	0.003
MASS	1338

RAW Results Record

Download RAW

_id

683622ebed9943e316bbb12c

raw

serialNumber

testType

results

stage

component

dbVersion

address

user

sys

20UPGB43200208

MASS_MEASUREMENT

property

SCALE_ACCURACY	0.003
ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
OPERATOR_IDENTITY	Tim Cundiff

comment

Measurements

MASS	1338.0

Metadata

LocalDB version	2.3.5
Institution	ANL
ModuleSN	20UPGB43200208
TimeStart	1746648300
TimeEnd	1746648300

BAREMODULERECEPTION

67c71489ccae83c989e5dac3

1.01

64657cef8d79bac1f3f00578

admin

mts	2025-05-27 20:39:07.778000
cts	2025-05-27 20:39:07.778000
rev	0

rawHash

4af8d39774de2deb9e7617046ce99e0e

stage

BAREMODULERECEPTION

ProductionDB Record

Expand ProductionDB Record

685dc69f9b78e594d7b435d0

state

ready

stateTs

2025-06-26T22:15:59.296Z

stateUserIdentity

1294-8027-1

date

2025-05-27T20:39:00.000Z

testType

id	5f87daff50d75e000a335805
code	MASS_MEASUREMENT
name	Mass Measurement
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

683622eced9943e316bbb12d

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.4.1	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-05-07T20:05:00.000+00:00	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	Tim Cundiff	None	None
SCALE_ACCURACY	Scale Accuracy [mg]	float	single	False	0.003	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
MASS	Mass [mg]	float	single	None	False	1338	None

cts

2025-06-26T22:15:59.296Z

sys

cts	2025-06-26T22:15:59.296Z
mts	2025-06-26T22:15:59.740Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

852334b2df2e000bc7e68df625f24fa1

2025-06-26T22:15:59.501Z

RAW

application/json

file

True

data

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67c71489ccae83c989e5dac3

aac06a50c3bcdc4804f1cbd1ca256d26

ready

2025-03-04T14:56:09.692Z

23-6780-1

False

None

False

None

20UPGB43200208

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Thermal Cycles

No tests are allocated for this stage.

Past QC Stages and Results

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
686362…4f2d46	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	Simpson,Liana Rae	N/A	5 months ago	No tags	Selected
686361…ad5a00	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	Simpson,Liana Rae	N/A	5 months ago	No tags	Selected
683622…bbb12d	BAREMODULERECEPTION	MASS_MEASUREMENT	Simpson,Liana Rae	7 months ago	6 months ago	No tags	Selected
68361d…bbaec5	BAREMODULERECEPTION	VISUAL_INSPECTION	Simpson,Liana Rae	7 months ago	6 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200208

MODULE/THERMAL_CYCLES

Component Information

Distribution of chips on wafer

Properties

Comments

Test: MASS_MEASUREMENT QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Thermal Cycles

Past QC Stages and Results

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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