20UPGB43200206

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number	20UPGB43200206
ProdDB ID	41c6a6…531c0b
LocalDB ID	67c714895cfcdd14475557f2
Component Type	BARE_MODULE
Parents	20UPGM24211289
Children	20UPGFC0142490 FE Chip 20UPGFC0142507 FE Chip 20UPGFC0142478 FE Chip 20UPGFC0142508 FE Chip 20UPGS33303778 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	6 months ago
component ObjectId	67c714895cfcdd14475557f2
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	Simpson,Liana Rae
ObjectId of this record	68361fd8ed9943e316bbb082
ObjectId of RAW record	68361fd7ed9943e316bbb081
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.4.1
MEASUREMENT_DATE	2025-05-27T20:22:52.000+00:00
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	1
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	1
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
front_tile21 Download front_tile21		Chipped_corner_in_FE

RAW Results Record

Download RAW

serialNumber

20UPGB43200206

testType

VISUAL_INSPECTION

subtestType

results

property

ANALYSIS_VERSION	None
MEASUREMENT_DATE	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	0.1.1.dev5

comment

Metadata

QCHELPER_VERSION

0.1.1.dev5

ModuleSN

20UPGB43200206

TimeStart

1748377372

front_defects

21	Yellow.Chipped_corner_in_FE

front_comments

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front_image

68361f6b776a7fba4c104b29

front_defect_images

21	693b18c031b71a9bc19a9234

back_defects

back_comments

0
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back_image

68361fc1776a7fba4c104b77

back_defect_images

Measurements

DEFECTS

None

SMD_COMPONENTS_PASSED_QC

None

SENSOR_CONDITION_PASSED_QC

None

FE_CHIP_CONDITION_PASSED_QC

None

GLUE_DISTRIBUTION_PASSED_QC

None

WIREBONDING_PASSED_QC

None

PARYLENE_COATING_PASSED_QC

None

OBWBP_ASSEMBLY_PASSED_QC

None

STRAIN_RELIEF_PASSED_QC

None

stage

BAREMODULERECEPTION

component

67c714895cfcdd14475557f2

dbVersion

1.01

address

64657cef8d79bac1f3f00578

sys

mts	2025-05-27 20:25:59.730000
cts	2025-05-27 20:25:59.730000
rev	0

ProductionDB Record

Expand ProductionDB Record

685dca0dc2981c36841c4b21

state

ready

stateTs

2025-06-26T22:30:37.241Z

stateUserIdentity

1294-8027-1

date

2025-05-27T20:25:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

68361fd8ed9943e316bbb082

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.4.1	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-05-27T20:22:52.000+00:00	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None

cts

2025-06-26T22:30:37.241Z

sys

cts	2025-06-26T22:30:37.241Z
mts	2025-06-26T22:32:27.207Z
rev	7

defects

code	name	description	properties
c06503a0c4287312e218efd6	front_tile21	Yellow.Chipped_corner_in_FE

comments

None

attachments

code

001444d10daa1cef89a785c542d96db9

dateTime

2025-06-26T22:30:37.467Z

title

RAW

description

RAW

contentType

application/json

type

file

binaryStoreg02

True

filename

data

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

code

aeed87d17a21bef98c4e83806bdd9d2b

dateTime

2025-06-26T22:30:38.040Z

title

front_image

description

Visual Inspection Image

contentType

None

type

eos

url

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urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/a/e/e/aeed87d17a21bef98c4e83806bdd9d2b

filename

aeed87d17a21bef98c4e83806bdd9d2b

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

code

add9975db94acfe03a7bf3f89ab08dd0

dateTime

2025-06-26T22:31:05.507Z

title

back_image

description

Visual Inspection Image

contentType

None

type

eos

url

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urlCernbox

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filename

add9975db94acfe03a7bf3f89ab08dd0

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

code

2af0dc61b5db49ff1631ad68c17fa8c4

dateTime

2025-06-26T22:32:13.188Z

title

front_tile21

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/2/a/f/2af0dc61b5db49ff1631ad68c17fa8c4?authz=zteos64:MDAwMDAyZjZ4nO1RsUoDQRAlgVgEBLW0WjWFzeV2Nnd7l7GxsBAbQdKFK_Zud5Mjye1x2Vik0E7wA6zSCf6CjQi2FhL8AhtLsdFW9BQLC2srh8cwPGYeb3j1x2q9UiydXT7dLqzWUjvI5Xp1mm9WWMdVZuwKOxTfPVFF1ivMJJfpeOBKZZ1y3c0LIx0Zu8wVrnaZ0FQmHGJfxl5ba-AtEJKHCQRahIm316DM4ypgiSN5wh0ATZ2Ye9QRXqwpBG0esPbBvNLt9CdkRyUEgDCKEJQoB-ZHZJJKBA94CN0vvxHpfTItGnSneURsKlVmsTDGNoFB6FFkAWXbXURdFvrQBODNdtgEGpFMjBR-yRCZISm_sTgoYp-IPEfSN2OLvx9KMxJphj-YnjJIxhNpkBJbiEQhMVms-mKocYXcdxavL0427o92X_zDteerxvHpsnndOn-bAb6_7d-s_gfxF0GQ-ezhrvYBgE3s9w%3d%3d

urlCernbox

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filename

2af0dc61b5db49ff1631ad68c17fa8c4

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67c714895cfcdd14475557f2

41c6a658a239cd33320b19c046531c0b

ready

2025-03-04T14:56:09.501Z

23-6780-1

False

None

False

None

20UPGB43200206

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Post-Parylene Warm

No tests are allocated for this stage.

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	No result	N/A
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
686362…ad70ab	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	Simpson,Liana Rae	N/A	5 months ago	No tags	Selected
686362…4f2831	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	Simpson,Liana Rae	N/A	5 months ago	No tags
683622…bbb127	BAREMODULERECEPTION	MASS_MEASUREMENT	Simpson,Liana Rae	7 months ago	6 months ago	No tags	Selected
68361f…bbb082	BAREMODULERECEPTION	VISUAL_INSPECTION	Simpson,Liana Rae	7 months ago	6 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200206

MODULE/POST_PARYLENE_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Post-Parylene Warm

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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