20UPGB43200202

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number	20UPGB43200202
ProdDB ID	a2ffd6…ab2158
LocalDB ID	67c714895cfcdd14475557ea
Component Type	BARE_MODULE
Parents	20UPGM23211141
Children	20UPGFC0142426 FE Chip 20UPGFC0142553 FE Chip 20UPGFC0142445 FE Chip 20UPGFC0142412 FE Chip 20UPGS33303770 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: BARE_MODULE_SENSOR_IV QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	6 months ago
component ObjectId	67c714895cfcdd14475557ea
Stage	BAREMODULERECEPTION
Test Type	BARE_MODULE_SENSOR_IV
Institute ObjectId
User Name	Simpson,Liana Rae
ObjectId of this record	684894449f4d7e6edebbdf01
ObjectId of RAW record	None

Results

Key	Data
MEASUREMENT_DATE	2025-06-03T10:05Z
LINK_TO_SENSOR_IV_TEST	N/A

ProductionDB Record

Expand ProductionDB Record

684894449f4d7e6edebbdf01

state

ready

stateTs

2025-06-10T20:23:32.891Z

stateUserIdentity

1294-8027-1

date

2025-06-10T20:23:00.000Z

testType

id	63a087f8641a3f0036a0e8a7
code	BARE_MODULE_SENSOR_IV
name	Sensor IV on bare module
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

...

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2025-06-03T10:05Z	None	None

results

code

name

dataType

valueType

arrayDimensions

additional

rangeMin

rangeMax

value

associateChild

LINK_TO_SENSOR_IV_TEST

Link to sensor IV test result

testRun

single

None

False

None

684894419f4d7e6edebbdebe

testType

id	5b1a3abf130f5600054a42a8
code	IV_MEASURE
name	IV measurement

runNumber

...

passed

True

state

ready

problems

False

date

2025-06-10T20:23:00.000Z

None

cts

2025-06-10T20:23:32.891Z

sys

cts	2025-06-10T20:23:32.891Z
mts	2025-06-10T20:23:32.891Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67c714895cfcdd14475557ea

a2ffd6178576cde8865e0a3928ab2158

ready

2025-03-04T14:56:09.200Z

23-6780-1

False

None

False

None

20UPGB43200202

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Post-Parylene Warm

No tests are allocated for this stage.

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68635a…acbe0f	BAREMODULERECEPTION	MASS_MEASUREMENT	Simpson,Liana Rae	N/A	5 months ago	No tags	Selected
684894…bbdf01	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	Simpson,Liana Rae	N/A	6 months ago	No tags	Selected
683623…2db4dc	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	DoyeongKim	N/A	7 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200202

MODULE/POST_PARYLENE_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: BARE_MODULE_SENSOR_IV QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Post-Parylene Warm

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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