20UPGB43200202

MODULE/POST_PARYLENE_WARM

Component Information

Serial Number 20UPGB43200202
ProdDB ID  a2ffd6…ab2158
LocalDB ID 67c714895cfcdd14475557ea
Component Type BARE_MODULE
Parents 20UPGM23211141
Children 20UPGFC0142426 FE Chip 20UPGFC0142553 FE Chip 20UPGFC0142445 FE Chip 20UPGFC0142412 FE Chip 20UPGS33303770 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 3
Sensor Type 5
Vendor code readonly 2
Thickness of FE chips (RD53A) None

 Comments


Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 7 months ago
component ObjectId 67c714895cfcdd14475557ea
Stage BAREMODULERECEPTION
Test Type QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name DoyeongKim
ObjectId of this record 6836239b9f4d7e6ede2db4dc
ObjectId of RAW record None
Tags No tags

Results

Key Data
BARE_MODULE_THICKNESS 344.9
BARE_MODULE_THICKNESS_STD_DEVIATION 2.6
FECHIPS_X 42.25395
FECHIPS_Y 40.30509
FECHIP_THICKNESS 171
FECHIP_THICKNESS_STD_DEVIATION 4
SENSOR_X 39.53708
SENSOR_Y 41.11204

ProductionDB Record

id6836239b9f4d7e6ede2db4dc
stateready
stateTs2025-05-27T20:42:03.271Z
stateUserIdentity5718-8332-1
date2025-05-22T14:24:58.000Z
testType
id5f87e63950d75e000a335aac
codeQUAD_BARE_MODULE_METROLOGY
name Quad Bare Module Metrology
stateactive
institution
id5d318624df98f200097386d5
codeANL
nameArgonne National Laboratory
user
id63628636d213a00028c42a81
userIdentity5718-8332-1
firstNameDoyeong
middleName
lastNameKim
runNumber1
passedTrue
problemsFalse
properties
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
BARE_MODULE_THICKNESSAverage bare module thickness [µm]floatsingleNoneFalse344.9None
BARE_MODULE_THICKNESS_STD_DEVIATIONStd deviation of bare module thickness [µm]floatsingleNoneFalse2.6None
FECHIPS_XFE chips x dimension [mm]floatsingle1False42.25395None
FECHIPS_YFE chips y dimension [mm]floatsingle1False40.30509None
FECHIP_THICKNESSAverage FE chip thickness [µm]floatsingleNoneFalse171None
FECHIP_THICKNESS_STD_DEVIATIONStd deviation of FE chip thickness [µm]floatsingleNoneFalse4None
SENSOR_XSensor dimension in x [mm]floatsingleNoneFalse39.53708None
SENSOR_YSensor dimension in y [mm]floatsingleNoneFalse41.11204None
cts2025-05-27T20:42:03.271Z
sys
cts2025-05-27T20:42:03.271Z
mts2025-05-27T20:42:03.271Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
67c714895cfcdd14475557eaa2ffd6178576cde8865e0a3928ab2158ready2025-03-04T14:56:09.200Z23-6780-1FalseFalseNoneNoneFalseNoneNone20UPGB43200202None
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v2
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseIZM
codevalue
0Advacam
1Leonardo
2IZM
3HPK (in-kind)
4HPK (CERN order)
5RAL (in-house)
6Glasgow (in-house)
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeIZM
nameFraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

 Current Stage: Post-Parylene Warm

Past QC Stages and Results

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)
Registered Registered
Flatness
(FLATNESS)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)
Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
68635a…acbe0f BAREMODULERECEPTION MASS_MEASUREMENT Simpson,Liana Rae N/A 5 months ago No tags Selected
684894…bbdf01 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV Simpson,Liana Rae N/A 6 months ago No tags Selected
683623…2db4dc BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY DoyeongKim N/A 7 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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