20UPGB43200170

MODULE/FINAL_METROLOGY

Component Information

Serial Number	20UPGB43200170
ProdDB ID	552a4b…329a8f
LocalDB ID	67c714855cfcdd14475557ce
Component Type	BARE_MODULE
Parents	20UPGM23210791
Children	20UPGFC0142123 FE Chip 20UPGFC0142156 FE Chip 20UPGFC0142120 FE Chip 20UPGFC0142214 FE Chip 20UPGS33304995 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	7 months ago
component ObjectId	67c714855cfcdd14475557ce
Stage	BAREMODULERECEPTION
Test Type	QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	DoyeongKim
ObjectId of this record	683774acd176bd7f634dbb1f
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
BARE_MODULE_THICKNESS	344.4
BARE_MODULE_THICKNESS_STD_DEVIATION	4
FECHIPS_X	42.24663
FECHIPS_Y	40.2747
FECHIP_THICKNESS	173
FECHIP_THICKNESS_STD_DEVIATION	6
SENSOR_X	39.52772
SENSOR_Y	41.11341

ProductionDB Record

Expand ProductionDB Record

683774acd176bd7f634dbb1f

state

ready

stateTs

2025-05-28T20:40:12.309Z

stateUserIdentity

5718-8332-1

date

2025-05-23T11:18:02.000Z

testType

id	5f87e63950d75e000a335aac
code	QUAD_BARE_MODULE_METROLOGY
name	Quad Bare Module Metrology
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	63628636d213a00028c42a81
userIdentity	5718-8332-1
firstName	Doyeong
middleName
lastName	Kim

runNumber

passed

True

problems

False

properties

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
BARE_MODULE_THICKNESS	Average bare module thickness [µm]	float	single	None	False	344.4	None
BARE_MODULE_THICKNESS_STD_DEVIATION	Std deviation of bare module thickness [µm]	float	single	None	False	4	None
FECHIPS_X	FE chips x dimension [mm]	float	single	1	False	42.24663	None
FECHIPS_Y	FE chips y dimension [mm]	float	single	1	False	40.2747	None
FECHIP_THICKNESS	Average FE chip thickness [µm]	float	single	None	False	173	None
FECHIP_THICKNESS_STD_DEVIATION	Std deviation of FE chip thickness [µm]	float	single	None	False	6	None
SENSOR_X	Sensor dimension in x [mm]	float	single	None	False	39.52772	None
SENSOR_Y	Sensor dimension in y [mm]	float	single	None	False	41.11341	None

cts

2025-05-28T20:40:12.309Z

sys

cts	2025-05-28T20:40:12.309Z
mts	2025-05-28T20:40:12.309Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

67c714855cfcdd14475557ce

552a4b7c8aa38e7ae25270f4b9329a8f

ready

2025-03-04T14:56:05.560Z

23-6780-1

False

None

False

None

20UPGB43200170

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Final flatness measurement

No tests are allocated for this stage.

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
686351…aba31b	BAREMODULERECEPTION	MASS_MEASUREMENT	Simpson,Liana Rae	N/A	5 months ago	No tags	Selected
68488d…ad15e6	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	Simpson,Liana Rae	N/A	6 months ago	No tags	Selected
683774…4dbb1f	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	DoyeongKim	N/A	7 months ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200170

MODULE/FINAL_METROLOGY

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Final flatness measurement

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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