20UPGB43200152

MODULE/TAB_CUTTING

Component Information

Serial Number 20UPGB43200152
ProdDB ID  8f165e…404936
LocalDB ID 67a227eb3d425b3252e00828
Component Type BARE_MODULE
Parents 20UPGM23210890
Children 20UPGFC0142953 FE Chip 20UPGFC0143034 FE Chip 20UPGFC0142904 FE Chip 20UPGFC0142972 FE Chip 20UPGS33303738 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 3
Sensor Type 5
Vendor code readonly 2
Thickness of FE chips (RD53A) None

 Comments


Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 9 months ago
component ObjectId 67a227eb3d425b3252e00828
Stage BAREMODULERECEPTION
Test Type QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name AnnaRaquel Petri
ObjectId of this record 67d420645ae416616e5c50fe
ObjectId of RAW record None
Tags No tags

Results

Key Data
BARE_MODULE_THICKNESS 349.85422919248936
BARE_MODULE_THICKNESS_STD_DEVIATION 9.66348059015158
FECHIPS_X 42.198
FECHIPS_Y 40.275
FECHIP_THICKNESS 171.83102840362244
FECHIP_THICKNESS_STD_DEVIATION 16.016935013792025
SENSOR_THICKNESS -1
SENSOR_THICKNESS_STD_DEVIATION -1
SENSOR_X 39.515
SENSOR_Y 41.1055

ProductionDB Record

id67d420645ae416616e5c50fe
stateready
stateTs2025-03-14T12:26:12.070Z
stateUserIdentity3182-7646-1
date2025-02-28T09:56:00.000Z
testType
id5f87e63950d75e000a335aac
codeQUAD_BARE_MODULE_METROLOGY
name Quad Bare Module Metrology
stateactive
institution
id5d41d8ddf6e07b000a559aee
codeINFN_MILANO
nameINFN Milano
user
id60e59f40049e18000a3aec94
userIdentity3182-7646-1
firstNameAnna
middleNameRaquel
lastNamePetri
runNumber1
passedTrue
problemsFalse
properties
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
BARE_MODULE_THICKNESSAverage bare module thickness [µm]floatsingleNoneFalse349.85422919248936None
BARE_MODULE_THICKNESS_STD_DEVIATIONStd deviation of bare module thickness [µm]floatsingleNoneFalse9.66348059015158None
FECHIPS_XFE chips x dimension [mm]floatsingle1False42.198None
FECHIPS_YFE chips y dimension [mm]floatsingle1False40.275None
FECHIP_THICKNESSAverage FE chip thickness [µm]floatsingleNoneFalse171.83102840362244None
FECHIP_THICKNESS_STD_DEVIATIONStd deviation of FE chip thickness [µm]floatsingleNoneFalse16.016935013792025None
SENSOR_THICKNESSAverage sensor thickness (if total height out of specifications) [µm]floatsingleNoneFalse-1None
SENSOR_THICKNESS_STD_DEVIATIONStd deviation of sensor thickness (if total height out of specifications) [µm]floatsingleNoneFalse-1None
SENSOR_XSensor dimension in x [mm]floatsingleNoneFalse39.515None
SENSOR_YSensor dimension in y [mm]floatsingleNoneFalse41.1055None
cts2025-03-14T12:26:12.070Z
sys
cts2025-03-14T12:26:12.070Z
mts2025-03-14T12:26:12.070Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
67a227eb3d425b3252e008288f165e091a377e765004596b9c404936ready2025-02-04T14:44:59.542Z23-6780-1FalseFalseNoneNoneFalseNoneNone20UPGB43200152None
parent
component
id67d2e84e2717b3491d94934d
code8e61100a54e79bc44ff8773734a63050
stateready
stateTs2025-03-13T14:14:38.242Z
stateUserIdentity3182-7646-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM23210890
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INIT
nameInitial state to associate flex to bare module
highestLevelParent
component
id67d2e84e2717b3491d94934d
code8e61100a54e79bc44ff8773734a63050
stateready
stateTs2025-03-13T14:14:38.242Z
stateUserIdentity3182-7646-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM23210890
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/INIT
nameInitial state to associate flex to bare module
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeQUAD_BARE_MODULE
nameQuad bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v2
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseOuter pixel quad sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseIZM
codevalue
0Advacam
1Leonardo
2IZM
3HPK (in-kind)
4HPK (CERN order)
5RAL (in-house)
6Glasgow (in-house)
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeIZM
nameFraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

 Current Stage: Module PCB tab cutting

Past QC Stages and Results

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)
Registered Registered
Flatness
(FLATNESS)
No result N/A
Mass Measurement
(MASS_MEASUREMENT)
Registered Registered
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)
Registered Registered
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)
No result N/A
Visual Inspection
(VISUAL_INSPECTION)
Registered Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
67d420…5c50fe BAREMODULERECEPTION QUAD_BARE_MODULE_METROLOGY AnnaRaquel Petri N/A 9 months ago No tags Selected
67c9ce…2b75c2 BAREMODULERECEPTION MASS_MEASUREMENT AnnaRaquel Petri N/A 9 months ago No tags Selected
67c9cc…6a2b86 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV AnnaRaquel Petri N/A 9 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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