Top Page > Component List > 20UPGM23211195 > QC Result / MODULE/ASSEMBLY / QUAD_MODULE_METROLOGY

20UPGM23211195
Outer-Quad-Module/ITkPix_v2
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGM23211195
Production DB Component ID a6259edc0e5eebdac07d01c9c527105c
LocalDB Component ID 6790dadd66b4f7e05327e28b
Component Type module
Super-Component No match.
Sub-Components •  20UPGB43200085   Bare Module
•  20UPGFC0132978   FE Chip
•  20UPGPQ2211195   PCB
•  20UPGFC0133060   FE Chip
•  20UPGFC0132969   FE Chip
•  20UPGFC0133014   FE Chip
Flags

Properties

Item Data Type Value
FE chip version codeTable 3
PCB-Bare Orientation isNormal boolean True
Wirebond protection roof presence boolean None
Alternative ID string None
Rank codeTable None

Comments


Test: QUAD_MODULE_METROLOGY QC Passed

(Stage: MODULE/ASSEMBLY)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2025-01-22 06:00:55 PST(-0800)
component ObjectId 6790dadd66b4f7e05327e28b
Stage MODULE/ASSEMBLY
Test Type QUAD_MODULE_METROLOGY
Institute ObjectId
User Name MarioJose
ObjectId of this record 6790fa174d1c6006c3fd66ae
ObjectId of RAW record None

Results

Key Data
ANALYSIS_VERSION mqat vv005
AVERAGE_THICKNESS [680, 671, 673, 675]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT [2208, 763]
DISTANCE_PCB_BARE_MODULE_TOP_LEFT [2174, 751]
HV_CAPACITOR_THICKNESS 2309
STD_DEVIATION_THICKNESS [20, 17, 14, 20]
THICKNESS_INCLUDING_POWER_CONNECTOR 2078
THICKNESS_VARIATION_PICKUP_AREA 9

ProductionDB Record

{}

Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

LocalDB Object ID TestRun Code QC Passed Inspector Date Analysis Version QC Registration
6793742f4a8295ecfc10bbfa MASS_MEASUREMENT Passed MarioJose 2025-01-24 03:06:23 PST(-0800) None Selected
6790fa174d1c6006c3fd66ae QUAD_MODULE_METROLOGY Passed MarioJose 2025-01-22 06:00:55 PST(-0800) v005 Selected

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebonding Information
(WIREBONDING)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
6793742f4a8295ecfc10bbfa MODULE/ASSEMBLY MASS_MEASUREMENT MarioJose 2025-01-24 03:06:23 PST(-0800) Selected
6790fa174d1c6006c3fd66ae MODULE/ASSEMBLY QUAD_MODULE_METROLOGY MarioJose 2025-01-22 06:00:55 PST(-0800) Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
Back to top page of this component