20UPGB43200113

MODULE/QC_STATUS

Component Information

Serial Number	20UPGB43200113
ProdDB ID	8f822b…2c695b
LocalDB ID	6787cdf538efa70a43c85cac
Component Type	BARE_MODULE
Parents	20UPGM23211222
Children	20UPGFC0142659 FE Chip 20UPGFC0142740 FE Chip 20UPGFC0142730 FE Chip 20UPGFC0142742 FE Chip 20UPGS33303841 Sensor Tile
Flags	• BAD_OTHER

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	6787cdf538efa70a43c85cac
Stage	BAREMODULERECEPTION
Test Type	QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	ThomasNaquin
ObjectId of this record	6799e4ee243ca3afdd68c748
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
MEASUREMENT_DATE	None
MEASUREMENT_DURATION	None
OPERATOR_IDENTITY	None
BARE_MODULE_THICKNESS	361
BARE_MODULE_THICKNESS_STD_DEVIATION	3
FECHIPS_X	42.263
FECHIPS_Y	40.284
FECHIP_THICKNESS	188
FECHIP_THICKNESS_STD_DEVIATION	3
SENSOR_THICKNESS	N/A
SENSOR_THICKNESS_STD_DEVIATION	N/A
SENSOR_X	39.545
SENSOR_Y	41.105

ProductionDB Record

Expand ProductionDB Record

6799e4ee243ca3afdd68c748

state

ready

stateTs

2025-01-29T08:21:02.533Z

stateUserIdentity

8769-4020-1

date

2025-01-29T08:18:00.000Z

testType

id	5f87e63950d75e000a335aac
code	QUAD_BARE_MODULE_METROLOGY
name	Quad Bare Module Metrology
state	active

institution

id	5d372a3becb4750009835557
code	IJCLAB
name	Laboratoire de Physique des 2 Infinis Irène Joliot-Curie (IJCLab)

user

id	66e9329c0fc5b30042e7f088
userIdentity	8769-4020-1
firstName	Thomas
middleName
lastName	Naquin

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	None	None	None
MEASUREMENT_DURATION	Measurement duration	integer	None	False	None	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	None	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
BARE_MODULE_THICKNESS	Average bare module thickness [µm]	float	single	None	False	361	None
BARE_MODULE_THICKNESS_STD_DEVIATION	Std deviation of bare module thickness [µm]	float	single	None	False	3	None
FECHIPS_X	FE chips x dimension [mm]	float	single	1	False	42.263	None
FECHIPS_Y	FE chips y dimension [mm]	float	single	1	False	40.284	None
FECHIP_THICKNESS	Average FE chip thickness [µm]	float	single	None	False	188	None
FECHIP_THICKNESS_STD_DEVIATION	Std deviation of FE chip thickness [µm]	float	single	None	False	3	None
SENSOR_THICKNESS	Average sensor thickness (if total height out of specifications) [µm]	float	single	None	False	None	None
SENSOR_THICKNESS_STD_DEVIATION	Std deviation of sensor thickness (if total height out of specifications) [µm]	float	single	None	False	None	None
SENSOR_X	Sensor dimension in x [mm]	float	single	None	False	39.545	None
SENSOR_Y	Sensor dimension in y [mm]	float	single	None	False	41.105	None

cts

2025-01-29T08:21:02.533Z

sys

cts	2025-01-29T08:21:02.533Z
mts	2025-01-29T08:21:02.533Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6787cdf538efa70a43c85cac

8f822b727c2da06893b7c1ff5f2c695b

ready

2025-01-15T15:02:13.083Z

23-6780-1

False

None

False

None

20UPGB43200113

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Ranking of the module

No tests are allocated for this stage.

Past QC Stages and Results

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
67a0e8…65cfad	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	AbdoulayeNDIAYE	N/A	a year ago	No tags	Selected
6799e4…68c748	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	ThomasNaquin	N/A	a year ago	No tags	Selected
6799e4…b96a71	BAREMODULERECEPTION	VISUAL_INSPECTION	ThomasNaquin	N/A	a year ago	No tags	Selected
6799e4…73ae02	BAREMODULERECEPTION	MASS_MEASUREMENT	ThomasNaquin	N/A	a year ago	No tags	Selected
6799e4…73adae	BAREMODULERECEPTION	FLATNESS	ThomasNaquin	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200113

MODULE/QC_STATUS

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Ranking of the module

Past QC Stages and Results

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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