Top Page > Component List > 20UPGM23211199 > QC Result / MODULE/INITIAL_WARM / E_SUMMARY

20UPGM23211199
Outer-Quad-Module/ITkPix_v2
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGM23211199
Production DB Component ID 91d91d02967b4ea2a530b8b50690899b
LocalDB Component ID 677eab4f9840dd877b1a133a
Component Type module
Super-Component No match.
Sub-Components •  20UPGB43200080   Bare Module
•  20UPGPQ2211199   PCB
•  20UPGFC0133685   FE Chip
•  20UPGFC0133782   FE Chip
•  20UPGFC0133802   FE Chip
•  20UPGFC0133752   FE Chip
Flags

Properties

Item Data Type Value
FE chip version codeTable 3
PCB-Bare Orientation isNormal boolean True
Wirebond protection roof presence boolean None
Alternative ID string None
Rank codeTable None

Comments


Test: E_SUMMARY QC Failed

(Stage: MODULE/INITIAL_WARM)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed False
Date 2025-01-22 14:40:29 PST(-0800)
component ObjectId 677eab4f9840dd877b1a133a
Stage MODULE/INITIAL_WARM
Test Type E_SUMMARY
Institute ObjectId
User Name SimoneRavera
ObjectId of this record 67917258d6d45f614eece8f7
ObjectId of RAW record None

Results

Key Data
ANALYSIS_VERSION localdb-tools v2.2.37
MEASUREMENT_DATE None
MODULE_TEMPERATURE 20
QUAD-MODULE_ADC_CALIBRATION 1 2 3 4
QUAD-MODULE_ANALOG_READBACK 1 2 3 4
MODULE_BAD_PIXEL_NUMBER 3452
QUAD-MODULE_DATA_TRANSMISSION 1 2 3 4
MODULE_DISCONNECTED_PIXEL_NUMBER 5
MODULE_ELECTRICALLY_BAD_PIXEL_NUMBER 3447
MODULE_HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
QUAD-MODULE_INJECTION_CAPACITANCE 1 2 3 4
QUAD-MODULE_LP_MODE 1 2 3
4
QUAD-MODULE_MIN_HEALTH_TEST 1 2 3 4
QUAD-MODULE_OVERVOLTAGE_PROTECTION
1
2
3
4
QUAD-MODULE_PIXEL_FAILURE_ANALYSIS 1 2 3 4
QUAD-MODULE_SLDO 1 2 3 4
QUAD-MODULE_TUNING 1 2 3 4
QUAD-MODULE_UNDERSHUNT_PROTECTION
1
2
3
4
QUAD-MODULE_VCAL_CALIBRATION 1 2 3 4

Key Data
BAD_PIXEL_NUMBER 107
DISCONNECTED_PIXEL_NUMBER 2
ELECTRICALLY_BAD_PIXEL_NUMBER 105
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
Key Data
BAD_PIXEL_NUMBER 103
DISCONNECTED_PIXEL_NUMBER 2
ELECTRICALLY_BAD_PIXEL_NUMBER 101
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
Key Data
BAD_PIXEL_NUMBER 70
DISCONNECTED_PIXEL_NUMBER 0
ELECTRICALLY_BAD_PIXEL_NUMBER 70
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A
Key Data
BAD_PIXEL_NUMBER 3172
DISCONNECTED_PIXEL_NUMBER 1
ELECTRICALLY_BAD_PIXEL_NUMBER 3171
HIGHEST_NUMBER_BAD_PIXELS_CLUSTER N/A

ProductionDB Record

{}

Current Stage: Initial Cold

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

LocalDB Object ID TestRun Code QC Passed Inspector Date Analysis Version QC Registration
679142d8d6d45f614eece466 IV_MEASURE Passed SimoneRavera 2025-01-22 14:40:32 PST(-0800) 2.3.0 Selected
67917258d6d45f614eece8f7 E_SUMMARY Failed SimoneRavera 2025-01-22 14:40:29 PST(-0800) 2.2.37 Selected

Past QC Stages and Results

  Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Alternative

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
IV measurement
(IV_MEASURE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Test Local Result ProdDB Record
Electrical Test (e-test) Module Summary
(E_SUMMARY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
IV measurement
(IV_MEASURE)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebonding Information
(WIREBONDING)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
679142d8d6d45f614eece466 MODULE/INITIAL_WARM IV_MEASURE SimoneRavera 2025-01-22 14:40:32 PST(-0800) Selected
67917258d6d45f614eece8f7 MODULE/INITIAL_WARM E_SUMMARY SimoneRavera 2025-01-22 14:40:29 PST(-0800) Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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