20UPGB43200031

MODULE/TAB_CUTTING

Component Information

Serial Number	20UPGB43200031
ProdDB ID	ba460f…60836c
LocalDB ID	6720fc48cdff110042194ad1
Component Type	BARE_MODULE
Parents	20UPGM23211208
Children	20UPGFC0133432 FE Chip 20UPGFC0133417 FE Chip 20UPGFC0133515 FE Chip 20UPGFC0133466 FE Chip 20UPGS33303586 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	3
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	a year ago
component ObjectId	6720fc48cdff110042194ad1
Stage	BAREMODULERECEPTION
Test Type	QUAD_BARE_MODULE_METROLOGY
Institute ObjectId
User Name	PietroRivetti
ObjectId of this record	6745bfe72a57a2573b6ec372
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
BARE_MODULE_THICKNESS	356.6072291232529
BARE_MODULE_THICKNESS_STD_DEVIATION	3.4693405713986776
FECHIPS_X	42.1815
FECHIPS_Y	40.2815
FECHIP_THICKNESS	175.73604284072607
FECHIP_THICKNESS_STD_DEVIATION	3.783631866197115
SENSOR_THICKNESS	0
SENSOR_THICKNESS_STD_DEVIATION	0
SENSOR_X	39.4985
SENSOR_Y	41.106

ProductionDB Record

Expand ProductionDB Record

6745bfe72a57a2573b6ec372

state

ready

stateTs

2024-11-26T12:32:39.337Z

stateUserIdentity

5590-4360-1

date

2024-11-14T15:39:00.000Z

testType

id	5f87e63950d75e000a335aac
code	QUAD_BARE_MODULE_METROLOGY
name	Quad Bare Module Metrology
state	active

institution

id	5d41d8ddf6e07b000a559aee
code	INFN_MILANO
name	INFN Milano

user

id	66f15055a2dfe000421cf923
userIdentity	5590-4360-1
firstName	Pietro
middleName
lastName	Rivetti

runNumber

passed

False

problems

False

properties

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
BARE_MODULE_THICKNESS	Average bare module thickness [µm]	float	single	None	False	356.6072291232529	None
BARE_MODULE_THICKNESS_STD_DEVIATION	Std deviation of bare module thickness [µm]	float	single	None	False	3.4693405713986776	None
FECHIPS_X	FE chips x dimension [mm]	float	single	1	False	42.1815	None
FECHIPS_Y	FE chips y dimension [mm]	float	single	1	False	40.2815	None
FECHIP_THICKNESS	Average FE chip thickness [µm]	float	single	None	False	175.73604284072607	None
FECHIP_THICKNESS_STD_DEVIATION	Std deviation of FE chip thickness [µm]	float	single	None	False	3.783631866197115	None
SENSOR_THICKNESS	Average sensor thickness (if total height out of specifications) [µm]	float	single	None	False	0	None
SENSOR_THICKNESS_STD_DEVIATION	Std deviation of sensor thickness (if total height out of specifications) [µm]	float	single	None	False	0	None
SENSOR_X	Sensor dimension in x [mm]	float	single	None	False	39.4985	None
SENSOR_Y	Sensor dimension in y [mm]	float	single	None	False	41.106	None

cts

2024-11-26T12:32:39.337Z

sys

cts	2024-11-26T12:32:39.337Z
mts	2024-11-26T12:32:39.337Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6720fc48cdff110042194ad1

ba460f101616f32e24fd8beb8d60836c

ready

2024-10-29T15:16:24.494Z

23-6780-1

False

None

False

None

20UPGB43200031

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v2

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Module PCB tab cutting

No tests are allocated for this stage.

Past QC Stages and Results

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
67c096…3a3059	BAREMODULERECEPTION	MASS_MEASUREMENT	AnastasiaBarri	N/A	10 months ago	No tags	Selected
679a58…ffcf6f	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	AnnaRaquel Petri	N/A	11 months ago	No tags	Selected
6745bf…6ec372	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	PietroRivetti	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB43200031

MODULE/TAB_CUTTING

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_BARE_MODULE_METROLOGY QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Module PCB tab cutting

Past QC Stages and Results

Module reception (MODULE/RECEPTION)

Module Complete (MODULE/COMPLETE)

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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