20UPGPQ4210028

MODULE/QC_CROSSCHECK

Component Information

Serial Number	20UPGPQ4210028
ProdDB ID	80c7fc…ace8ea
LocalDB ID	6703f474ef991c0043ea24d4
Component Type	MODULE_PCB
Parents	20UPGM24210028
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	NCAB
PCB design version readonly	4
PCB vendor technology readonly	2
SMD population vendor	Garner Osborne Ltd
PCB BOM version	22

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: PCB_POPULATION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	8 months ago
component ObjectId	6703f474ef991c0043ea24d4
Stage	PCB_POPULATION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	Burhani Taher Saifuddin
ObjectId of this record	680fbde92024e49a77aa55e6
ObjectId of RAW record	680fbde82024e49a77aa55e5
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.4.1
INSTRUMENT
OPERATOR
COMPONENT_MISALIGNMENT_GRADE	1
DATA_CONNECTOR_ASSEMBLY_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
OVERALL_GRADE	5
PARTICULATE_CONTAMINATION_GRADE	1
SCRATCHES_GRADE	3
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	1
SOLDER_SPILLS_GRADE	1
WATERMARKS_GRADE	1
WIREBOND_PADS_CONTAMINATION_GRADE	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
front_tile5 Download front_tile5		Scratches_Wirebonding_pad
front_tile9 Download front_tile9		Scratches_PCB
front_tile10 Download front_tile10		Other_contamination
front_tile11 Download front_tile11		Scratches_Wirebonding_pad
front_tile17 Download front_tile17		Scratches_Wirebonding_pad
front_tile23 Download front_tile23		Scratches_Wirebonding_pad

RAW Results Record

Download RAW

serialNumber

20UPGPQ4210028

testType

VISUAL_INSPECTION

subtestType

results

property

OPERATOR
INSTRUMENT
ANALYSIS_VERSION	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	0.1.0

comment

Metadata

QCHELPER_VERSION

0.1.0

ModuleSN

20UPGPQ4210028

TimeStart

1745861943

front_defects

5	Yellow.Scratches_Wirebonding_pad
9	Yellow.Scratches_PCB
10	Yellow.Other_contamination
11	Red.Scratches_Wirebonding_pad
17	Red.Scratches_Wirebonding_pad
23	Red.Scratches_Wirebonding_pad

front_comments

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

front_image

680fbdd645ec60c43b563424

front_defect_images

5	69273d2ca14734d275787c94
9	69273d2aa14734d275787c8b
10	69273d29a14734d275787c87
11	69273d2ba14734d275787c8f
17	69273d2da14734d275787c99
23	69273d2fa14734d275787c9e

Measurements

WIREBOND_PADS_CONTAMINATION_GRADE

None

PARTICULATE_CONTAMINATION_GRADE

None

WATERMARKS_GRADE

None

SCRATCHES_GRADE

None

TRACES_GRADE

None

SOLDERMASK_IRREGULARITIES_GRADE

None

HV_LV_CONNECTOR_ASSEMBLY_GRADE

None

DATA_CONNECTOR_ASSEMBLY_GRADE

None

SOLDER_SPILLS_GRADE

None

COMPONENT_MISALIGNMENT_GRADE

None

SHORTS_OR_CLOSE_PROXIMITY_GRADE

None

OPENS_TOMBSTONING_GRADE

None

OVERALL_GRADE

None

OBSERVATION

None

stage

PCB_POPULATION

component

6703f474ef991c0043ea24d4

dbVersion

1.01

address

64657cef8d79bac1f3f00582

sys

mts	2025-04-28 17:42:00.942000
cts	2025-04-28 17:42:00.942000
rev	0

ProductionDB Record

Expand ProductionDB Record

680fbe0654aadc8e96bfe80d

state

ready

stateTs

2025-04-28T17:42:30.311Z

stateUserIdentity

277-6873-1

date

2025-04-28T17:42:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d428100f6e07b000a559e87
code	OKLAHOMA
name	University of Oklahoma

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

runNumber

680fbde92024e49a77aa55e6

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	2.4.1	None	None
INSTRUMENT	Instrument	string	single	False		None	None
OPERATOR	Operator	string	single	False		None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
COMPONENT_MISALIGNMENT_GRADE	Component misalignment (scale 1-3)	integer	single	None	False	1	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue (scale 1-3)	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue (scale 1-3)	integer	single	None	False	1	None
OVERALL_GRADE	Overall grade (scale 1-3)	integer	single	None	False	5	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination on the PCB including pick-up points (scale 1-3)	integer	single	None	False	1	None
SCRATCHES_GRADE	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)	integer	single	None	False	3	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment (scale 1-3)	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single	None	False	1	None
SOLDER_SPILLS_GRADE	Solder spills as part of assembly process on wirebonding pads (scale 1-3)	integer	single	None	False	1	None
WATERMARKS_GRADE	Watermarks on the PCB (scale 1-3)	integer	single	None	False	1	None
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)	integer	single	None	False	1	None

cts

2025-04-28T17:42:30.311Z

sys

cts	2025-04-28T17:42:30.311Z
mts	2025-04-28T17:45:12.306Z
rev	15

defects

code	name	description
76117fd09601ac73700c82fe	front_tile5	Yellow.Scratches_Wirebonding_pad
c502e4aca6df1f9a40fbba3f	front_tile9	Yellow.Scratches_PCB
b5149a3b8b489715deb6e72b	front_tile10	Yellow.Other_contamination
01884335abffb83d40236da6	front_tile11	Red.Scratches_Wirebonding_pad
11dec4c627f075ad923fe558	front_tile17	Red.Scratches_Wirebonding_pad
466dbfa123615eed002d5bb1	front_tile23	Red.Scratches_Wirebonding_pad

comments

None

attachments

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2025-04-28T17:42:30.635Z

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RAW

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middleName
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dateTime

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Visual Inspection Image

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title

front_tile10

description

Visual Inspection Image

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middleName
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dateTime

2025-04-28T17:44:52.073Z

title

front_tile11

description

Visual Inspection Image

contentType

None

type

eos

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middleName
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Visual Inspection Image

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middleName
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title

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Visual Inspection Image

contentType

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firstName	Burhani Taher
middleName
lastName	Saifuddin

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6703f474ef991c0043ea24d4

80c7fc206a74ada24b2cb2f05dace8ea

ready

2024-10-07T14:47:16.898Z

2355-570-1

False

None

False

None

20UPGPQ4210028

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value NCAB

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

NCAB (100 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Garner Osborne Ltd
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_POPULATION
name	Population
order	3
initial	False
final	False

code	EDI
name	University of Edinburgh

Current Stage: QC cross-check (module swapping)

No tests are allocated for this stage.

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6883a4…787a4e	PCB_QC	HV_LV_TEST	Lubos	N/A	5 months ago	No tags	Selected
680fbd…aa55e6	PCB_POPULATION	VISUAL_INSPECTION	Burhani Taher Saifuddin	8 months ago	8 months ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4210028

MODULE/QC_CROSSCHECK

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: PCB_POPULATION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: QC cross-check (module swapping)

Past QC Stages and Results

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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