Database for ITk Pixel Module

Serial Number	20UPGS33303814
ProdDB ID	9b0a4e…3c9523
LocalDB ID	66f6be76db67820043376bdd
Component Type	SENSOR_TILE
Parents	20UPGB43200224
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	production
Scratch id (to be used if not the same as agreed manufacturer ID)	7042
Alternative Identifier	V4-2-007042-3-003
Original Manufacturer ID	Q3
Breakdown Voltage (-999 if no breakdown occurred)	-999
Depletion Voltage (V)	58.25

Key	Data
QC Passed	False
Date	4 months ago
component ObjectId	66f6be76db67820043376bdd
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	Simpson,Liana Rae
ObjectId of this record	6887e3d34008fa36f4953c4e
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat vwebApp SHA:54c860b
HUM	35
MEASUREMENT_DATE	2025-07-23T16:00Z
TEMP	20
BREAKDOWN_VOLTAGE	64.8
IV_ARRAY	{'voltage': [0, 4.8, 9.7, 14.7, 19.8, 24.8, 29.8, 34.8, 39.9, 45, 49.9, 54.9, 59.8, 64.8, 69.8], 'current': [0, 0.31900000000000006, 0.3553, 0.37715, 0.39085000000000003, 0.40075000000000005, 0.40764999999999996, 0.4128, 0.41784999999999994, 0.441, 0.4548, 0.4804, 0.5198499999999999, 0.75745, 3.8774], 'sigma current': [0, 0.0015165750888103114, 0.000927361849549571, 0.0008381527307120111, 0.0006726812023536861, 0.0005123475382979803, 0.0005500000000000005, 0.0006000000000000006, 0.0003905124837953331, 0.0019364916731037102, 0.0015198684153570677, 0.007449161026585472, 0.004801301906774866, 0.0813598334560734, 7.833891171697497]}
LEAK_CURRENT	0.75745
MAXIMUM_VOLTAGE	69.8
NO_BREAKDOWN_VOLTAGE_OBSERVED	False

Expand ProductionDB Record

6887e3d34008fa36f4953c4e

state

ready

stateTs

2025-07-28T20:55:47.907Z

stateUserIdentity

1294-8027-1

date

2025-07-28T20:55:00.000Z

testType

id	5b1a3abf130f5600054a42a8
code	IV_MEASURE
name	IV measurement
state	active

institution

id	5d318624df98f200097386d5
code	ANL
name	Argonne National Laboratory

user

id	6797ca0f2ffbf908f24868f9
userIdentity	1294-8027-1
firstName	Simpson,
middleName
lastName	Liana Rae

runNumber

...

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	webApp SHA:54c860b	None	None
HUM	Humidity [%]	float	single	True	35	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	single	False	2025-07-23T16:00Z	None	None
TEMP	Temperature [°C]	float	single	True	20	None	None

results

code BREAKDOWN_VOLTAGE
name Breakdown voltage [V] (if no breakdown put -999)
dataType float
valueType single
arrayDimensions None
additional False
value 64.8
associateChild None

code

IV_ARRAY

name

IV data

dataType

object

valueType

single

arrayDimensions

additional

False

value

voltage	0 4.8 9.7 14.7 19.8 24.8 29.8 34.8 39.9 45 49.9 54.9 59.8 64.8 69.8
current	0 0.31900000000000006 0.3553 0.37715 0.39085000000000003 0.40075000000000005 0.40764999999999996 0.4128 0.41784999999999994 0.441 0.4548 0.4804 0.5198499999999999 0.75745 3.8774
sigma current	0 0.0015165750888103114 0.000927361849549571 0.0008381527307120111 0.0006726812023536861 0.0005123475382979803 0.0005500000000000005 0.0006000000000000006 0.0003905124837953331 0.0019364916731037102 0.0015198684153570677 0.007449161026585472 0.004801301906774866 0.0813598334560734 7.833891171697497

dateTime

2026-02-18T18:49:05.983Z

userIdentity

1294-8027-1

associateChild

None

code	LEAK_CURRENT
name	Leakage current at depletion voltage + 20 (50) V for 3D (planar) sensors [μA]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	0.75745
dateTime	2026-02-18T18:49:12.907Z
userIdentity	1294-8027-1
associateChild	None

code MAXIMUM_VOLTAGE
name Maximum measured Voltage [V]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 69.8
associateChild None
code NO_BREAKDOWN_VOLTAGE_OBSERVED
name No breakdown voltage observed
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value False
associateChild None

cts

2025-07-28T20:55:47.907Z

sys

cts	2025-07-28T20:55:47.907Z
mts	2026-02-18T18:49:12.912Z
rev	2

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

66f6be76db67820043376bdd

9b0a4e2e01b680c8e7d0ed3a443c9523

ready

2024-09-27T14:17:26.224Z

20-8539-1

False

None

False

None

20UPGS33303814

V4-2-007042-3-003

parent

component

67e41734cd90d23537777555

code

aae005d394ec76bc9648ae7b2dd93c03

state

ready

stateTs

2025-03-26T15:03:16.868Z

stateUserIdentity

23-6780-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGB43200224

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	BARE_MODULE
name	Bare Module

type

code	QUAD_BARE_MODULE
name	Quad bare module

testedAtStage

code	BAREMODULEASSEMBLY
name	Bare module assembly

highestLevelParent

component

67e41734cd90d23537777555

code

aae005d394ec76bc9648ae7b2dd93c03

state

ready

stateTs

2025-03-26T15:03:16.868Z

stateUserIdentity

23-6780-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGB43200224

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	BARE_MODULE
name	Bare Module

type

code	QUAD_BARE_MODULE
name	Quad bare module

testedAtStage

code	BAREMODULEASSEMBLY
name	Bare module assembly

code	P
name	Pixels

code	PG
name	Pixel general

code	SENSOR_TILE
name	Sensor Tile

code	OUTER_PIXEL_QUAD_SENSOR_TILE
name	Outer Pixel Quad Sensor Tile

code	name	dataType	required	default	value
MAIN_VENDOR	Main Vendor	integer	True	False	3
SENSOR_TYPE_OR_TEST_STRUCTURE	Sensor Type or Test Structure	integer	True	False	3
VERSION	Version of component	string	True	False	production
SENSOR_SCRATCHID	Scratch id (to be used if not the same as agreed manufacturer ID)	string	False	False	7042
MAN_SNO	Alternative Identifier	string	True	True	V4-2-007042-3-003
MAN_ID	Original Manufacturer ID	string	False	False	Q3
BREAKDOWN_VOLTAGE	Breakdown Voltage (-999 if no breakdown occurred)	float	True	False	-999
V_FULLDEPL	Depletion Voltage (V)	float	True	False	58.25

code	BAREMODULERECEPTION
name	Bare module reception at ITk institute
order	6
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Ranking of the module

No tests are allocated for this stage.

Past QC Stages and Results

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6887e3…953c4e	BAREMODULERECEPTION	IV_MEASURE	Simpson,Liana Rae	N/A	4 months ago	No tags	Selected
66f6c7…37d131	sensor_manufacturer	IV_MEASURE	JörnGroße-Knetter	N/A	a year ago	No tags	Selected
66f6c4…37b3e9	sensor_manufacturer	CV_MEASURE	JörnGroße-Knetter	N/A	a year ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33303814

MODULE/QC_STATUS

Component Information

Properties

Comments

Test: IV_MEASURE QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Ranking of the module

Past QC Stages and Results

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

Back to top page of this component