Database for ITk Pixel Module

Serial Number	20UPGS33303740
ProdDB ID	206a83…3ea0eb
LocalDB ID	66f6bbe213e0b0004328dad7
Component Type	SENSOR_TILE
Parents	20UPGB43200156
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	production
Scratch id (to be used if not the same as agreed manufacturer ID)	7030
Alternative Identifier	V4-2-007030-3-001
Original Manufacturer ID	Q1
Breakdown Voltage (-999 if no breakdown occurred)	-999
Depletion Voltage (V)	58.24

Key	Data
QC Passed	True
Date	9 months ago
component ObjectId	66f6bbe213e0b0004328dad7
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	AnnaRaquel Petri
ObjectId of this record	67c9ccc72717b3491d6a2c3b
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp SHA:21c6060
HUM	41.77585365853658
MEASUREMENT_DATE	2025-02-27T14:45Z
TEMP	20.427073170731706
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [0.00011419767456062894, 0.2399550515935967, 0.2723391854951997, 0.2880976173121548, 0.2996008139012635, 0.29713040272371855, 0.30462529446730446, 0.3079363705215597, 0.3140035936824295, 0.3170711288214718, 0.31927098926776826, 0.322782583114938, 0.3235845965115888, 0.3239354256158458, 0.3267286835356516, 0.32713797131839434, 0.32906259162866164, 0.33130756472669665, 0.33393758899180176, 0.3352462314297705, 0.3370509108243376, 0.3388910159277084, 0.34078235783361954, 0.3426693377264597, 0.344067252180281, 0.34592553715269825, 0.3474616686829455, 0.34943177718250057, 0.3502177387562167, 0.35264803482017726, 0.3539198360616569, 0.3553799838277911, 0.3568949793344383, 0.35871605720198524, 0.3603554904457546, 0.36197558832032645, 0.3633136960121523, 0.36499919519528506, 0.36729620431679827, 0.36902608433490736, 0.3710424128405127], 'sigma current': [0.0001580603976404701, 0.001039681900283817, 0.0007717432993626286, 0.0014883075355733688, 0.00047397173192782993, 0.0018907692617027576, 0.000823038278845183, 0.0006199822639936286, 0.0009941177545386129, 0.0010933416139930333, 0.0010603537325922056, 0.001535051454837912, 0.0011132159818891135, 0.0011561919500863353, 0.0006896165636706295, 0.0004472082772291044, 0.0007032632762107438, 0.0017064110806016184, 0.0015650421883202344, 0.0006239309603010725, 0.0009551052756982672, 0.0006983607841860091, 0.0005681080319798371, 0.0006983147594188532, 0.0006600514915940676, 0.0006512155479477514, 0.0014172656551731334, 0.0014565895091693552, 0.0017516115636432889, 0.001126880059475915, 0.0007973732977721278, 0.0008565866398418598, 0.0007115189351739797, 0.0008131946978156904, 0.0004759072836873521, 0.0008820580520703977, 0.0008714189213894495, 0.0010912901640820465, 0.0007302755949335402, 0.000722515042596188, 0.0008807317251391895]}
LEAK_CURRENT	0.3388910159277084
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
67c9cc…6a2c3b	BAREMODULERECEPTION	IV_MEASURE	AnnaRaquel Petri	N/A	9 months ago	No tags	Selected
66f6c7…2952cb	sensor_manufacturer	IV_MEASURE	JörnGroße-Knetter	N/A	a year ago	No tags	Selected
66f6c4…37b0ff	sensor_manufacturer	CV_MEASURE	JörnGroße-Knetter	N/A	a year ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33303740

MODULE/INITIAL_COLD

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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