20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number	20UPGPQ4622030
ProdDB ID	55f4a9…849174
LocalDB ID	66d53ae91d92be0043080953
Component Type	MODULE_PCB
Parents	20UPGM23622030
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	4
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	22

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	8 months ago
component ObjectId	66d53ae91d92be0043080953
Stage	PCB_RECEPTION_MODULE_SITE
Test Type	METROLOGY
Institute ObjectId
User Name	Shift-LeaderHayashi-REPIC-KEK
ObjectId of this record	68a7cea10c1d266dd3d0ad50
ObjectId of RAW record	68a7cea00c1d266dd3d0ad4d
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.3.1.dev27
INSTRUMENT	None
OPERATOR	None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.205
AVERAGE_THICKNESS_POWER_CONNECTOR	1.527
DIAMETER_DOWEL_HOLE_A	3.043
HV_CAPACITOR_THICKNESS	1.863
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	True
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.003
WIDTH_DOWEL_SLOT_B	3.075
X-Y_DIMENSION_WITHIN_ENVELOP	True
X_DIMENSION	39.569
Y_DIMENSION	40.39

Attachments

Filename	Contents
20UPGPQ4622030_summary.png

RAW Results Record

Download RAW

_id

68a7cea00c1d266dd3d0ad4d

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGPQ4622030

METROLOGY

property

OPERATOR	None
INSTRUMENT	None
ANALYSIS_VERSION	None
METROLOGY_MEASUREMENT_VERSION	0.1.1.dev5

comment

Metadata

QCHELPER_VERSION

0.1.1.dev5

ModuleSN

20UPGPQ4622030

TimeStart

1755827799

Institution

KEK

component

20UPGPQ4622030

componentType

PCB

stage

PCB_POPULATION

testType

METROLOGY

date

2025-08-22T10:57:38.566+09:00

results

X_DIMENSION	39.569
Y_DIMENSION	40.39
X-Y_DIMENSION_WITHIN_ENVELOP	True
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.205
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.003
HV_CAPACITOR_THICKNESS	1.863
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	True
AVERAGE_THICKNESS_POWER_CONNECTOR	1.527
DIAMETER_DOWEL_HOLE_A	3.043
WIDTH_DOWEL_SLOT_B	3.075

passed

True

problems

False

runNumber

comment

Measurements

X_DIMENSION

X	False
Unit	mm
Values	39.569

Y_DIMENSION

X	False
Unit	mm
Values	40.39

X-Y_DIMENSION_WITHIN_ENVELOP

X	False
Unit	mm
Values	True

DIAMETER_DOWEL_HOLE_A

X	False
Unit	mm
Values	3.043

WIDTH_DOWEL_SLOT_B

X	False
Unit	mm
Values	3.075

AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS

X	False
Unit	mm
Values	0.205

STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS

X	False
Unit	mm
Values	0.003

HV_CAPACITOR_THICKNESS

X	False
Unit	mm
Values	1.863

HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP

X	False
Unit	mm
Values	True

AVERAGE_THICKNESS_POWER_CONNECTOR

X	False
Unit	mm
Values	1.527

X_DIMENSION

None

Y_DIMENSION

None

X-Y_DIMENSION_WITHIN_ENVELOP

None

DIAMETER_DOWEL_HOLE_A

None

WIDTH_DOWEL_SLOT_B

None

AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS

None

STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS

None

HV_CAPACITOR_THICKNESS

None

HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP

None

AVERAGE_THICKNESS_POWER_CONNECTOR

None

PCB_RECEPTION_MODULE_SITE

66d53ae91d92be0043080953

1.01

64657cef8d79bac1f3f0057a

mts	2025-08-22 01:57:52.501000
cts	2025-08-22 01:57:52.501000
rev	0

rawHash

a113ae79bbc42505584354cfa35dad5a

stage

PCB_RECEPTION_MODULE_SITE

ProductionDB Record

Expand ProductionDB Record

68a7e654bf31877ce50828fd

state

ready

stateTs

2025-08-22T03:39:00.213Z

stateUserIdentity

9833-9995-1

date

2025-08-22T01:57:00.000Z

testType

id	60255faf86dec3000ad0330d
code	METROLOGY
name	Metrology
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

runNumber

68a7cea10c1d266dd3d0ad50

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.3.1.dev27	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
OPERATOR	Operator	string	single	False	None	None	None

results

code AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS
name Average thickness of all pick-up areas [mm]
dataType float
valueType single
arrayDimensions 1
additional False
value 0.205
associateChild None

code	AVERAGE_THICKNESS_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [mm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	1.527
associateChild	None

code DIAMETER_DOWEL_HOLE_A
name Diameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 3.043
associateChild None
code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 1.863
associateChild None
code HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP
name HV capacitor thickness within envelop
dataType boolean
valueType single
arrayDimensions None
additional False
value True
associateChild None
code STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS
name Std deviation of thickness of all pick-up area [mm]
dataType float
valueType single
arrayDimensions 1
additional False
value 0.003
associateChild None
code WIDTH_DOWEL_SLOT_B
name Width of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 3.075
associateChild None
code X-Y_DIMENSION_WITHIN_ENVELOP
name X-Y dimension within envelope
order 1
dataType boolean
valueType single
arrayDimensions None
additional False
value True
associateChild None
code X_DIMENSION
name X dimension [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 39.569
associateChild None
code Y_DIMENSION
name Y dimension [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 40.39
associateChild None

cts

2025-08-22T03:39:00.213Z

sys

cts	2025-08-22T03:39:00.213Z
mts	2025-08-22T03:39:05.751Z
rev	2

defects

comments

None

attachments

code

3d8febd13e0dd2820d86e0bd3e04fba6

dateTime

2025-08-22T03:39:01.070Z

title

TestRun_68a7e654bf31877ce50828fd_Attachment_Pack.zip

description

/nas/db/localdb-tools-v2.2.38-rc1/viewer/static/cache/thumbnail/TestRun_68a7e654bf31877ce50828fd_Attachment_Pack.zip

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/3/d/8/3d8febd13e0dd2820d86e0bd3e04fba6?authz=zteos64:MDAwMDAyZjh4nO1RsUoDQRAlAS2sRAUl1SAWWtzd7t7lbm8qKxFBCBJsYopdZy85Ym6PywbE3sZ_EAS7FBa2go2FIBaC32Bj7QcYg4WFtZVTDMzjvcc83sJbfaFWLV5cnz_PN-ZyNyhpvX5WbtZEOzB2FCh3or73samKXmXHJeWjQUDGeVN6UFaWPNJBGFAgg5BkZjTx0DAiIQUjGRumaXpHmVbx3kZqKKJmEnmMpZnHeca9NMmkpyKdMZ6kcSLSg5dapz02sGM0QAhMoJDIJQgm4i6Mc0Ie8VjyzuzfLvS-kJAlnbOyCy4nUzisrHW-iJhkUmIchmy7g5hNB5vc5zz2U-lz1oVCDQ3OfIAKhGkch4NKN0GVJULfjhz-LiQ7VHmBP5CesQijMVlk4Cp1bBBsoU1fnWS4BB_8anvr4VDcrO62lp8ed05ffX17Hk38leH-XWvtqPHfxJ80AfeT98v6J-Gr6Ms%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/3/d/8/3d8febd13e0dd2820d86e0bd3e04fba6

filename

3d8febd13e0dd2820d86e0bd3e04fba6

user

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

code

339ce21ba0ad66c9fd8a4db99d8a7c9e

dateTime

2025-08-22T03:39:05.494Z

title

RAW

description

RAW

contentType

text/plain

type

file

binaryStoreg02

True

filename

20UPGPQ4622030_PCB_RECEPTION_MODULE_SITE_METROLOGY_68a7e654bf31877ce50828fd_68a7cea00c1d266dd3d0ad4d.json

user

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66d53ae91d92be0043080953

55f4a9a4a51585b8df59235920849174

ready

2024-09-02T04:11:21.928Z

24-779-1

False

None

False

None

20UPGPQ4622030

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION_MODULE_SITE
name	PCB Reception at module site
order	13
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Parylene Unmasking

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68a7ce…d0ad50	PCB_RECEPTION_MODULE_SITE	METROLOGY	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
68a7ce…d0ad4a	PCB_QC	HV_LV_TEST	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
677b82…b1fcf9	PCB_RECEPTION	LAYER_THICKNESS	KojiNakamura	a year ago	a year ago	No tags	Selected
677b83…b1fcfb	PCB_RECEPTION	METROLOGY	KojiNakamura	a year ago	a year ago	No tags	Selected
677b82…b1fcf7	PCB_RECEPTION	VISUAL_INSPECTION	KojiNakamura	a year ago	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Properties

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Attachments

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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