20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number	20UPGPQ4622030
ProdDB ID	55f4a9…849174
LocalDB ID	66d53ae91d92be0043080953
Component Type	MODULE_PCB
Parents	20UPGM23622030
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	4
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	22

Comments

Test: HV_LV_TEST QC Passed

(Stage: PCB_QC)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	8 months ago
component ObjectId	66d53ae91d92be0043080953
Stage	PCB_QC
Test Type	HV_LV_TEST
Institute ObjectId
User Name	Shift-LeaderHayashi-REPIC-KEK
ObjectId of this record	68a7ce450c1d266dd3d0ad4a
ObjectId of RAW record	68a7ce450c1d266dd3d0ad49
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
INSTRUMENT	None
OPERATOR
TEST_DURATION	10
DAMAGE_COMMENT
EFFECTIVE_RESISTANCE	9.04
GND_DROP	0.29
HV_LEAKAGE	31
LEAKAGE_CURRENT	3.1
NTC_VALUE	7.054
NTC_VOLTAGE	1.446
R1_HV_RESISTOR	-1
RELATIVE_HUMIDITY	6.1
TEMPERATURE	24.4
VIN_DROP	0.347

RAW Results Record

Download RAW

_id

68a7ce450c1d266dd3d0ad49

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGPQ4622030

HV_LV_TEST

property

OPERATOR	None
INSTRUMENT	None
ANALYSIS_VERSION	None
TEST_DURATION	None
HV_LV_TEST_MEASUREMENT_VERSION	0.1.1.dev5

comment

Metadata

QCHELPER_VERSION

0.1.1.dev5

ModuleSN

20UPGPQ4622030

TimeStart

1755827769

Measurement

VIN_DROP[V]	0.347
GND_DROP[V]	0.29
EFFECTIVE_RESISTANCE[mOhm]	9.04
HV_LEAKAGE[mV]	31
LEAKAGE_CURRENT[nA]	3.1
NTC_VOLTAGE[V]	1.446
NTC_VALUE[kOhm]	7.054
HUMIDITY[RH%]	6.1
TEST_DURATION[min]	10
TEMPERATURE	24.4
R1_HV_RESISTOR	-1

Measurements

VIN_DROP

None

GND_DROP

None

EFFECTIVE_RESISTANCE

None

HV_LEAKAGE

None

LEAKAGE_CURRENT

None

NTC_VOLTAGE

None

NTC_VALUE

None

TEMPERATURE

None

RELATIVE_HUMIDITY

None

R1_HV_RESISTOR

None

DAMAGE_COMMENT

None

PCB_QC

66d53ae91d92be0043080953

1.01

64657cef8d79bac1f3f0057a

mts	2025-08-22 01:56:21.135000
cts	2025-08-22 01:56:21.135000
rev	0

rawHash

16fe95134767f8198e56c686bc75a062

stage

PCB_QC

ProductionDB Record

Expand ProductionDB Record

68a7e64eac202b0e6fb50f84

state

ready

stateTs

2025-08-22T03:38:54.415Z

stateUserIdentity

9833-9995-1

date

2025-08-22T01:56:00.000Z

testType

id	63ef7c67a1170e0037dc07eb
code	HV_LV_TEST
name	LV and HV Test
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

runNumber

68a7ce450c1d266dd3d0ad4a

passed

True

problems

False

properties

code ANALYSIS_VERSION
name Analysis version
dataType string
valueType single
required False
value None
code INSTRUMENT
name Instrument
dataType string
valueType single
required False
value None
code OPERATOR
name Operator
dataType string
valueType single
required False
value
code TEST_DURATION
name Duration of test [min]
dataType float
valueType single
required False
value 10
rangeMin None
rangeMax None

results

code DAMAGE_COMMENT
name Damage comment
dataType string
valueType single
arrayDimensions None
additional False
value
associateChild None
code EFFECTIVE_RESISTANCE
name Effective resistance of the PCB [mΩ]
dataType float
valueType single
arrayDimensions None
additional False
value 9.04
associateChild None
code GND_DROP
name GND Drop [V]
dataType float
valueType single
arrayDimensions None
additional False
value 0.29
associateChild None
code HV_LEAKAGE
name HV (-975V) leakage value [mV]
dataType float
valueType single
arrayDimensions None
additional False
rangeMax None
value 31
associateChild None
code LEAKAGE_CURRENT
name Leakage current [nA]
dataType float
valueType single
arrayDimensions None
additional False
value 3.1
associateChild None
code NTC_VALUE
name NTC value [kΩ]
dataType float
valueType single
arrayDimensions None
additional False
value 7.054
associateChild None
code NTC_VOLTAGE
name NTC voltage [V]
dataType float
valueType single
arrayDimensions None
additional False
value 1.446
associateChild None
code R1_HV_RESISTOR
name R1 - HV resistor value [kΩ]
dataType float
valueType single
arrayDimensions None
additional False
value -1
associateChild None
code RELATIVE_HUMIDITY
name Relative Humidity [RH%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 6.1
associateChild None
code TEMPERATURE
name Temperature [°C]
dataType float
valueType single
arrayDimensions None
additional False
value 24.4
associateChild None
code VIN_DROP
name Vin Drop [V]
dataType float
valueType single
arrayDimensions None
additional False
value 0.347
associateChild None

cts

2025-08-22T03:38:54.415Z

sys

cts	2025-08-22T03:38:54.415Z
mts	2025-08-22T03:38:55.035Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

e6255ca332552f81239815f308140011

2025-08-22T03:38:54.809Z

RAW

application/json

file

True

20UPGPQ4622030_PCB_QC_HV_LV_TEST_68a7e64eac202b0e6fb50f84_68a7ce450c1d266dd3d0ad49.json

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66d53ae91d92be0043080953

55f4a9a4a51585b8df59235920849174

ready

2024-09-02T04:11:21.928Z

24-779-1

False

None

False

None

20UPGPQ4622030

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_QC
name	QC
order	9
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Parylene Unmasking

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68a7ce…d0ad50	PCB_RECEPTION_MODULE_SITE	METROLOGY	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
68a7ce…d0ad4a	PCB_QC	HV_LV_TEST	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
677b82…b1fcf9	PCB_RECEPTION	LAYER_THICKNESS	KojiNakamura	a year ago	a year ago	No tags	Selected
677b83…b1fcfb	PCB_RECEPTION	METROLOGY	KojiNakamura	a year ago	a year ago	No tags	Selected
677b82…b1fcf7	PCB_RECEPTION	VISUAL_INSPECTION	KojiNakamura	a year ago	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Properties

Comments

Test: HV_LV_TEST QC Passed

(Stage: PCB_QC)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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