20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number	20UPGPQ4622030
ProdDB ID	55f4a9…849174
LocalDB ID	66d53ae91d92be0043080953
Component Type	MODULE_PCB
Parents	20UPGM23622030
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	4
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	22

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66d53ae91d92be0043080953
Stage	PCB_RECEPTION
Test Type	METROLOGY
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	677b8379d6bd81619cb1fcfb
ObjectId of RAW record	677b8379d6bd81619cb1fcfa
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.22
INSTRUMENT	None
OPERATOR	None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.204
AVERAGE_THICKNESS_POWER_CONNECTOR	0
DIAMETER_DOWEL_HOLE_A	3.076
HV_CAPACITOR_THICKNESS	0
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	True
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.003
WIDTH_DOWEL_SLOT_B	3.029
X-Y_DIMENSION_WITHIN_ENVELOP	True
X_DIMENSION	39.561
Y_DIMENSION	40.378

RAW Results Record

Download RAW

_id

677b8379d6bd81619cb1fcfa

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGPQ4622030

METROLOGY

property

OPERATOR	None
INSTRUMENT	None
ANALYSIS_VERSION	None
METROLOGY_MEASUREMENT_VERSION	0.1.0

comment

Metadata

QCHELPER_VERSION	0.1.0
ModuleSN	20UPGPQ4622030
TimeStart	1736147817

Measurements

X_DIMENSION	39.561
Y_DIMENSION	40.378
X-Y_DIMENSION_WITHIN_ENVELOP	True
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.204
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.003
HV_CAPACITOR_THICKNESS	0.0
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	True
AVERAGE_THICKNESS_POWER_CONNECTOR	0.0
DIAMETER_DOWEL_HOLE_A	3.076
WIDTH_DOWEL_SLOT_B	3.029

X_DIMENSION

None

Y_DIMENSION

None

X-Y_DIMENSION_WITHIN_ENVELOP

None

DIAMETER_DOWEL_HOLE_A

None

WIDTH_DOWEL_SLOT_B

None

AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS

None

STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS

None

HV_CAPACITOR_THICKNESS

None

HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP

None

AVERAGE_THICKNESS_POWER_CONNECTOR

None

PCB_RECEPTION

66d53ae91d92be0043080953

1.01

64657cef8d79bac1f3f0057a

mts	2025-01-06 07:17:13.362000
cts	2025-01-06 07:17:13.362000
rev	0

rawHash

df89be15979ef53db25e9fb4d8e834bb

stage

PCB_RECEPTION

ProductionDB Record

Expand ProductionDB Record

677b9585e89f7f88ba29f15a

state

ready

stateTs

2025-01-06T08:34:13.771Z

stateUserIdentity

24-779-1

date

2025-01-06T07:17:00.000Z

testType

id	60255faf86dec3000ad0330d
code	METROLOGY
name	Metrology
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

677b8379d6bd81619cb1fcfb

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.22	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
OPERATOR	Operator	string	single	False	None	None	None

results

code AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS
name Average thickness of all pick-up areas [mm]
dataType float
valueType single
arrayDimensions 1
additional False
value 0.204
associateChild None

code	AVERAGE_THICKNESS_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [mm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	0
associateChild	None

code DIAMETER_DOWEL_HOLE_A
name Diameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 3.076
associateChild None
code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 0
associateChild None
code HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP
name HV capacitor thickness within envelop
dataType boolean
valueType single
arrayDimensions None
additional False
value True
associateChild None
code STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS
name Std deviation of thickness of all pick-up area [mm]
dataType float
valueType single
arrayDimensions 1
additional False
value 0.003
associateChild None
code WIDTH_DOWEL_SLOT_B
name Width of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 3.029
associateChild None
code X-Y_DIMENSION_WITHIN_ENVELOP
name X-Y dimension within envelope
order 1
dataType boolean
valueType single
arrayDimensions None
additional False
value True
associateChild None
code X_DIMENSION
name X dimension [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 39.561
associateChild None
code Y_DIMENSION
name Y dimension [mm]
dataType float
valueType single
arrayDimensions None
additional False
value 40.378
associateChild None

cts

2025-01-06T08:34:13.771Z

sys

cts	2025-01-06T08:34:13.771Z
mts	2025-01-06T08:34:14.574Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

63489235929155faf9ca99ecbf35d8a6

2025-01-06T08:34:14.229Z

RAW

application/json

file

True

20UPGPQ4622030_PCB_RECEPTION_METROLOGY_677b9585e89f7f88ba29f15a_677b8379d6bd81619cb1fcfa.json

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66d53ae91d92be0043080953

55f4a9a4a51585b8df59235920849174

ready

2024-09-02T04:11:21.928Z

24-779-1

False

None

False

None

20UPGPQ4622030

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION
name	Reception
order	1
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Parylene Unmasking

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68a7ce…d0ad50	PCB_RECEPTION_MODULE_SITE	METROLOGY	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
68a7ce…d0ad4a	PCB_QC	HV_LV_TEST	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
677b82…b1fcf9	PCB_RECEPTION	LAYER_THICKNESS	KojiNakamura	a year ago	a year ago	No tags	Selected
677b83…b1fcfb	PCB_RECEPTION	METROLOGY	KojiNakamura	a year ago	a year ago	No tags	Selected
677b82…b1fcf7	PCB_RECEPTION	VISUAL_INSPECTION	KojiNakamura	a year ago	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Properties

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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