20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number	20UPGPQ4622030
ProdDB ID	55f4a9…849174
LocalDB ID	66d53ae91d92be0043080953
Component Type	MODULE_PCB
Parents	20UPGM23622030
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	4
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	22

Comments

Test: LAYER_THICKNESS QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66d53ae91d92be0043080953
Stage	PCB_RECEPTION
Test Type	LAYER_THICKNESS
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	677b8284d6bd81619cb1fcf9
ObjectId of RAW record	677b8284d6bd81619cb1fcf8
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
INSTRUMENT	None
OPERATOR
BOTTOM_LAYER_THICKNESS	30.7
COVERLAY_WITH_ADHESIVE_THICKNESS	81.7
CU_THICKNESS	N/A
DIELECTRIC_THICKNESS	84.3
INNER_LAYER_THICKNESS	12.5
THICKNESS	218
TOP_LAYER_THICKNESS	29.9

RAW Results Record

Download RAW

_id

677b8284d6bd81619cb1fcf8

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGPQ4622030

LAYER_THICKNESS

property

OPERATOR	None
INSTRUMENT	None
ANALYSIS_VERSION	None
LAYER_THICKNESS_MEASUREMENT_VERSION	0.1.0

comment

Metadata

QCHELPER_VERSION

0.1.0

ModuleSN

20UPGPQ4622030

TimeStart

1736147578

Measurement

BOTTOM_LAYER_THICKNESS	30.7
COVERLAY_WITH_ADHESIVE_THICKNESS	81.7
DIELECTRIC_THICKNESS	84.3
INNER_LAYER_THICKNESS	12.5
SOLDERMASK_THICKNESS	18.9
THICKNESS	218.0
TOP_LAYER_THICKNESS	29.9

Measurements

TOP_LAYER_THICKNESS

None

INNER_LAYER_THICKNESS

None

BOTTOM_LAYER_THICKNESS

None

DIELECTRIC_THICKNESS

None

COVERLAY_WITH_ADHESIVE_THICKNESS

None

THICKNESS

None

CU_THICKNESS

None

PCB_RECEPTION

66d53ae91d92be0043080953

1.01

64657cef8d79bac1f3f0057a

mts	2025-01-06 07:13:08.071000
cts	2025-01-06 07:13:08.071000
rev	0

rawHash

06614cabe1db91e379003e8df9ddb0fe

stage

PCB_RECEPTION

ProductionDB Record

Expand ProductionDB Record

677b958985eb1e04aa6105fb

state

ready

stateTs

2025-01-06T08:34:17.008Z

stateUserIdentity

24-779-1

date

2025-01-06T07:13:00.000Z

testType

id	63ef3b1919aead0036ceca12
code	LAYER_THICKNESS
name	Layer thickness measurement
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

677b8284d6bd81619cb1fcf9

passed

True

problems

False

properties

code	name	dataType	valueType	required	value
ANALYSIS_VERSION	Analysis Version	string	single	False	None
INSTRUMENT	Instrument	string	single	False	None
OPERATOR	Operator	string	single	False

results

code BOTTOM_LAYER_THICKNESS
name Bottom layer thickness (including ENIG) [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 30.7
associateChild None
code COVERLAY_WITH_ADHESIVE_THICKNESS
name Coverlay with Adhesive thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 81.7
associateChild None
code CU_THICKNESS
name Effective Cu thickness [µm]
order 1
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code DIELECTRIC_THICKNESS
name Dielectric thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 84.3
associateChild None
code INNER_LAYER_THICKNESS
name Inner layer thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 12.5
associateChild None
code THICKNESS
name Total PCB thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 218
associateChild None
code TOP_LAYER_THICKNESS
name Top layer thickness (including ENIG) [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 29.9
associateChild None

cts

2025-01-06T08:34:17.008Z

sys

cts	2025-01-06T08:34:17.008Z
mts	2025-01-06T08:34:17.483Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

8808532d55799cbb78df2e460b99861b

2025-01-06T08:34:17.343Z

RAW

application/json

file

True

20UPGPQ4622030_PCB_RECEPTION_LAYER_THICKNESS_677b958985eb1e04aa6105fb_677b8284d6bd81619cb1fcf8.json

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66d53ae91d92be0043080953

55f4a9a4a51585b8df59235920849174

ready

2024-09-02T04:11:21.928Z

24-779-1

False

None

False

None

20UPGPQ4622030

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION
name	Reception
order	1
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Parylene Unmasking

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68a7ce…d0ad50	PCB_RECEPTION_MODULE_SITE	METROLOGY	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
68a7ce…d0ad4a	PCB_QC	HV_LV_TEST	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
677b82…b1fcf9	PCB_RECEPTION	LAYER_THICKNESS	KojiNakamura	a year ago	a year ago	No tags	Selected
677b83…b1fcfb	PCB_RECEPTION	METROLOGY	KojiNakamura	a year ago	a year ago	No tags	Selected
677b82…b1fcf7	PCB_RECEPTION	VISUAL_INSPECTION	KojiNakamura	a year ago	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Properties

Comments

Test: LAYER_THICKNESS QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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