20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Serial Number	20UPGPQ4622030
ProdDB ID	55f4a9…849174
LocalDB ID	66d53ae91d92be0043080953
Component Type	MODULE_PCB
Parents	20UPGM23622030
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	4
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	22

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	66d53ae91d92be0043080953
Stage	PCB_RECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	677b8278d6bd81619cb1fcf7
ObjectId of RAW record	677b8277d6bd81619cb1fcf6
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v2.3.1.dev0
INSTRUMENT
OPERATOR
COMPONENT_MISALIGNMENT_GRADE	1
DATA_CONNECTOR_ASSEMBLY_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
OVERALL_GRADE	2
PARTICULATE_CONTAMINATION_GRADE	2
SCRATCHES_GRADE	1
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	1
SOLDER_SPILLS_GRADE	1
WATERMARKS_GRADE	1
WIREBOND_PADS_CONTAMINATION_GRADE	1

Visual Inspection Defects

Filename	Contents	Defects	Comment
front_tile10 Download front_tile10		Dusts
front_tile19 Download front_tile19		Dusts
front_tile25 Download front_tile25		Dusts

RAW Results Record

Download RAW

serialNumber

20UPGPQ4622030

testType

VISUAL_INSPECTION

subtestType

results

property

OPERATOR
INSTRUMENT
ANALYSIS_VERSION	None
VISUAL_INSPECTION_MEASUREMENT_VERSION	0.1.0

comment

Metadata

QCHELPER_VERSION

0.1.0

ModuleSN

20UPGPQ4622030

TimeStart

1736147457

front_defects

10	Yellow.Dusts
19	Yellow.Dusts
25	Yellow.Dusts

front_comments

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

front_image

677b8275a42aa0a9a2230bab

front_defect_images

10	69814f35e62785753342a022
19	69814f36e62785753342a025
25	69814f37e62785753342a028

Measurements

WIREBOND_PADS_CONTAMINATION_GRADE

None

PARTICULATE_CONTAMINATION_GRADE

None

WATERMARKS_GRADE

None

SCRATCHES_GRADE

None

TRACES_GRADE

None

SOLDERMASK_IRREGULARITIES_GRADE

None

HV_LV_CONNECTOR_ASSEMBLY_GRADE

None

DATA_CONNECTOR_ASSEMBLY_GRADE

None

SOLDER_SPILLS_GRADE

None

COMPONENT_MISALIGNMENT_GRADE

None

SHORTS_OR_CLOSE_PROXIMITY_GRADE

None

OPENS_TOMBSTONING_GRADE

None

OVERALL_GRADE

None

OBSERVATION

None

stage

PCB_RECEPTION

component

66d53ae91d92be0043080953

dbVersion

1.01

address

64657cef8d79bac1f3f0057a

sys

mts	2025-01-06 07:12:55.884000
cts	2025-01-06 07:12:55.884000
rev	0

ProductionDB Record

Expand ProductionDB Record

677b9540e89f7f88ba29f082

state

ready

stateTs

2025-01-06T08:33:04.181Z

stateUserIdentity

24-779-1

date

2025-01-06T07:12:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

677b8278d6bd81619cb1fcf7

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	2.3.1.dev0	None	None
INSTRUMENT	Instrument	string	single	False		None	None
OPERATOR	Operator	string	single	False		None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
COMPONENT_MISALIGNMENT_GRADE	Component misalignment (scale 1-3)	integer	single	None	False	1	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue (scale 1-3)	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue (scale 1-3)	integer	single	None	False	1	None
OVERALL_GRADE	Overall grade (scale 1-3)	integer	single	None	False	2	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination on the PCB including pick-up points (scale 1-3)	integer	single	None	False	2	None
SCRATCHES_GRADE	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)	integer	single	None	False	1	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment (scale 1-3)	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single	None	False	1	None
SOLDER_SPILLS_GRADE	Solder spills as part of assembly process on wirebonding pads (scale 1-3)	integer	single	None	False	1	None
WATERMARKS_GRADE	Watermarks on the PCB (scale 1-3)	integer	single	None	False	1	None
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)	integer	single	None	False	1	None

cts

2025-01-06T08:33:04.181Z

sys

cts	2025-01-06T08:33:04.181Z
mts	2025-01-06T08:34:11.817Z
rev	9

defects

code	name	description
a607ec48b886903ac7f92bf6	front_tile10	Yellow.Dusts
1e37131c425b00c2a17b34e7	front_tile19	Yellow.Dusts
0e715a0560903ad5ca7cb3df	front_tile25	Yellow.Dusts

comments

None

attachments

code

aee583f0cc5da97543c3b762eacd0753

dateTime

2025-01-06T08:33:04.568Z

title

RAW

description

RAW

contentType

application/json

type

file

binaryStoreg02

True

filename

20UPGPQ4622030_PCB_RECEPTION_VISUAL_INSPECTION_677b9540e89f7f88ba29f082_677b8277d6bd81619cb1fcf6.json

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

code

b429a456036907d92d91c7c6516d89d6

dateTime

2025-01-06T08:33:05.697Z

title

front_image

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/b/4/2/b429a456036907d92d91c7c6516d89d6?authz=zteos64:MDAwMDAyZjh4nO2Rr0sEQRTHOUEFMYhRER5ywbK3M7N7MzsvXTIIFhVEjguzO7Pnct7OsjdXDoyKv7JREKsYBLNgFIPNbPAP0CqipxgMZpMvvPDh-768L9-Jp5GJSjm1f7ZzNzYzmrlOoedHBsVCha35xvZ85bbU905MmbdL2y901uv42jhvKPeL0mpPx37shz7z45BJFdY5CbgkQkumJU1EwuuU60hqvlSVhnIZCeURIlOP0pR6iuvEU2GcEiokF0yu3Feaa30DiyYGCIAwZBFSAYww3oJ-ppGGlEe0-fVvC9qfJCCiOSha4DJtcoelta7GQiIiyTEQMmg0EdPhYJ3WKOU1GdUoaUGuuga_fEDnCMM4DjtlXAdVFAibtufw90NtuyrL8QdpG4vQ62uLBFypEoNg89hsqq0Up-Ho9vF0e9a-PkerjTfv_ODyYflk92LObaxfXe9Vjydn_pv4kybg_ebwZfwDg9TqKw%3d%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/b/4/2/b429a456036907d92d91c7c6516d89d6

filename

b429a456036907d92d91c7c6516d89d6

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

code

d4067789b096baf89fb00d9ee99551bc

dateTime

2025-01-06T08:33:51.240Z

title

front_tile10

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/d/4/0/d4067789b096baf89fb00d9ee99551bc?authz=zteos64:MDAwMDAyZjd4nO2RMUvEQBCFuQNPsRCxUa4axMLCJLO5XJKdRm0sBBu5Ro4Uu9nNGU6zIbcHcr2FltqIaOUv8FfYWAj-AhFBrGztPA8LC2srp3jF433DDG_2pT5bq-ZPbo7vG82p3PZLtVwflas1v-NpM_CEPRDfmuqq6FVmWKp80PeUts447pWVUY6SnvICDz0VYBhFMZfIQymymGcSUXGtOW-3mUy3V7gOMJUBOog8cxjLmCM5CkcEMkMW8TDy-e5DrdsZatjSEqAF6JMfE4vBRz9MYJgrYgELY9ad3JtA78tpYdQdlQnYXOnCUmWMdf0AIz5m4zhsbXSJsvFQm7mMhS6PXYYJFOJQ02QPqIJg_I6lfiXbIMqSYN8MLP0OKnMo8oJ-OD1tCAZDZQjBViLVBKaQel8cZLQArevFtef36cfN9ZPGxWVzZu7ubOfofJG_fbyqvdPttPnfxJ80AU9Xt0uf_gTn2g%3d%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/d/4/0/d4067789b096baf89fb00d9ee99551bc

filename

d4067789b096baf89fb00d9ee99551bc

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

code

623bea8852f6e9970c7160416e886f15

dateTime

2025-01-06T08:33:56.266Z

title

front_tile19

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/6/2/3/623bea8852f6e9970c7160416e886f15?authz=zteos64:MDAwMDAyZjd4nO2RMUsDQRCFiaCFlVhaDWJhc7ndvcve7mAhIhYqCJIuBNm73UvOxNvjboMa0sZC0Maf4B8RbS0sUvgHTGllZ2MUCwtrK6eY4uO9xwxv8WVusVYuXd6OHxdW5jPXK_Tq3LBYr7Gmb2zlK9dX3zsxZd4p7aDQWdXztXHeTO4XpdWejn3uMz_wOQtio4RosJQbKSOSRJSTkHIjBE9pY3dNGh4LloYeITL1KE2pp5KEeCqMU0IjySMmD59qrebAwI6JAQIgDJlAKoARxtswyDTSWaSgra9729D5JAGJWsOiDS7TJndYWuvqLCSRjDgGMiSbLcR0NtigdUp5XYo6JW3I1YnBrxzQOcLsHYe9Mm6AKgqErq0c_m7U9kRlOf4gHWMRqoG2SMCVKjEINo9NV_VTXIa30fX4fv9i725yujE534pu3o-aB1NyXG0_JNPw9Wzlv4k_aQKunq9HH8D26Xo%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/6/2/3/623bea8852f6e9970c7160416e886f15

filename

623bea8852f6e9970c7160416e886f15

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

code

b48a9375dcaa3b427f514c386a9b9f3d

dateTime

2025-01-06T08:34:02.937Z

title

front_tile25

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/b/4/8/b48a9375dcaa3b427f514c386a9b9f3d?authz=zteos64:MDAwMDAyZjd4nO2RMUvEQBCFOUELKxEEtRrEQoRcdjebZHcqKwtLOQs5rti93ZzhzmxINo2looLgH1Cw8Sfob7CyEKxtBG20tLHzFAsLayunmOLjzWMeb_ppYrpVzZxcHt5OLU7mfliapYm9cqXFOqF1daj8SH3vvq2KQeWa0uT1MDTWB2N5WFbOBEaHOuShCDUXSkZpbPpKRZqzNIsp70ciUVLLLDIby9JKSWSUBITILKA0o4FQmQkU1xmhqUxSJjfvWt1OY2HdaoAICEMmkApghCU9aHKDlNNE0O7Xvz0YfJKIpN29sgc-N7bwWDnn24wTQRjFmNN4rYuYjQdj2qY0aUvRpqQHhdq1-OUDpkAYx_E4rHQMqiwRdlzt8fdD43ZVXuAPMrAOoW6MQwK-Un2L4Aptd9Qow1loruceDm5qx86vLp63Bkevb_fbq_uj99MFfvx2F88v_jfxJ03A48sZ-QDWC-tL

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/b/4/8/b48a9375dcaa3b427f514c386a9b9f3d

filename

b48a9375dcaa3b427f514c386a9b9f3d

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

66d53ae91d92be0043080953

55f4a9a4a51585b8df59235920849174

ready

2024-09-02T04:11:21.928Z

24-779-1

False

None

False

None

20UPGPQ4622030

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Production OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V2 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION
name	Reception
order	1
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Parylene Unmasking

No tests are allocated for this stage.

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	Registered	Registered
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
68a7ce…d0ad50	PCB_RECEPTION_MODULE_SITE	METROLOGY	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
68a7ce…d0ad4a	PCB_QC	HV_LV_TEST	Shift-LeaderHayashi-REPIC-KEK	8 months ago	8 months ago	No tags	Selected
677b82…b1fcf9	PCB_RECEPTION	LAYER_THICKNESS	KojiNakamura	a year ago	a year ago	No tags	Selected
677b83…b1fcfb	PCB_RECEPTION	METROLOGY	KojiNakamura	a year ago	a year ago	No tags	Selected
677b82…b1fcf7	PCB_RECEPTION	VISUAL_INSPECTION	KojiNakamura	a year ago	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ4622030

MODULE/PARYLENE_UNMASKING

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Parylene Unmasking

Past QC Stages and Results

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

GRAVEYARD - PCB impossible to recover (PCB/GRAVEYARD)

UNHAPPY - Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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