Database for ITk Pixel Module

Serial Number	20UPIS07100145
ProdDB ID	f3e4d9…e6ce44
LocalDB ID	66abad4bd19fe900439527e3
Component Type	SENSOR_TILE
Parents	20UPGB13200178
Children	No match.
Flags

Item	Value
Main Vendor readonly	7
Sensor Type or Test Structure readonly	1
Version of component	production
Scratch id (to be used if not the same as agreed manufacturer ID)	2010-11315
Alternative Identifier	V8-2-022103-1-007
Original Manufacturer ID	G
Breakdown Voltage (-999 if no breakdown occurred)	-999
Depletion Voltage (V)	-999

Key	Data
QC Passed	True
Date	4 months ago
component ObjectId	66abad4bd19fe900439527e3
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	KrishnanRama
ObjectId of this record	6992f3715b4dd8f5d296289b
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp SHA:f60b511
HUM	32.5
MEASUREMENT_DATE	2026-02-09T15:00Z
TEMP	21.4
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'voltage': [0, 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80, 82, 84, 86, 88, 90, 92, 94, 96, 98], 'current': [0.0477, 0.308, 0.483, 0.586, 0.65, 0.699, 0.743, 0.784, 0.823, 0.857, 0.894, 0.929, 0.965, 1, 1.03, 1.07, 1.1, 1.14, 1.18, 1.21, 1.25, 1.29, 1.33, 1.37, 1.41, 1.45, 1.49, 1.53, 1.57, 1.62, 1.66, 1.7, 1.75, 1.79, 1.84, 1.88, 1.93, 1.98, 2.02, 2.07, 2.11, 2.16, 2.21, 2.26, 2.31, 2.36, 2.41, 2.46, 2.52, 2.57], 'sigma current': [0.000839, 0.000723, 0.000654, 0.000675, 0.000589, 0.00082, 0.000747, 0.000863, 0.000897, 0.000888, 0.000783, 0.000903, 0.000859, 0.000904, 0.00183, 0.00221, 0.00154, 0.00141, 0.00196, 0.00153, 0.0016, 0.0015, 0.0016, 0.00186, 0.00105, 0.000798, 0.00152, 0.00092, 0.00113, 0.00152, 0.00128, 0.00102, 0.00141, 0.0011, 0.00109, 0.0014, 0.00116, 0.00131, 0.00111, 0.00104, 0.00132, 0.000981, 0.000871, 0.00094, 0.0011, 0.001, 0.00113, 0.00106, 0.00119, 0.00107]}
LEAK_CURRENT	0.929
MAXIMUM_VOLTAGE	98
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Expand ProductionDB Record

6992f3715b4dd8f5d296289b

state

ready

stateTs

2026-02-16T10:37:37.076Z

stateUserIdentity

3667-3929-1

date

2026-02-16T10:37:00.000Z

testType

id	5b1a3abf130f5600054a42a8
code	IV_MEASURE
name	IV measurement
state	active

institution

id	5ecf13a093e5ee000a0e5ac6
code	IFAE
name	Institut de Fisica d'Altes Energies (IFAE)

user

id	66fc07b1ef991c0043c2688a
userIdentity	3667-3929-1
firstName	Krishnan
middleName
lastName	Rama

runNumber

...

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	webApp SHA:f60b511	None	None
HUM	Humidity [%]	float	single	True	32.5	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	single	False	2026-02-09T15:00Z	None	None
TEMP	Temperature [°C]	float	single	True	21.4	None	None

results

code BREAKDOWN_VOLTAGE
name Breakdown voltage [V] (if no breakdown put -999)
dataType float
valueType single
arrayDimensions None
additional False
value -999
associateChild None

code

IV_ARRAY

name

IV data

dataType

object

valueType

single

arrayDimensions

additional

False

value

voltage	0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98
current	0.0477 0.308 0.483 0.586 0.65 0.699 0.743 0.784 0.823 0.857 0.894 0.929 0.965 1 1.03 1.07 1.1 1.14 1.18 1.21 1.25 1.29 1.33 1.37 1.41 1.45 1.49 1.53 1.57 1.62 1.66 1.7 1.75 1.79 1.84 1.88 1.93 1.98 2.02 2.07 2.11 2.16 2.21 2.26 2.31 2.36 2.41 2.46 2.52 2.57
sigma current	0.000839 0.000723 0.000654 0.000675 0.000589 0.00082 0.000747 0.000863 0.000897 0.000888 0.000783 0.000903 0.000859 0.000904 0.00183 0.00221 0.00154 0.00141 0.00196 0.00153 0.0016 0.0015 0.0016 0.00186 0.00105 0.000798 0.00152 0.00092 0.00113 0.00152 0.00128 0.00102 0.00141 0.0011 0.00109 0.0014 0.00116 0.00131 0.00111 0.00104 0.00132 0.000981 0.000871 0.00094 0.0011 0.001 0.00113 0.00106 0.00119 0.00107

associateChild

None

code LEAK_CURRENT
name Leakage current at depletion voltage + 20 (50) V for 3D (planar) sensors [μA]
dataType float
valueType single
arrayDimensions None
additional False
value 0.929
associateChild None
code MAXIMUM_VOLTAGE
name Maximum measured Voltage [V]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 98
associateChild None
code NO_BREAKDOWN_VOLTAGE_OBSERVED
name No breakdown voltage observed
dataType boolean
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value True
associateChild None

cts

2026-02-16T10:37:37.076Z

sys

cts	2026-02-16T10:37:37.076Z
mts	2026-02-16T10:37:37.076Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

66abad4bd19fe900439527e3

f3e4d9ab618672154a83d91bb3e6ce44

ready

2024-08-01T15:44:11.490Z

5050-7261-1

False

None

False

None

20UPIS07100145

V8-2-022103-1-007

parent

component

696a420bd993f3a9c292d06a

code

479e4387f6533e7441a9d69a33813cec

state

ready

stateTs

2026-01-16T13:50:03.326Z

stateUserIdentity

23-6780-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGB13200178

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	BARE_MODULE
name	Bare Module

type

code	SINGLE_BARE_MODULE
name	Single bare module

testedAtStage

code	BAREMODULEASSEMBLY
name	Bare module assembly

highestLevelParent

component

696a420bd993f3a9c292d06a

code

479e4387f6533e7441a9d69a33813cec

state

ready

stateTs

2026-01-16T13:50:03.326Z

stateUserIdentity

23-6780-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGB13200178

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	BARE_MODULE
name	Bare Module

type

code	SINGLE_BARE_MODULE
name	Single bare module

testedAtStage

code	BAREMODULEASSEMBLY
name	Bare module assembly

code	P
name	Pixels

code	PI
name	Inner pixels

code	SENSOR_TILE
name	Sensor Tile

code	L0_INNER_PIXEL_3D_SENSOR_TILE_25
name	L0 Inner Pixel 3D Sensor Tile (25x100)

code	name	dataType	required	default	value
MAIN_VENDOR	Main Vendor	integer	True	False	7
SENSOR_TYPE_OR_TEST_STRUCTURE	Sensor Type or Test Structure	integer	True	False	1
VERSION	Version of component	string	True	False	production
SENSOR_SCRATCHID	Scratch id (to be used if not the same as agreed manufacturer ID)	string	False	False	2010-11315
MAN_SNO	Alternative Identifier	string	True	True	V8-2-022103-1-007
MAN_ID	Original Manufacturer ID	string	False	False	G
BREAKDOWN_VOLTAGE	Breakdown Voltage (-999 if no breakdown occurred)	float	True	False	-999
V_FULLDEPL	Depletion Voltage (V)	float	True	False	-999

code	BAREMODULERECEPTION
name	Bare module reception at ITk institute
order	6
initial	False
final	False

code	FBK
name	Fondazione Bruno Kessler (FBK)

Current Stage: Final Cold

No tests are allocated for this stage.

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
6992f3…96289b	BAREMODULERECEPTION	IV_MEASURE	KrishnanRama	N/A	4 months ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/WIREBOND_PROTECTION
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/GRAVEYARD
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPIS07100145

MODULE/FINAL_COLD

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Final Cold

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

Back to top page of this component