20UPGB12200128

MODULE/FINAL_METROLOGY

Component Information

Serial Number 20UPGB12200128
ProdDB ID  01087d…8c7c7b
LocalDB ID 669787b99d270d00432842c4
Component Type BARE_MODULE
Parents 20UPIM02202117 
Children 20UPGFC0096395 FE Chip 20UPIS18100364 Sensor Tile
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version readonly 2
Sensor Type 2
Vendor code readonly 2
Thickness of FE chips (RD53A) None

 Comments


Test: BARE_MODULE_SENSOR_IV QC Passed

(Stage: BAREMODULERECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 10 months ago
component ObjectId 669787b99d270d00432842c4
Stage BAREMODULERECEPTION
Test Type BARE_MODULE_SENSOR_IV
Institute ObjectId
User Name AlekseiGrigorev
ObjectId of this record 67ac8f41a1eaefaa26035265
ObjectId of RAW record None

Results

Key Data
LINK_TO_SENSOR_IV_TEST 20UPIS18100364 : Passed (vwebApp SHA:3a9a1ca)

ProductionDB Record

id67ac8f41a1eaefaa26035265
stateready
stateTs2025-02-12T12:08:33.305Z
stateUserIdentity269-8073-1
date2025-02-12T12:07:00.000Z
testType
id63a087f8641a3f0036a0e8a7
codeBARE_MODULE_SENSOR_IV
nameSensor IV on bare module
stateactive
institution
id5a832050daf1a000052e3e98
codeUIO
nameUniversity of Oslo, Department of Physics
user
id61ae0eba6d9ad9000a62cfa3
userIdentity269-8073-1
firstNameAleksei
middleName
lastNameGrigorev
runNumber...
passedTrue
problemsFalse
properties
results
codenamedataTypevalueTypearrayDimensionsadditionalrangeMinrangeMaxvalueassociateChild
LINK_TO_SENSOR_IV_TESTLink to sensor IV test resulttestRunsingleNoneFalseNoneNone
id67ac8f36e286112cecef661b
testType
id5b1a3abf130f5600054a42a8
codeIV_MEASURE
nameIV measurement
runNumber...
passedTrue
stateready
problemsFalse
date2025-02-12T12:07:00.000Z
None
cts2025-02-12T12:08:33.305Z
sys
cts2025-02-12T12:08:33.305Z
mts2025-02-12T12:08:33.305Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
669787b99d270d00432842c401087d6a84b926a2ccb85efc078c7c7bready2024-07-17T08:58:33.932Z23-6780-1FalseFalseNoneNoneFalseNoneNone20UPGB12200128None
parent
component
id6788ddac38efa70a43cc9c35
code4fab977aaa263d37e1df9b6b6c59978b
stateready
stateTs2025-01-16T10:21:32.621Z
stateUserIdentity5307-101-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPIM02202117
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePI
nameInner pixels
componentType
codeMODULE
nameModule
type
codeTRIPLET_L0_RING0_MODULE
nameTriplet L0 Ring0 module
testedAtStage
codeMODULE/WIREBONDING
nameWire Bonding
highestLevelParent
component
id6788ddac38efa70a43cc9c35
code4fab977aaa263d37e1df9b6b6c59978b
stateready
stateTs2025-01-16T10:21:32.621Z
stateUserIdentity5307-101-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPIM02202117
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePI
nameInner pixels
componentType
codeMODULE
nameModule
type
codeTRIPLET_L0_RING0_MODULE
nameTriplet L0 Ring0 module
testedAtStage
codeMODULE/WIREBONDING
nameWire Bonding
codeP
namePixels
codePG
namePixel general
codeBARE_MODULE
nameBare Module
codeSINGLE_BARE_MODULE
nameSingle bare module
codenamedataTyperequireddefaultvaluecodeTable
FECHIP_VERSIONFE chip versioncodeTableTrueFalseITkpix_v1.1
codevalue
0RD53A
1ITkpix_v1
2ITkpix_v1.1
3ITkpix_v2
9No FE chip
SENSOR_TYPESensor TypecodeTableTrueFalseL0 inner pixel 3D sensor tile
codevalue
0No sensor
1Market survey sensor tile
2L0 inner pixel 3D sensor tile
3L0 inner pixel planar sensor tile
4L1 inner pixel quad sensor tile
5Outer pixel quad sensor tile
9Dummy sensor tile
VENDORVendor codecodeTableTrueFalseIZM
codevalue
0Advacam
1Leonardo
2IZM
3HPK (in-kind)
4HPK (CERN order)
5RAL (in-house)
6Glasgow (in-house)
9ITk institute
codeBAREMODULERECEPTION
nameReception at ITk institute
order3
initialFalse
finalFalse
codeIZM
nameFraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

 Current Stage: Final flatness measurement

Past QC Stages and Results

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
Sensor IV on bare module
(BARE_MODULE_SENSOR_IV)		 Registered Registered
Flatness
(FLATNESS)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 No result N/A
Quad Bare Module Metrology
(QUAD_BARE_MODULE_METROLOGY)		 No result N/A
Single Bare Module Metrology
(SINGLE_BARE_MODULE_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
67ac8f…035265 BAREMODULERECEPTION BARE_MODULE_SENSOR_IV AlekseiGrigorev N/A 10 months ago No tags Selected
Stage Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Quad Bare Module Metrology  (QUAD_BARE_MODULE_METROLOGY)
  • Flatness  (FLATNESS)
  • Sensor IV on bare module  (BARE_MODULE_SENSOR_IV)
  • Single Bare Module Metrology  (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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