20UPGM23603039

MODULE/INITIAL_WARM

View QC Summary

Component Information

Serial Number 20UPGM23603039
ProdDB ID  7dbe8c…41e3d4
LocalDB ID 6635ca0094479d00359a578d
Component Type MODULE
Parents No match.
Children 20UPGB43309001 Bare Module 20UPGFC0135110 FE Chip 20UPGPQ2603039 PCB 20UPGFC0135094 FE Chip 20UPGFC0135081 FE Chip 20UPGFC0135100 FE Chip
Flags
Distribution of chips on wafer

 Properties

Item Value
FE chip version 3
PCB-Bare Orientation isNormal True
Wirebond protection roof presence None
IREF Trim Bit FE1 deleted None
IREF Trim Bit FE2 deleted None
IREF Trim Bit FE3 deleted None
IREF Trim Bit FE4 deleted None

 Comments

Scan Result: std_discbumpscan / run 192 (Stage: MODULE/INITIAL_WARM)
(ObjectId: 6635ca0094479d00359a578d)


Result Plots

EnMask

OccupancyMap

MeanTotMap-0

SigmaTotMap-0

MeanTotDist-0

SigmaTotDist-0

TagDist

MeanTagMap-0


Details

Scan

Key Data
runNumber 192
testType std_discbumpscan
stage MODULE/INITIAL_WARM
component 20UPGM23603039
20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
startTime 2024-05-28 22:57:54
finishTime 2024-05-28 22:59:42
user lmeng
site lbnl_pixel_modules
targetCharge -1
targetTot -1
ctrlStatus channel_configuration: 16x1
fe_chip_type: RD53A/B
firmware_hash: 0xe7985d6
firmware_identifier: 0x1030242
firmware_vers: v1.4.0
fmc_card_type: Ohio Card (Display Port)
fpga_card: Trenz TEF1001_R1
lpm_status: 0
rx_speed: 1280Mbps
exec -r configs/controller/specCfg-rd53b-16x1.json -c /home/lmeng/Yarr/configs/20UPGM23603039/20UPGM23603039_L2_warm.json -s configs/scans/itkpixv2/std_discbumpscan.json -o /home/lmeng/Yarr/configs/20UPGM23603039/data -W PFA
stopwatch analysis: 709
config: 1436
processing: 0
scan: 100448
yarr_version git_branch: mironova-itkpixv2-rosc
git_date: 2024-05-23 08:37:38 -0700
git_hash: 5297882623d062472e1d434455a61dad967c3754-dirty
git_subject: case consistency
git_tag: v1.5.1-19-g5297882
QC False
environment False
plots
passed True

Output Data

Data Display Download
Type FE Chip Serial Number
ctrlCfg N/A
dbCfg N/A
siteCfg N/A
userCfg N/A
scanCfg N/A
feCfg.before 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
feCfg.after 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
EnMask 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
OccupancyMap 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
MeanTotMap-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
SigmaTotMap-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
MeanTotDist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
SigmaTotDist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
TagDist 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
MeanTagMap-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100

DCS ### NO DCS DATA ###

 Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)		 No TestRun!
IV measurement
(IV_MEASURE)		 No TestRun!

 Candidate TestRuns of this Stage

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A
Wirebonding Information
(WIREBONDING)		 No result N/A

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test Local Result ProdDB Record
Flatness
(FLATNESS)		 No result N/A
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)		 No result N/A
Mass Measurement
(MASS_MEASUREMENT)		 No result N/A
Quad Module Metrology
(QUAD_MODULE_METROLOGY)		 No result N/A
Triplet Module Metrology
(TRIPLET_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Initial state to associate flex to bare module (MODULE/INIT)

Hide archived test results.

Run Date Test Type Stage User Site Tags Status
193 a year ago std_mergedbumpscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules PFA Pass
192 a year ago std_discbumpscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules PFA Pass
191 a year ago std_noisescan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules PFA Pass
190 a year ago std_thresholdscan_hd MODULE/INITIAL_WARM lmeng lbnl_pixel_modules PFA Pass
189 a year ago std_analogscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules PFA Pass
188 a year ago std_digitalscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules PFA Pass
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
LLS/PRE_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/PRE_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/POST_TC_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
LLS/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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