Top Page > Component List > 20 U PG M2 3603039 > QC Result > Scan Result / MODULE/INITIAL_WARM / std_thresholdscan_hd / Run 190

20 U PG M2 3603039
Outer-Quad-Module/ITkPix_v2
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Component Information

Item Value
Serial Number 20 U PG M2 3603039
Production DB Component ID 7dbe8c47d51ef338a9537eddc141e3d4
LocalDB Component ID 6635ca0094479d00359a578d
Component Type module
Super-Component No match.
Sub-Components •  20 U PG B4 3309001   Bare Module
•  20 U PG FC 0135110   FE Chip
•  20 U PG PQ 2603039   PCB
•  20 U PG FC 0135094   FE Chip
•  20 U PG FC 0135081   FE Chip
•  20 U PG FC 0135100   FE Chip
Flags

Result: 190

Properties

Item Data Type Value
FE chip version codeTable 3
PCB-Bare Orientation isNormal boolean True
Wirebond protection roof presence boolean None
IREF Trim Bit FE1 integer None
IREF Trim Bit FE2 integer None
IREF Trim Bit FE3 integer None
IREF Trim Bit FE4 integer None

Comments

Scan Result: std_thresholdscan_hd / run 190 (Stage: MODULE/INITIAL_WARM)
(ObjectId: 6635ca0094479d00359a578d)


Result Plots

ThresholdDist-0

ThresholdMap-0_0_300_0_0_0

NoiseDist-0

Chi2Map-0

StatusMap-0

StatusDist-0

NoiseMap-0

Chi2Dist-0

TimePerFitDist-0

InjVcalDiff

InjVcalDiff_Map


Details

Scan

Key Data
runNumber 190
testType std_thresholdscan_hd
stage MODULE/INITIAL_WARM
component 20UPGM23603039
20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
startTime 2024-05-28 15:28:43 PDT(-0700)
finishTime 2024-05-28 15:56:14 PDT(-0700)
user lmeng
site lbnl_pixel_modules
targetCharge -1
targetTot -1
ctrlStatus channel_configuration: 16x1
fe_chip_type: RD53A/B
firmware_hash: 0xe7985d6
firmware_identifier: 0x1030242
firmware_vers: v1.4.0
fmc_card_type: Ohio Card (Display Port)
fpga_card: Trenz TEF1001_R1
lpm_status: 0
rx_speed: 1280Mbps
exec -r configs/controller/specCfg-rd53b-16x1.json -c /home/lmeng/Yarr/configs/20UPGM23603039/20UPGM23603039_L2_warm.json -s configs/scans/itkpixv2/std_thresholdscan_hd.json -o /home/lmeng/Yarr/configs/20UPGM23603039/data -W PFA
stopwatch analysis: 687
config: 1369
processing: 0
scan: 1643366
yarr_version git_branch: mironova-itkpixv2-rosc
git_date: 2024-05-23 08:37:38 -0700
git_hash: 5297882623d062472e1d434455a61dad967c3754-dirty
git_subject: case consistency
git_tag: v1.5.1-19-g5297882
QC False
environment False
plots
passed True

Output Data

Data Display Download
Type FE Chip Serial Number
ctrlCfg N/A
dbCfg N/A
siteCfg N/A
userCfg N/A
scanCfg N/A
feCfg.before 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
feCfg.after 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
ThresholdDist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
ThresholdMap-0_0_300_0_0_0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
NoiseDist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
Chi2Map-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
StatusMap-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
StatusDist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
NoiseMap-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
Chi2Dist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
TimePerFitDist-0 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
InjVcalDiff 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100
InjVcalDiff_Map 20UPGFC0135110
20UPGFC0135094
20UPGFC0135081
20UPGFC0135100

DCS ### NO DCS DATA ###

Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebond pull test
(WIREBOND_PULL_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Wirebonding Information
(WIREBONDING)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Mass Measurement
(MASS_MEASUREMENT)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

Hide failed test results.

Hide archived test results.

Hide test results not in current stage.

Run Number
Test Type
Stage
User
Site
Date
Tags
193 std_mergedbumpscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules 2024-05-28 15:59:48 PDT(-0700) PFA
192 std_discbumpscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules 2024-05-28 15:57:54 PDT(-0700) PFA
191 std_noisescan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules 2024-05-28 15:56:31 PDT(-0700) PFA
190 std_thresholdscan_hd MODULE/INITIAL_WARM lmeng lbnl_pixel_modules 2024-05-28 15:28:43 PDT(-0700) PFA
189 std_analogscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules 2024-05-28 15:27:06 PDT(-0700) PFA
188 std_digitalscan MODULE/INITIAL_WARM lmeng lbnl_pixel_modules 2024-05-28 15:26:45 PDT(-0700) PFA
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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