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20UPGPQ2603039
Quad-PCB/Outer Pre-prod./Yamashita-Mat-75um
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGPQ2603039
Production DB Component ID 8ba535f5c343ffba465b0c361c196545
LocalDB Component ID 6603a0bba450ce00351c7f22
Component Type module_pcb
Super-Component 20UPGM23603039 
Sub-Components No match.
Flags

Properties

Item Data Type Value
PCB Manufacturer string Yamashita Material
PCB design version codeTable 2
PCB vendor technology codeTable 6
SMD population vendor string Hayashi REPIC Co.

Comments


Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 2024-04-19 01:53:50 PDT(-0700)
component ObjectId 6603a0bba450ce00351c7f22
Stage PCB_RECEPTION
Test Type METROLOGY
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 6622309feeac93e1421805b4
ObjectId of RAW record 6622309feeac93e1421805b3

Results

Key Data
ANALYSIS_VERSION mqat v1.0.14
INSTRUMENT None
OPERATOR None
X-Y_DIMENSION_WITHIN_ENVELOP True
X_DIMENSION 39.578
Y_DIMENSION 40.401
DIAMETER_DOWEL_HOLE_A 3.084
WIDTH_DOWEL_SLOT_B 3.174
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS 0.211
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS 0.002
HV_CAPACITOR_THICKNESS 0.196
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP True
AVERAGE_THICKNESS_POWER_CONNECTOR 0.212

RAW Results Record

Download RAW
_id6622309feeac93e1421805b3
raw
serialNumbertestTypesubtestTyperesultsstagecomponentdbVersionaddresssys
20UPGPQ2603039METROLOGY
property
OPERATORNone
INSTRUMENTNone
ANALYSIS_VERSIONNone
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGPQ2603039
Metadata
Measurements
X_DIMENSION39.578
Y_DIMENSION40.401
X-Y_DIMENSION_WITHIN_ENVELOPTrue
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS0.211
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS0.002
HV_CAPACITOR_THICKNESS0.196
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPTrue
AVERAGE_THICKNESS_POWER_CONNECTOR0.212
DIAMETER_DOWEL_HOLE_A3.084
WIDTH_DOWEL_SLOT_B3.174
X_DIMENSIONNone
Y_DIMENSIONNone
X-Y_DIMENSION_WITHIN_ENVELOPNone
DIAMETER_DOWEL_HOLE_ANone
WIDTH_DOWEL_SLOT_BNone
AVERAGE_THICKNESS_FECHIP_PICKUP_AREASNone
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREASNone
HV_CAPACITOR_THICKNESSNone
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPNone
AVERAGE_THICKNESS_POWER_CONNECTORNone
PCB_RECEPTION6603a0bba450ce00351c7f221.0164657cef8d79bac1f3f0057a
mts2024-04-19 08:51:43.255000
cts2024-04-19 08:51:43.255000
rev0
rawHashe2e7220a42c08d0899d9999f44e9085c
stagePCB_RECEPTION

ProductionDB Record

id6622311e5e53800034321de9
stateready
stateTs2024-04-19T08:53:50.114Z
stateUserIdentity24-779-1
date2024-04-19T08:51:00.000Z
testType
id60255faf86dec3000ad0330d
codeMETROLOGY
nameMetrology
stateactive
institution
id5d31879ddf98f200097387f5
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)
user
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
runNumber6622309feeac93e1421805b4
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1.0.14NoneNone
INSTRUMENTInstrumentstringsingleFalseNoneNoneNone
OPERATOROperatorstringsingleFalseNoneNoneNone
results
codenameorderdataTypevalueTypearrayDimensionsadditionalvalueassociateChild
X-Y_DIMENSION_WITHIN_ENVELOPX-Y dimension within envelope1booleansingleNoneFalseTrueNone
X_DIMENSIONX dimension [mm]1floatsingleNoneFalse39.578None
Y_DIMENSIONY dimension [mm]1floatsingleNoneFalse40.401None
DIAMETER_DOWEL_HOLE_ADiameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]4floatsingleNoneFalse3.084None
WIDTH_DOWEL_SLOT_BWidth of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]5floatsingleNoneFalse3.174None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREASAverage thickness of all pick-up areas [mm]6floatsingle1False0.211None
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREASStd deviation of thickness of all pick-up area [mm]7floatsingle1False0.002None
HV_CAPACITOR_THICKNESSHV capacitor thickness [mm]8floatsingleNoneFalse0.196None
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOPHV capacitor thickness within envelop9booleansingleNoneFalseTrueNone
AVERAGE_THICKNESS_POWER_CONNECTORThickness including the black body of power connector (excluding pins) [mm]10floatsingleNoneFalse0.212None
cts2024-04-19T08:53:50.114Z
sys
cts2024-04-19T08:53:50.114Z
mts2024-04-19T08:53:50.542Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypefilenameuser
42f68ac48c8e37adbe433f4a92852e1a2024-04-19T08:53:50.520ZRAWRAWtext/plainfile20UPGPQ2603039_PCB_RECEPTION_METROLOGY_6622311e5e53800034321de9_6622309feeac93e1421805b3.json
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6603a0bba450ce00351c7f228ba535f5c343ffba465b0c361c196545ready2024-03-27T04:29:47.716Z24-779-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2603039None
parent
component
id662212b015f25500356e8411
code66583d30722621b82a53e7eb0cea8139
stateready
stateTs2024-04-19T06:44:00.589Z
stateUserIdentity24-779-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22603039
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
highestLevelParent
component
id662212b015f25500356e8411
code66583d30722621b82a53e7eb0cea8139
stateready
stateTs2024-04-19T06:44:00.589Z
stateUserIdentity24-779-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22603039
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueYamashita Material
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePreproduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueYamashita Material (75 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueHayashi REPIC Co.
codePCB_RECEPTION
nameReception
order1
initialTrue
finalFalse
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)

Current Stage: Initial Warm

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test Local Result ProdDB Record
Mass
(MASS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

  Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: QC (PCB_QC) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Not signed-off

No tests are allocated for this stage.

  Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Not signed-off

No tests are allocated for this stage.

  Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cutting (PCB_CUTTING) Complete

Test Local Result ProdDB Record
Quick Tab Cutting Inspection
(QUICK_TAB_CUTTING_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Population (PCB_POPULATION) Complete

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

  Stage: Reception (PCB_RECEPTION) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Image capture test
(IMAGE_CAPTURE_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
66223237eeac93e1421805b9 PCB_POPULATION VISUAL_INSPECTION KojiNakamura 2024-04-19 02:01:24 PDT(-0700) Selected
66222884eeac93e1421805b2 PCB_RECEPTION LAYER_THICKNESS KojiNakamura 2024-04-19 01:53:55 PDT(-0700) Selected
6622309feeac93e1421805b4 PCB_RECEPTION METROLOGY KojiNakamura 2024-04-19 01:53:50 PDT(-0700) Selected
662227c1eeac93e1421805af PCB_RECEPTION VISUAL_INSPECTION KojiNakamura 2024-04-19 01:53:46 PDT(-0700) Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
PCB_CUTTING
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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