Top Page > Component List > 20UPGPQ2603039 > QC Result / PCB_RECEPTION / LAYER_THICKNESS

20UPGPQ2603039
Quad-PCB/Outer Pre-prod./Yamashita-Mat-75um
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGPQ2603039
Production DB Component ID 8ba535f5c343ffba465b0c361c196545
LocalDB Component ID 6603a0bba450ce00351c7f22
Component Type module_pcb
Super-Component 20UPGM23603039 
Sub-Components No match.
Flags

Properties

Item Data Type Value
PCB Manufacturer string Yamashita Material
PCB design version codeTable 2
PCB vendor technology codeTable 6
SMD population vendor string Hayashi REPIC Co.

Comments


Test: LAYER_THICKNESS QC Failed

(Stage: PCB_RECEPTION)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed False
Date 2024-04-19 01:53:55 PDT(-0700)
component ObjectId 6603a0bba450ce00351c7f22
Stage PCB_RECEPTION
Test Type LAYER_THICKNESS
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 66222884eeac93e1421805b2
ObjectId of RAW record 66222884eeac93e1421805b1

Results

Key Data
ANALYSIS_VERSION mqat vNone
INSTRUMENT None
OPERATOR Takumi Kumayama
BOTTOM_LAYER_THICKNESS 33.2
COVERLAY_WITH_ADHESIVE_THICKNESS 48
DIELECTRIC_THICKNESS 96.8
INNER_LAYER_THICKNESS 7.5
THICKNESS 235.5
TOP_LAYER_THICKNESS 28.9

RAW Results Record

Download RAW
_id66222884eeac93e1421805b1
raw
serialNumbertestTypesubtestTyperesultsstagecomponentdbVersionaddresssys
20UPGPQ2603039LAYER_THICKNESS
property
OPERATORNone
INSTRUMENTNone
ANALYSIS_VERSIONNone
comment
metadata
QCHELPER_VERSION4.0.dev1
MODULE_SN20UPGPQ2603039
Measurement
BOTTOM_LAYER_THICKNESS33.2
COVERLAY_WITH_ADHESIVE_THICKNESS48.0
DIELECTRIC_THICKNESS96.8
INNER_LAYER_THICKNESS7.5
SOLDERMASK_THICKNESS19.9
THICKNESS235.5
TOP_LAYER_THICKNESS28.9
Metadata
Measurements
TOP_LAYER_THICKNESSNone
INNER_LAYER_THICKNESSNone
BOTTOM_LAYER_THICKNESSNone
DIELECTRIC_THICKNESSNone
COVERLAY_WITH_ADHESIVE_THICKNESSNone
THICKNESSNone
PCB_RECEPTION6603a0bba450ce00351c7f221.0164657cef8d79bac1f3f0057a
mts2024-04-19 08:17:08.001000
cts2024-04-19 08:17:08.001000
rev0
rawHash7f8f5f39555de6819aae305c1d39188d
stagePCB_RECEPTION

ProductionDB Record

id662231235e53800034321e17
stateready
stateTs2024-04-19T08:53:55.028Z
stateUserIdentity24-779-1
date2024-04-19T08:17:00.000Z
testType
id63ef3b1919aead0036ceca12
codeLAYER_THICKNESS
nameLayer thickness measurement
stateactive
institution
id5d31879ddf98f200097387f5
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)
user
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
runNumber66222884eeac93e1421805b2
passedFalse
problemsFalse
properties
codenamedataTypevalueTyperequiredvalue
ANALYSIS_VERSIONAnalysis VersionstringsingleFalseNone
INSTRUMENTInstrumentstringsingleFalseNone
OPERATOROperatorstringsingleFalseTakumi Kumayama
results
codenameorderdataTypevalueTypearrayDimensionsadditionalvalueassociateChild
BOTTOM_LAYER_THICKNESSBottom layer thickness (including ENIG) [µm]1floatsingleNoneFalse33.2None
COVERLAY_WITH_ADHESIVE_THICKNESSCoverlay with Adhesive thickness [µm]1floatsingleNoneFalse48None
DIELECTRIC_THICKNESSDielectric thickness [µm]1floatsingleNoneFalse96.8None
INNER_LAYER_THICKNESSInner layer thickness [µm]1floatsingleNoneFalse7.5None
THICKNESSTotal PCB thickness [µm]1floatsingleNoneFalse235.5None
TOP_LAYER_THICKNESSTop layer thickness (including ENIG) [µm]1floatsingleNoneFalse28.9None
cts2024-04-19T08:53:55.028Z
sys
cts2024-04-19T08:53:55.028Z
mts2024-04-19T08:53:55.387Z
rev1
defects
commentsNone
attachments
codedateTimetitledescriptioncontentTypetypefilenameuser
a308650697dd2cd5f82245d8005cf9042024-04-19T08:53:55.377ZRAWRAWapplication/jsonfile20UPGPQ2603039_PCB_RECEPTION_LAYER_THICKNESS_662231235e53800034321e17_66222884eeac93e1421805b1.json
id5ca2afc878a5090009836718
userIdentity24-779-1
firstNameKoji
middleNameNone
lastNameNakamura
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierancestorMapprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6603a0bba450ce00351c7f228ba535f5c343ffba465b0c361c196545ready2024-03-27T04:29:47.716Z24-779-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2603039None
parent
component
id662212b015f25500356e8411
code66583d30722621b82a53e7eb0cea8139
stateready
stateTs2024-04-19T06:44:00.589Z
stateUserIdentity24-779-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22603039
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
highestLevelParent
component
id662212b015f25500356e8411
code66583d30722621b82a53e7eb0cea8139
stateready
stateTs2024-04-19T06:44:00.589Z
stateUserIdentity24-779-1
dummyFalse
completedFalse
completedTsNone
completedUserIdentityNone
trashedFalse
trashedTsNone
trashedUserIdentityNone
serialNumber20UPGM22603039
alternativeIdentifierNone
project
codeP
namePixels
subproject
codePG
namePixel general
componentType
codeMODULE
nameModule
type
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
testedAtStage
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueYamashita Material
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePreproduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueYamashita Material (75 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueHayashi REPIC Co.
codePCB_RECEPTION
nameReception
order1
initialTrue
finalFalse
codeKEK
nameHigh Energy Accelerator Research Organization (KEK)

Current Stage: Initial Warm

No tests are allocated for this stage.

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

No tests are allocated for this stage.

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

No tests are allocated for this stage.

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

  Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test Local Result ProdDB Record
Mass
(MASS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: PCB ready for module (PCB_READY_FOR_MODULE) Complete

No tests are allocated for this stage.

  Stage: Test failed, needs investigation (UNHAPPY) Complete

No tests are allocated for this stage.

  Stage: QC (PCB_QC) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Complete

Test Local Result ProdDB Record
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Not signed-off

No tests are allocated for this stage.

  Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Not signed-off

No tests are allocated for this stage.

  Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Complete

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Metrology
(METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
NTC Verification
(NTC_VERIFICATION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Signal Transmission
(SIGNAL_TRANSMISSION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
SLDO and precision resistors
(SLDO_RESISTORS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Cutting (PCB_CUTTING) Complete

Test Local Result ProdDB Record
Quick Tab Cutting Inspection
(QUICK_TAB_CUTTING_INSPECTION)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.

  Stage: Population (PCB_POPULATION) Complete

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

  Stage: Reception (PCB_RECEPTION) Complete

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Image capture test
(IMAGE_CAPTURE_TEST)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Layer thickness measurement
(LAYER_THICKNESS)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Metrology
(METROLOGY)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!
Via resistance
(VIA_RESISTANCE)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Jump to the LocalDB Test Record!
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
66223237eeac93e1421805b9 PCB_POPULATION VISUAL_INSPECTION KojiNakamura 2024-04-19 02:01:24 PDT(-0700) Selected
66222884eeac93e1421805b2 PCB_RECEPTION LAYER_THICKNESS KojiNakamura 2024-04-19 01:53:55 PDT(-0700) Selected
6622309feeac93e1421805b4 PCB_RECEPTION METROLOGY KojiNakamura 2024-04-19 01:53:50 PDT(-0700) Selected
662227c1eeac93e1421805af PCB_RECEPTION VISUAL_INSPECTION KojiNakamura 2024-04-19 01:53:46 PDT(-0700) Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
PCB_CUTTING
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Quick Tab Cutting Inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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