20UPGPQ2603039

MODULE/INITIAL_WARM

Component Information

Serial Number	20UPGPQ2603039
ProdDB ID	8ba535…196545
LocalDB ID	6603a0bba450ce00351c7f22
Component Type	MODULE_PCB
Parents	20UPGM23603039
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	2
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.

Comments

Test: LAYER_THICKNESS QC Failed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	a year ago
component ObjectId	6603a0bba450ce00351c7f22
Stage	PCB_RECEPTION
Test Type	LAYER_THICKNESS
Institute ObjectId
User Name	KojiNakamura
ObjectId of this record	66222884eeac93e1421805b2
ObjectId of RAW record	66222884eeac93e1421805b1
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
INSTRUMENT	None
OPERATOR	Takumi Kumayama
BOTTOM_LAYER_THICKNESS	33.2
COVERLAY_WITH_ADHESIVE_THICKNESS	48
DIELECTRIC_THICKNESS	96.8
INNER_LAYER_THICKNESS	7.5
THICKNESS	235.5
TOP_LAYER_THICKNESS	28.9

RAW Results Record

Download RAW

_id

66222884eeac93e1421805b1

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGPQ2603039

LAYER_THICKNESS

property

OPERATOR	None
INSTRUMENT	None
ANALYSIS_VERSION	None

comment

metadata

QCHELPER_VERSION

4.0.dev1

MODULE_SN

20UPGPQ2603039

Measurement

BOTTOM_LAYER_THICKNESS	33.2
COVERLAY_WITH_ADHESIVE_THICKNESS	48.0
DIELECTRIC_THICKNESS	96.8
INNER_LAYER_THICKNESS	7.5
SOLDERMASK_THICKNESS	19.9
THICKNESS	235.5
TOP_LAYER_THICKNESS	28.9

Metadata

Measurements

TOP_LAYER_THICKNESS

None

INNER_LAYER_THICKNESS

None

BOTTOM_LAYER_THICKNESS

None

DIELECTRIC_THICKNESS

None

COVERLAY_WITH_ADHESIVE_THICKNESS

None

THICKNESS

None

PCB_RECEPTION

6603a0bba450ce00351c7f22

1.01

64657cef8d79bac1f3f0057a

mts	2024-04-19 08:17:08.001000
cts	2024-04-19 08:17:08.001000
rev	0

rawHash

7f8f5f39555de6819aae305c1d39188d

stage

PCB_RECEPTION

ProductionDB Record

Expand ProductionDB Record

662231235e53800034321e17

state

ready

stateTs

2024-04-19T08:53:55.028Z

stateUserIdentity

24-779-1

date

2024-04-19T08:17:00.000Z

testType

id	63ef3b1919aead0036ceca12
code	LAYER_THICKNESS
name	Layer thickness measurement
state	active

institution

id	5d31879ddf98f200097387f5
code	KEK
name	High Energy Accelerator Research Organization (KEK)

user

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

runNumber

66222884eeac93e1421805b2

passed

False

problems

False

properties

code	name	dataType	valueType	required	value
ANALYSIS_VERSION	Analysis Version	string	single	False	None
INSTRUMENT	Instrument	string	single	False	None
OPERATOR	Operator	string	single	False	Takumi Kumayama

results

code	name	order	dataType	valueType	arrayDimensions	additional	value	associateChild
BOTTOM_LAYER_THICKNESS	Bottom layer thickness (including ENIG) [µm]	1	float	single	None	False	33.2	None
COVERLAY_WITH_ADHESIVE_THICKNESS	Coverlay with Adhesive thickness [µm]	1	float	single	None	False	48	None
DIELECTRIC_THICKNESS	Dielectric thickness [µm]	1	float	single	None	False	96.8	None
INNER_LAYER_THICKNESS	Inner layer thickness [µm]	1	float	single	None	False	7.5	None
THICKNESS	Total PCB thickness [µm]	1	float	single	None	False	235.5	None
TOP_LAYER_THICKNESS	Top layer thickness (including ENIG) [µm]	1	float	single	None	False	28.9	None

cts

2024-04-19T08:53:55.028Z

sys

cts	2024-04-19T08:53:55.028Z
mts	2024-04-19T08:53:55.387Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

filename

user

a308650697dd2cd5f82245d8005cf904

2024-04-19T08:53:55.377Z

RAW

application/json

file

20UPGPQ2603039_PCB_RECEPTION_LAYER_THICKNESS_662231235e53800034321e17_66222884eeac93e1421805b1.json

id	5ca2afc878a5090009836718
userIdentity	24-779-1
firstName	Koji
middleName	None
lastName	Nakamura

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

6603a0bba450ce00351c7f22

8ba535f5c343ffba465b0c361c196545

ready

2024-03-27T04:29:47.716Z

24-779-1

False

None

False

None

20UPGPQ2603039

None

parent

component

662212b015f25500356e8411

code

66583d30722621b82a53e7eb0cea8139

state

ready

stateTs

2024-04-19T06:44:00.589Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22603039

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly

highestLevelParent

component

662212b015f25500356e8411

code

66583d30722621b82a53e7eb0cea8139

state

ready

stateTs

2024-04-19T06:44:00.589Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22603039

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Preproduction OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.

code	PCB_RECEPTION
name	Reception
order	1
initial	True
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Initial Warm

No tests are allocated for this stage.

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	No result	N/A
Metrology (METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
662232…1805b9	PCB_POPULATION	VISUAL_INSPECTION	KojiNakamura	N/A	a year ago	No tags	Selected
662228…1805b2	PCB_RECEPTION	LAYER_THICKNESS	KojiNakamura	N/A	a year ago	No tags	Selected
662230…1805b4	PCB_RECEPTION	METROLOGY	KojiNakamura	N/A	a year ago	No tags	Selected
662227…1805af	PCB_RECEPTION	VISUAL_INSPECTION	KojiNakamura	N/A	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ2603039

MODULE/INITIAL_WARM

Component Information

Properties

Comments

Test: LAYER_THICKNESS QC Failed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Initial Warm

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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