20UPGS33300903

MODULE/INITIAL_WARM

Component Information

Serial Number 20UPGS33300903
ProdDB ID  f8e9ab…76a75f
LocalDB ID 6602eea4aee5d400354d0bf5
Component Type SENSOR_TILE
Parents 20UPGB43309002
Children No match.
Flags

 Properties

Item Value
Main Vendor readonly 3
Sensor Type or Test Structure readonly 3
Version of component pre-production
Scratch id (to be used if not the same as agreed manufacturer ID) 77
Alternative Identifier V4-1-000077-3-002
Original Manufacturer ID Q2
Breakdown Voltage (-999 if no breakdown occurred) -999
Depletion Voltage (V) 68.97

 Comments


Test: CV_MEASURE QC Passed

(Stage: sensor_manufacturer)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date a year ago
component ObjectId 6602eea4aee5d400354d0bf5
Stage sensor_manufacturer
Test Type CV_MEASURE
Institute ObjectId
User Name KojiNakamura
ObjectId of this record 662088335e538000342f0a02
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat vad4945a2
HUM 0
TEMP 20
CV_IMG ff5d660f5939e7f21938c36da4abf16294bbb63ca6c7ead03488d67e931b3e25
V_FULLDEPL 68.97496197070161
CV_ARRAY {'Time': [0, 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54, 56, 58, 60, 62, 64, 66, 68, 70, 72, 74, 76, 78, 80], 'Voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'Capacitance': [0.0045884132760991144, 0.06524338228218089, 0.1248699166082859, 0.1852952090194904, 0.24619401532088997, 0.3075133926157037, 0.3690520058897306, 0.4313485565671101, 0.49322038737716645, 0.5548446608338622, 0.6153410530247755, 0.6761786017858514, 0.7390795963892236, 0.7925168090239515, 0.8179474085827009, 0.8238977202165113, 0.825995676457791, 0.8271981083633658, 0.8276496973318161, 0.8281016562024842, 0.8288557440896616, 1.0729646429394701, 0.8293086913433385, 0.8305183674576859, 0.8297620099836299, 0.8299131987975985, 0.8305183674576859, 0.8306697630491241, 0.8306697630491241, 0.8303670132518938, 0.8309726784493053, 0.831427362319391, 0.831427362319391, 0.8320341882182313, 0.831427362319391, 0.8317306922556932, 0.8321859984972051, 0.8320341882182313, 0.831882419476111, 0.8324897437263572, 0.8332498347561421], 'Sigma Capacitance': [], 'Temperature': [], 'Humidity': []}

ProductionDB Record

{}

 Current Stage: Initial Warm

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test Local Result ProdDB Record
IV measurement
(IV_MEASURE)
No result N/A

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A

QA at Institutes (QA)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result N/A
Inter-pixel capacitance
(INTER-PIXEL_CAPACITANCE)
No result N/A
Inter-pixel resistance
(INTER-PIXEL_RESISTANCE)
No result N/A
IT measurement
(IT_MEASURE)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No result N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
No result N/A
IV measurement
(IV_MEASURE)
No result N/A
Sensor Metrology: Sensor bow and thickness
(SENSOR_METROLOGY)
No result N/A
Visual inspection
(VISUAL_INSPECTION)
No result N/A

Sensor Manufacturer (sensor_manufacturer)

Test Local Result ProdDB Record
CV measurement
(CV_MEASURE)
Registered Registered
IV measurement
(IV_MEASURE)
Registered Registered
LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
662088…2f0a02 sensor_manufacturer CV_MEASURE KojiNakamura N/A a year ago No tags Selected
662088…2f0ab9 sensor_manufacturer IV_MEASURE KojiNakamura N/A a year ago No tags Selected
Stage Tests
sensor_manufacturer
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
WAFER_PROCESSING
  • Visual inspection  (VISUAL_INSPECTION)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
QA
  • CV measurement  (CV_MEASURE)
  • IV measurement  (IV_MEASURE)
  • IT measurement  (IT_MEASURE)
  • Inter-pixel capacitance  (INTER-PIXEL_CAPACITANCE)
  • Inter-pixel resistance  (INTER-PIXEL_RESISTANCE)
  • Sensor Metrology: Sensor bow and thickness  (SENSOR_METROLOGY)
POST_IRRAD
  • IV measurement  (IV_MEASURE)
  • CV measurement  (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION
  • IV measurement  (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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