20UPGPQ2210402

MODULE/POST_PARYLENE_COLD

Component Information

Serial Number 20UPGPQ2210402
ProdDB ID  644afd…f373ff
LocalDB ID 65f0e4cfbb920b0035f6604b
Component Type MODULE_PCB
Parents 20UPGM23210402 
Children No match.
Flags

 Properties

Item Value
PCB Manufacturer NCAB
PCB design version readonly 2
PCB vendor technology readonly 2
SMD population vendor Garner Osborne Circuits
PCB BOM version 12

 Comments


Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_RECEPTION_MODULE_SITE)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed True
Date 11 months ago
component ObjectId 65f0e4cfbb920b0035f6604b
Stage PCB_RECEPTION_MODULE_SITE
Test Type VISUAL_INSPECTION
Institute ObjectId
User Name JedrzejBukowski
ObjectId of this record 677fadc63ffb922b17e18b0c
ObjectId of RAW record None
Tags No tags

Results

Key Data
ANALYSIS_VERSION mqat vNone
INSTRUMENT Epson V850
OPERATOR Andy Bukowski
COMPONENT_MISALIGNMENT_GRADE 1
DATA_CONNECTOR_ASSEMBLY_GRADE 1
HV_LV_CONNECTOR_ASSEMBLY_GRADE 1
OBSERVATION No major issues detected. Some contamination on the bottom right bond pads.
OPENS_TOMBSTONING_GRADE 1
OVERALL_GRADE 2
PARTICULATE_CONTAMINATION_GRADE 2
SCRATCHES_GRADE 1
SHORTS_OR_CLOSE_PROXIMITY_GRADE 1
SOLDERMASK_IRREGULARITIES_GRADE 1
SOLDER_SPILLS_GRADE 1
TRACES_GRADE 1
WATERMARKS_GRADE 1
WIREBOND_PADS_CONTAMINATION_GRADE 2

ProductionDB Record

id677fadc63ffb922b17e18b0c
stateready
stateTs2025-01-09T11:06:46.458Z
stateUserIdentity7075-9969-1
date2025-01-09T10:39:00.000Z
testType
id5f644fba928ccc000ad1215f
codeVISUAL_INSPECTION
nameVisual Inspection
stateactive
institution
id59f1f092df054600056d35b2
codeLIV
nameUniversity of Liverpool
user
id65ba4dcc2808ba00428b8189
userIdentity7075-9969-1
firstNameJedrzej
middleName
lastNameBukowski
runNumber1
passedTrue
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis versionstringsingleFalseNoneNoneNone
INSTRUMENTInstrumentstringsingleFalseEpson V850NoneNone
OPERATOROperatorstringsingleFalseAndy BukowskiNoneNone
results
  • codeCOMPONENT_MISALIGNMENT_GRADE
    nameComponent misalignment (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeDATA_CONNECTOR_ASSEMBLY_GRADE
    nameData connector assembly issue (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeHV_LV_CONNECTOR_ASSEMBLY_GRADE
    nameHV LV connector assembly issue (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeOBSERVATION
    nameObservation
    dataTypestring
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    valueNo major issues detected. Some contamination on the bottom right bond pads.
    associateChildNone
  • codeOPENS_TOMBSTONING_GRADE
    nameOpens or tombstoning, where one end of the component lifts from a pad of the PCB during the soldering process, (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value1
    associateChildNone
  • codeOVERALL_GRADE
    nameOverall grade (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2
    associateChildNone
  • codePARTICULATE_CONTAMINATION_GRADE
    nameParticulate contamination on the PCB including pick-up points (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2
    associateChildNone
  • codeSCRATCHES_GRADE
    nameScratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeSHORTS_OR_CLOSE_PROXIMITY_GRADE
    nameShorts/close proximity of components due to misalignment (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeSOLDERMASK_IRREGULARITIES_GRADE
    nameSoldermask irregularity/cracks grade (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeSOLDER_SPILLS_GRADE
    nameSolder spills as part of assembly process on wirebonding pads (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeTRACES_GRADE
    nameIssues seen on traces like spurious copper, spur, mousebit, pin hole, short, breakout etc. that reduce/cut the copper traces width (grade 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    rangeMinNone
    rangeMaxNone
    value1
    associateChildNone
  • codeWATERMARKS_GRADE
    nameWatermarks on the PCB (scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1
    associateChildNone
  • codeWIREBOND_PADS_CONTAMINATION_GRADE
    nameWirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)
    dataTypeinteger
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2
    associateChildNone
cts2025-01-09T11:06:46.470Z
sys
cts2025-01-09T11:06:46.470Z
mts2025-01-09T11:06:46.470Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
65f0e4cfbb920b0035f6604b644afda464f2ffc72eff5b69d7f373ffready2024-03-12T23:27:11.244Z2355-570-1FalseFalseNoneNoneFalseNoneNone20UPGPQ2210402None
codeP
namePixels
codePG
namePixel general
codePCB
nameModule PCB
codeQUAD_PCB
nameQuad PCB
  • codePCB_MANUFACTURER
    namePCB Manufacturer
    dataTypestring
    requiredTrue
    defaultFalse
    valueNCAB
  • codePCB_DESIGN_VERSION
    namePCB design version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valuePreproduction OS
    codeTable
    codevalue
    0RD53A
    1Prototype
    2Preproduction OS
    3Preproduction IS
    4Production OS
    5Production IS
    9No chip
  • codePCB_VENDOR_TECHNOLOGY
    namePCB vendor technology
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueNCAB (100 mum trace)
    codeTable
    codevalue
    1EPEC (100 mum trace)
    2NCAB (100 mum trace)
    3ALTAFLEX (75 mum trace)
    4SFCircuits (100 mum trace)
    5PHOENIX (100 mum trae)
    6Yamashita Material (75 mum trace)
    7NCAB (75 mum trace)
    8Tecnomec (100 mum trace)
  • codeSMD_POPULATION_VENDOR
    nameSMD population vendor
    dataTypestring
    requiredFalse
    defaultFalse
    valueGarner Osborne Circuits
  • codePCB_BOM_VERSION
    namePCB BOM version
    dataTypecodeTable
    requiredFalse
    defaultFalse
    valueV1.1 L2
    codeTable
    codevalue
    10V1.1 L0
    11V1.1 L1
    12V1.1 L2
    20V2 L0
    21V2 L1
    22V2 L2
codePCB_RECEPTION_MODULE_SITE
namePCB Reception at module site
order12
initialFalse
finalFalse
codeEDI
nameUniversity of Edinburgh

 Current Stage: Post-Parylene Cold

Past QC Stages and Results

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test Local Result ProdDB Record
Mass
(MASS)		 Registered Registered
Metrology
(METROLOGY)		 Registered Registered
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)		 No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 Registered Registered

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 No result N/A
LV and HV Test
(HV_LV_TEST)		 Registered Registered
Tab cutting and gross defect inspection
(QUICK_TAB_CUTTING_INSPECTION)		 No result N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test Local Result ProdDB Record
LV and HV Test
(HV_LV_TEST)		 No result N/A
Metrology
(METROLOGY)		 No result N/A
NTC Verification
(NTC_VERIFICATION)		 No result N/A
Signal Transmission
(SIGNAL_TRANSMISSION)		 No result N/A
SLDO and precision resistors
(SLDO_RESISTORS)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Wirebond pull test
(WIREBOND_PULL_TEST)		 No result N/A

Population (PCB_POPULATION)

Test Local Result ProdDB Record
Component Position Check
(COMPONENT_POSITION_CHECK)		 Registered Registered
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test Local Result ProdDB Record
Dowel Tolerance Check
(DOWEL_TOLERANCE_CHECK)		 Registered Registered
Image capture test
(IMAGE_CAPTURE_TEST)		 No result N/A
Layer thickness measurement
(LAYER_THICKNESS)		 No result N/A
Metrology
(METROLOGY)		 Registered Registered
Metrology Triplet Linear
(TRIPLET_PCB_LINEAR_METROLOGY)		 No result N/A
Metrology Triplet Ring
(TRIPLET_PCB_RING_METROLOGY)		 No result N/A
Via resistance
(VIA_RESISTANCE)		 No result N/A
Visual Inspection
(VISUAL_INSPECTION)		 No result N/A

Bare PCB Initial (PCB_INIT)

LocalDB Test ID Stage Test Name Inspector Measurement Date Analysis Date Tags QC Registration
678017…21c87b PCB_RECEPTION_MODULE_SITE METROLOGY JedrzejBukowski N/A 11 months ago No tags Selected
677fad…e18b0c PCB_RECEPTION_MODULE_SITE VISUAL_INSPECTION JedrzejBukowski N/A 11 months ago No tags Selected
677eaf…db7e0a PCB_RECEPTION_MODULE_SITE MASS JedrzejBukowski N/A 11 months ago No tags Selected
66794f…f3e075 PCB_QC HV_LV_TEST FuatUstuner N/A a year ago No tags Selected
6655c2…495338 PCB_POPULATION COMPONENT_POSITION_CHECK SnehaAmogh Naik N/A a year ago No tags Selected
6655bf…494d1c PCB_RECEPTION METROLOGY SnehaAmogh Naik N/A a year ago No tags
6650c5…407083 PCB_RECEPTION METROLOGY SnehaAmogh Naik N/A a year ago No tags Selected
6650c3…3777e3 PCB_RECEPTION DOWEL_TOLERANCE_CHECK SnehaAmogh Naik N/A a year ago No tags Selected
Stage Tests
PCB_INIT
PCB_RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Metrology  (METROLOGY)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Layer thickness measurement  (LAYER_THICKNESS)
  • Image capture test  (IMAGE_CAPTURE_TEST)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Component Position Check  (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE
  • NTC Verification  (NTC_VERIFICATION)
  • Via resistance  (VIA_RESISTANCE)
  • LV and HV Test  (HV_LV_TEST)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
  • Metrology  (METROLOGY)
  • SLDO and precision resistors   (SLDO_RESISTORS)
  • NTC Verification  (NTC_VERIFICATION)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • LV and HV Test  (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE
  • Signal Transmission  (SIGNAL_TRANSMISSION)
  • Via resistance  (VIA_RESISTANCE)
PCB_QC
  • LV and HV Test  (HV_LV_TEST)
  • Dowel Tolerance Check  (DOWEL_TOLERANCE_CHECK)
  • Tab cutting and gross defect inspection  (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE
  • Visual Inspection  (VISUAL_INSPECTION)
  • Mass  (MASS)
  • Metrology  (METROLOGY)
  • Metrology Triplet Linear  (TRIPLET_PCB_LINEAR_METROLOGY)
  • Metrology Triplet Ring  (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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