Database for ITk Pixel Module

Item	Value
Serial Number	20UPGM22110265
Production DB Component ID	6b689640f585a0e53dcef73bf0e52ca0
LocalDB Component ID	6584597c13093c0042d7e356
Component Type	module
Super-Component	No match.
Sub-Components	• 20UPGB42000083 Bare Module • 20UPGPQ2110265 PCB • 20UPGFC0086212 FE Chip • 20UPGFC0086215 FE Chip • 20UPGFC0086214 FE Chip • 20UPGFC0086231 FE Chip • 20UPGB42000083 Bare Module • 20UPGPQ2110265 PCB • 20UPGFC0086212 FE Chip • 20UPGFC0086215 FE Chip • 20UPGFC0086214 FE Chip • 20UPGFC0086231 FE Chip
Flags

Key	Data
QC Passed	True
Date	2024-04-10 01:36:27 PDT(-0700)
component ObjectId	6584597c13093c0042d7e356
Stage	MODULE/WIREBONDING
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	ClaudiaGemme
ObjectId of this record	66164f3dbcf2c00035441b37
ObjectId of RAW record	None

Key	Data
ANALYSIS_VERSION	mqat vNone
DEFECTS	[]
FE_CHIP_CONDITION_PASSED_QC	N/A
GLUE_DISTRIBUTION_PASSED_QC	N/A
OBSERVATION	Pictures
PARYLENE_COATING_PASSED_QC	N/A
SENSOR_CONDITION_PASSED_QC	N/A
SMD_COMPONENTS_PASSED_QC	N/A
WIREBONDING_PASSED_QC	N/A

Expand ProductionDB Record

66164f3dbcf2c00035441b37

state

ready

stateTs

2024-04-10T08:35:09.446Z

stateUserIdentity

23-9871-1

date

2024-04-09T08:34:00.000Z

testType

id	6418292ae43ca10038f30f84
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d41d52cf6e07b000a559ada
code	INFN_GENOA
name	INFN Genoa

user

id	5c8252a9072e020009ba96df
userIdentity	23-9871-1
firstName	Claudia
middleName	None
lastName	Gemme

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

rangeMin

None

rangeMax

None

value

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code	FE_CHIP_CONDITION_PASSED_QC
name	FE chip condition passed QC (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code	GLUE_DISTRIBUTION_PASSED_QC
name	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code OBSERVATION
name Observation
order 8
dataType string
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value Pictures
associateChild None

code	PARYLENE_COATING_PASSED_QC
name	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code	SENSOR_CONDITION_PASSED_QC
name	Sensor condition passed QC (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code SMD_COMPONENTS_PASSED_QC
name SMD components passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional None
rangeMin None
rangeMax None
value None
associateChild None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

cts

2024-04-10T08:35:09.446Z

sys

cts	2024-04-10T08:35:09.446Z
mts	2024-04-10T08:36:27.230Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

url

filename

user

50df6be692af38e2fd8fc270b8862e95

2024-04-10T08:36:27.230Z

a testRun image attachment

from webApp 2024-04-10T08:36Z

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/5/0/d/50df6be692af38e2fd8fc270b8862e95?authz=zteos64:MDAwMDAyOWJ4nOPazsTFWCTwZOr1zWxSrJkl2QUpSkxVBRqMRsb6qfnF-oklOYlQMjm1KC-9KL-0ICWzOFs_JbVEF6hcv6AoP0U3JUnfVN9AP8VLxczUNMXQMM1E1ygtLUXX0DA1TdfCKDFFN9EkKc3A0NzSNMXIMugwY7RbUaaCV2megpGhgpGBlbGFlYEJkGFkEqtQmpliZWhiaGZhGA12TqxCOkjE2MA8uqogVqEkMyU1r8SqKD-_RM_QxNzI1NzEytzQxMgh2soqDQisTA31DA3N9Cwt9AwNYhXyEnNTrcDmKKTkWSkAXVtilV2UZKqQWFBgpZCRX1xihV1jSn5uYmaeFZJIemq-lYGpobFCcWkKkCWkMOlYMt-i8xEnblqEaKeyPAx99feXffNRdTf_TdE8HQLs8lKjYUtm2CpcnjdbGABlsc1w

50df6be692af38e2fd8fc270b8862e95

id	5c8252a9072e020009ba96df
userIdentity	23-9871-1
firstName	Claudia
middleName	None
lastName	Gemme

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6584597c13093c0042d7e356

6b689640f585a0e53dcef73bf0e52ca0

ready

2023-12-21T15:27:56.046Z

7608-2618-1

False

None

False

None

20UPGM22110265

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	INFN_GENOA
name	INFN Genoa

Current Stage: Initial Cold

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun! TestRun is missing in LocalDB.
IV measurement (IV_MEASURE)	No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

LocalDB Object ID	TestRun Code	QC Passed	Inspector	Date	Analysis Version	QC Registration
66164f3dbcf2c00035441b37	VISUAL_INSPECTION	Passed	ClaudiaGemme	2024-04-10 01:36:27 PDT(-0700)	None	Selected
660d67ceec873d0035449810	WIREBOND_PULL_TEST	Passed	MarioJose	2024-04-03 07:29:34 PDT(-0700)	None	Selected

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
IV measurement (IV_MEASURE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Wirebond pull test (WIREBOND_PULL_TEST)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Wirebonding Information (WIREBONDING)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Mass Measurement (MASS_MEASUREMENT)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology (TRIPLET_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
6626417f1bcd99b2d5375ef4	MODULE/INITIAL_WARM	E_SUMMARY	SimoneRavera	2024-05-21 08:33:27 PDT(-0700)	Selected
66265be75e538000343fa818	MODULE/ASSEMBLY	VISUAL_INSPECTION	MarioJose	2024-04-22 05:48:02 PDT(-0700)	Selected
66164f3dbcf2c00035441b37	MODULE/WIREBONDING	VISUAL_INSPECTION	ClaudiaGemme	2024-04-10 01:36:27 PDT(-0700)	Selected
66164e7e64ba440035c78767	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	MarioJose	2024-04-10 01:31:58 PDT(-0700)	Selected
660e8fd82fc9f200350db302	MODULE/ASSEMBLY	MASS_MEASUREMENT	MarioJose	2024-04-04 04:32:40 PDT(-0700)	Selected
660d67ceec873d0035449810	MODULE/WIREBONDING	WIREBOND_PULL_TEST	MarioJose	2024-04-03 07:29:34 PDT(-0700)	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22110265
Outer-Quad-Module/ITkPix_v1.1

ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

Item	Data Type	Value
FE chip version	codeTable	2
PCB-Bare Orientation isNormal	boolean	True
Wirebond protection roof presence	boolean	None
IREF Trim Bit FE1	integer	None
IREF Trim Bit FE2	integer	None
IREF Trim Bit FE3	integer	None
IREF Trim Bit FE4	integer	None

20UPGM22110265 Outer-Quad-Module/ITkPix_v1.1 ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

20UPGM22110265
Outer-Quad-Module/ITkPix_v1.1

ITkPD Component Page Jump to ITkPD component page