Database for ITk Pixel Module

Serial Number	20UPGM22110265
ProdDB ID	6b6896…e52ca0
LocalDB ID	6584597c13093c0042d7e356
Component Type	MODULE
Parents	No match.
Children	20UPGB42000083 Bare Module 20UPGPQ2110265 PCB 20UPGFC0086212 FE Chip 20UPGFC0086215 FE Chip 20UPGFC0086214 FE Chip 20UPGFC0086231 FE Chip 20UPGB42000083 Bare Module 20UPGPQ2110265 PCB 20UPGFC0086212 FE Chip 20UPGFC0086215 FE Chip 20UPGFC0086214 FE Chip 20UPGFC0086231 FE Chip
Flags

Item	Value
FE chip version	2
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
IREF Trim Bit FE1 deleted	None
IREF Trim Bit FE2 deleted	None
IREF Trim Bit FE3 deleted	None
IREF Trim Bit FE4 deleted	None

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	6584597c13093c0042d7e356
Stage	MODULE/WIREBONDING
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	ClaudiaGemme
ObjectId of this record	66164f3dbcf2c00035441b37
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat vNone
DEFECTS	[]
FE_CHIP_CONDITION_PASSED_QC	N/A
GLUE_DISTRIBUTION_PASSED_QC	N/A
OBSERVATION	Pictures
PARYLENE_COATING_PASSED_QC	N/A
SENSOR_CONDITION_PASSED_QC	N/A
SMD_COMPONENTS_PASSED_QC	N/A
WIREBONDING_PASSED_QC	N/A

Expand ProductionDB Record

66164f3dbcf2c00035441b37

state

ready

stateTs

2024-04-10T08:35:09.446Z

stateUserIdentity

23-9871-1

date

2024-04-09T08:34:00.000Z

testType

id	6418292ae43ca10038f30f84
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d41d52cf6e07b000a559ada
code	INFN_GENOA
name	INFN Genoa

user

id	5c8252a9072e020009ba96df
userIdentity	23-9871-1
firstName	Claudia
middleName	None
lastName	Gemme

runNumber

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

rangeMin

None

rangeMax

None

value

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code	FE_CHIP_CONDITION_PASSED_QC
name	FE chip condition passed QC (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code	GLUE_DISTRIBUTION_PASSED_QC
name	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code OBSERVATION
name Observation
order 8
dataType string
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value Pictures
associateChild None

code	PARYLENE_COATING_PASSED_QC
name	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code	SENSOR_CONDITION_PASSED_QC
name	Sensor condition passed QC (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

code SMD_COMPONENTS_PASSED_QC
name SMD components passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional None
rangeMin None
rangeMax None
value None
associateChild None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	None
rangeMin	None
rangeMax	None
value	None
associateChild	None

cts

2024-04-10T08:35:09.446Z

sys

cts	2024-04-10T08:35:09.446Z
mts	2024-04-10T08:36:27.230Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

url

filename

user

50df6be692af38e2fd8fc270b8862e95

2024-04-10T08:36:27.230Z

a testRun image attachment

from webApp 2024-04-10T08:36Z

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/5/0/d/50df6be692af38e2fd8fc270b8862e95?authz=zteos64:MDAwMDAyOWJ4nOPazsTFWCTwZOr1zWxSrJkl2QUpSkxVBRqMRsb6qfnF-oklOYlQMjm1KC-9KL-0ICWzOFs_JbVEF6hcv6AoP0U3JUnfVN9AP8VLxczUNMXQMM1E1ygtLUXX0DA1TdfCKDFFN9EkKc3A0NzSNMXIMugwY7RbUaaCV2megpGhgpGBlbGFlYEJkGFkEqtQmpliZWhiaGZhGA12TqxCOkjE2MA8uqogVqEkMyU1r8SqKD-_RM_QxNzI1NzEytzQxMgh2soqDQisTA31DA3N9Cwt9AwNYhXyEnNTrcDmKKTkWSkAXVtilV2UZKqQWFBgpZCRX1xihV1jSn5uYmaeFZJIemq-lYGpobFCcWkKkCWkMOlYMt-i8xEnblqEaKeyPAx99feXffNRdTf_TdE8HQLs8lKjYUtm2CpcnjdbGABlsc1w

50df6be692af38e2fd8fc270b8862e95

id	5c8252a9072e020009ba96df
userIdentity	23-9871-1
firstName	Claudia
middleName	None
lastName	Gemme

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6584597c13093c0042d7e356

6b689640f585a0e53dcef73bf0e52ca0

ready

2023-12-21T15:27:56.046Z

7608-2618-1

False

None

False

None

20UPGM22110265

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	INFN_GENOA
name	INFN Genoa

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
66164f…441b37	VISUAL_INSPECTION	Pass	ClaudiaGemme	N/A	a year ago	None	No tags	Selected
660d67…449810	WIREBOND_PULL_TEST	Pass	MarioJose	N/A	a year ago	None	No tags	Selected

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	No result	N/A

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	No result	N/A

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
662641…375ef4	MODULE/INITIAL_WARM	E_SUMMARY	SimoneRavera	N/A	a year ago	No tags	Selected
66265b…3fa818	MODULE/ASSEMBLY	VISUAL_INSPECTION	MarioJose	N/A	a year ago	No tags	Selected
66164f…441b37	MODULE/WIREBONDING	VISUAL_INSPECTION	ClaudiaGemme	N/A	a year ago	No tags	Selected
66164e…c78767	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	MarioJose	N/A	a year ago	No tags	Selected
660e8f…0db302	MODULE/ASSEMBLY	MASS_MEASUREMENT	MarioJose	N/A	a year ago	No tags	Selected
660d67…449810	MODULE/WIREBONDING	WIREBOND_PULL_TEST	MarioJose	N/A	a year ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22110265

MODULE/INITIAL_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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