Database for ITk Pixel Module

Serial Number	20UPGM22110303
ProdDB ID	d230ed…cd7214
LocalDB ID	655f30d65f9f8800384e8035
Component Type	MODULE
Parents	No match.
Children	20UPGB42200012 Bare Module 20UPGFC0096418 FE Chip 20UPGFC0096307 FE Chip 20UPGFC0096339 FE Chip 20UPGFC0096323 FE Chip 20UPGPQ2110303 PCB
Flags

Item	Value
PCB-Bare Orientation isNormal	True
FE chip version	2
Wirebond protection roof presence	False
IREF Trim Bit FE1 deleted	None
IREF Trim Bit FE2 deleted	None
IREF Trim Bit FE3 deleted	None
IREF Trim Bit FE4 deleted	None

Key	Data
component id	655f30d65f9f8800384e8035
Stage	MODULE/WIREBONDING
test Type	WIREBOND_PULL_TEST
institute	64657cef8d79bac1f3f00584
user	FrancescoCrescioli

Key	Data
properties	{'ANALYSIS_VERSION': '1.0.11', 'INSTRUMENT': 'Bondtech', 'OPERATOR': 'Pascal Corona'} g
BOND_PEEL	0 g
HEEL_BREAKS_ON_FE_CHIP	0 g
HEEL_BREAKS_ON_PCB	100 g
PULL_STRENGTH	7.798 g
PULL_STRENGTH_ERROR	1.8580802518250448 g
PULL_STRENGTH_GRADING	<span class="badge badge-warning">N/A</span> g
PULL_STRENGTH_MAX	9.39 g
PULL_STRENGTH_MIN	4.46 g
WIRE_BREAKS_5G	1 g
WIRE_PULLS	10 g

Expand ProductionDB Record

65b22605d5a3cd0042d67a77

state

ready

stateTs

2024-01-25T09:12:37.778Z

stateUserIdentity

9086-39-1

date

2024-01-09T13:42:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5d42fb891fd678000a409866
code	LPNHE
name	Laboratoire de Physique Nucléaire et de Hautes Energies

user

id	5e98594f8bc0cb000ba8d3a8
userIdentity	9086-39-1
firstName	Francesco
middleName
lastName	Crescioli

runNumber

659d4d2fa94269cc065c73ea

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.11	None	None
INSTRUMENT	Instrument	string	single	False	Bondtech	None	None
OPERATOR	Operator	string	single	False	Pascal Corona	None	None

results

code BOND_PEEL
name Percentage of bond peel on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 100
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 7.798
associateChild None
code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 1.8580802518250448
associateChild None
code PULL_STRENGTH_GRADING
name Pull strength grade data array
order 1
dataType float
valueType array
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.39
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 4.46
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 1
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 10
associateChild None

cts

2024-01-25T09:12:37.778Z

sys

cts	2024-01-25T09:12:37.778Z
mts	2024-01-25T09:12:37.914Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

filename

user

b4984b7be2df1648482929a82006be33

2024-01-25T09:12:37.904Z

RAW

text/plain

file

20UPGM22110303_MODULE__WIREBONDING_WIREBOND_PULL_TEST_65b22605d5a3cd0042d67a77_659d4d2ea94269cc065c73e9.json

id	5e98594f8bc0cb000ba8d3a8
userIdentity	9086-39-1
firstName	Francesco
middleName
lastName	Crescioli

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

655f30d65f9f8800384e8035

d230ed85b2bc18a9eb693303cdcd7214

ready

2023-11-23T11:00:38.582Z

9086-39-1

False

None

False

None

20UPGM22110303

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code IREFTRIM_FE1
name IREF Trim Bit FE1
dataType integer
required False
default False
value None
code IREFTRIM_FE2
name IREF Trim Bit FE2
dataType integer
required False
default False
value None
code IREFTRIM_FE3
name IREF Trim Bit FE3
dataType integer
required False
default False
value None
code IREFTRIM_FE4
name IREF Trim Bit FE4
dataType integer
required False
default False
value None

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	LPNHE
name	Laboratoire de Physique Nucléaire et de Hautes Energies

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	TestRun Present
IV measurement (IV_MEASURE)	TestRun Present

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
65aa5b…41daa5	VISUAL_INSPECTION	Pass	FrancescoCrescioli	N/A	a year ago	1.0.11	No tags	Selected
659d4d…5c73ea	WIREBOND_PULL_TEST	Pass	FrancescoCrescioli	N/A	a year ago	1.0.11	No tags	Selected
659fb9…3a44ec	WIREBONDING	Pass	FrancescoCrescioli	N/A	a year ago		No tags	Selected

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65b127…211f0b	MODULE/INITIAL_COLD	IV_MEASURE	FrancescoCrescioli	N/A	a year ago	No tags	Selected
65b127…211f0c	MODULE/INITIAL_COLD	E_SUMMARY	FrancescoCrescioli	N/A	a year ago	No tags	Selected
65b116…1dacaf	MODULE/INITIAL_WARM	IV_MEASURE	FrancescoCrescioli	N/A	a year ago	No tags	Selected
65aa68…183ca8	MODULE/INITIAL_WARM	E_SUMMARY	FrancescoCrescioli	N/A	a year ago	No tags	Selected
65aa5b…41daa5	MODULE/WIREBONDING	VISUAL_INSPECTION	FrancescoCrescioli	N/A	a year ago	No tags	Selected
659d4d…5c73ea	MODULE/WIREBONDING	WIREBOND_PULL_TEST	FrancescoCrescioli	N/A	a year ago	No tags	Selected
659fb9…3a44ec	MODULE/WIREBONDING	WIREBONDING	FrancescoCrescioli	N/A	a year ago	No tags	Selected
65b10f…1daca6	MODULE/ASSEMBLY	VISUAL_INSPECTION	FrancescoCrescioli	N/A	a year ago	No tags	Selected
6560bb…67e439	MODULE/ASSEMBLY	MASS_MEASUREMENT	FrancescoCrescioli	N/A	a year ago	No tags	Selected
657307…534109	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	FrancescoCrescioli	N/A	2 years ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22110303

MODULE/INITIAL_COLD

Component Information

Distribution of chips on wafer

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Result of Wirebond Pull Test

Scan

Result

RAW Results Record

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

Back to top page of this component

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered