Database for ITk Pixel Module

Item	Value
Serial Number	20UPGM22110303
Production DB Component ID	d230ed85b2bc18a9eb693303cdcd7214
LocalDB Component ID	655f30d65f9f8800384e8035
Component Type	module
Super-Component	No match.
Sub-Components	• 20UPGB42200012 Bare Module • 20UPGFC0096418 FE Chip • 20UPGFC0096307 FE Chip • 20UPGFC0096339 FE Chip • 20UPGFC0096323 FE Chip • 20UPGPQ2110303 PCB
Flags

Key	Data
QC Passed	True
Date	2024-01-25 01:12:37 PST(-0800)
component ObjectId	655f30d65f9f8800384e8035
Stage	MODULE/WIREBONDING
Test Type	WIREBOND_PULL_TEST
Institute ObjectId
User Name	FrancescoCrescioli
ObjectId of this record	659d4d2fa94269cc065c73ea
ObjectId of RAW record	659d4d2ea94269cc065c73e9

Key	Data
ANALYSIS_VERSION	mqat v1.0.11
INSTRUMENT	Bondtech
OPERATOR	Pascal Corona
BOND_PEEL	0
HEEL_BREAKS_ON_FE_CHIP	0
HEEL_BREAKS_ON_PCB	100
PULL_STRENGTH	7.798
PULL_STRENGTH_ERROR	1.8580802518250448
PULL_STRENGTH_GRADING	N/A
PULL_STRENGTH_MAX	9.39
PULL_STRENGTH_MIN	4.46
WIRE_BREAKS_5G	1
WIRE_PULLS	10

Expand ProductionDB Record

65b22605d5a3cd0042d67a77

state

ready

stateTs

2024-01-25T09:12:37.778Z

stateUserIdentity

9086-39-1

date

2024-01-09T13:42:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	5d42fb891fd678000a409866
code	LPNHE
name	Laboratoire de Physique Nucléaire et de Hautes Energies

user

id	5e98594f8bc0cb000ba8d3a8
userIdentity	9086-39-1
firstName	Francesco
middleName
lastName	Crescioli

runNumber

659d4d2fa94269cc065c73ea

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.11	None	None
INSTRUMENT	Instrument	string	single	False	Bondtech	None	None
OPERATOR	Operator	string	single	False	Pascal Corona	None	None

results

code BOND_PEEL
name Percentage of bond peel on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 100
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 7.798
associateChild None
code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 1.8580802518250448
associateChild None
code PULL_STRENGTH_GRADING
name Pull strength grade data array
order 1
dataType float
valueType array
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.39
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 4.46
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 1
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 10
associateChild None

cts

2024-01-25T09:12:37.778Z

sys

cts	2024-01-25T09:12:37.778Z
mts	2024-01-25T09:12:37.914Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

filename

user

b4984b7be2df1648482929a82006be33

2024-01-25T09:12:37.904Z

RAW

text/plain

file

20UPGM22110303_MODULE__WIREBONDING_WIREBOND_PULL_TEST_65b22605d5a3cd0042d67a77_659d4d2ea94269cc065c73e9.json

id	5e98594f8bc0cb000ba8d3a8
userIdentity	9086-39-1
firstName	Francesco
middleName
lastName	Crescioli

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

655f30d65f9f8800384e8035

d230ed85b2bc18a9eb693303cdcd7214

ready

2023-11-23T11:00:38.582Z

9086-39-1

False

None

False

None

20UPGM22110303

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True
code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ROOF
name Wirebond protection roof presence
dataType boolean
required False
default False
value False
code IREFTRIM_FE1
name IREF Trim Bit FE1
dataType integer
required False
default False
value None
code IREFTRIM_FE2
name IREF Trim Bit FE2
dataType integer
required False
default False
value None
code IREFTRIM_FE3
name IREF Trim Bit FE3
dataType integer
required False
default False
value None
code IREFTRIM_FE4
name IREF Trim Bit FE4
dataType integer
required False
default False
value None

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	LPNHE
name	Laboratoire de Physique Nucléaire et de Hautes Energies

Current Stage: Initial Cold

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	TestRun Present At least one candidate TestRun is registered in LocalDB.
IV measurement (IV_MEASURE)	TestRun Present At least one candidate TestRun is registered in LocalDB.

LocalDB Object ID	TestRun Code	QC Passed	Inspector	Date	Analysis Version	QC Registration
65aa5b13d6eb45062b41daa5	VISUAL_INSPECTION	Passed	FrancescoCrescioli	2024-01-25 01:12:47 PST(-0800)	1.0.11	Selected
659d4d2fa94269cc065c73ea	WIREBOND_PULL_TEST	Passed	FrancescoCrescioli	2024-01-25 01:12:37 PST(-0800)	1.0.11	Selected
659fb9849ad3a38c8b3a44ec	WIREBONDING	Passed	FrancescoCrescioli	2024-01-25 01:12:36 PST(-0800)		Selected

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
IV measurement (IV_MEASURE)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Wirebond pull test (WIREBOND_PULL_TEST)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Wirebonding Information (WIREBONDING)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Mass Measurement (MASS_MEASUREMENT)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology (TRIPLET_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
65b127011f83430075211f0b	MODULE/INITIAL_COLD	IV_MEASURE	FrancescoCrescioli	2024-02-19 05:09:50 PST(-0800)	Selected
65b127581f83430075211f0c	MODULE/INITIAL_COLD	E_SUMMARY	FrancescoCrescioli	2024-02-19 05:09:47 PST(-0800)	Selected
65b1163fda3bf6f8131dacaf	MODULE/INITIAL_WARM	IV_MEASURE	FrancescoCrescioli	2024-02-19 05:07:24 PST(-0800)	Selected
65aa684a029762f29a183ca8	MODULE/INITIAL_WARM	E_SUMMARY	FrancescoCrescioli	2024-02-19 05:07:21 PST(-0800)	Selected
65aa5b13d6eb45062b41daa5	MODULE/WIREBONDING	VISUAL_INSPECTION	FrancescoCrescioli	2024-01-25 01:12:47 PST(-0800)	Selected
659d4d2fa94269cc065c73ea	MODULE/WIREBONDING	WIREBOND_PULL_TEST	FrancescoCrescioli	2024-01-25 01:12:37 PST(-0800)	Selected
659fb9849ad3a38c8b3a44ec	MODULE/WIREBONDING	WIREBONDING	FrancescoCrescioli	2024-01-25 01:12:36 PST(-0800)	Selected
65b10f8bda3bf6f8131daca6	MODULE/ASSEMBLY	VISUAL_INSPECTION	FrancescoCrescioli	2024-01-25 01:12:31 PST(-0800)	Selected
6560bb2fe7aee5003867e439	MODULE/ASSEMBLY	MASS_MEASUREMENT	FrancescoCrescioli	2024-01-25 01:11:54 PST(-0800)	Selected
657307db822c6e0042534109	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	FrancescoCrescioli	2023-12-08 04:11:07 PST(-0800)	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22110303
Outer-Quad-Module/ITkPix_v1.1

ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

Item	Data Type	Value
PCB-Bare Orientation isNormal	boolean	True
FE chip version	codeTable	2
Wirebond protection roof presence	boolean	False
IREF Trim Bit FE1	integer	None
IREF Trim Bit FE2	integer	None
IREF Trim Bit FE3	integer	None
IREF Trim Bit FE4	integer	None

20UPGM22110303 Outer-Quad-Module/ITkPix_v1.1 ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Initial Cold

Candidate TestRuns of this Stage

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Not signed-off

No tests are allocated for this stage.

Results Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

Results Stage: Wire Bonding (MODULE/WIREBONDING) Complete

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

20UPGM22110303
Outer-Quad-Module/ITkPix_v1.1

ITkPD Component Page Jump to ITkPD component page