20UPGB42200117

MODULE/COMPLETE

Component Information

Serial Number	20UPGB42200117
ProdDB ID	fcca30…04839c
LocalDB ID	650c418d4203f000423f318e
Component Type	BARE_MODULE
Parents	20UPGM22110275
Children	20UPGFC0096040 FE Chip 20UPGFC0096072 FE Chip 20UPGFC0096120 FE Chip 20UPGFC0096104 FE Chip 20UPGS33300742 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Vendor code readonly	2
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	a year ago
component ObjectId	650c418d4203f000423f318e
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	GiacintoPiacquadio
ObjectId of this record	652a98546b662900421d5767
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vNone
DEFECTS	['1', '3', '4', '7', '9', '13']
FE_CHIP_CONDITION_PASSED_QC	3
GLUE_DISTRIBUTION_PASSED_QC	N/A
PARYLENE_COATING_PASSED_QC	N/A
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	N/A
WIREBONDING_PASSED_QC	N/A

ProductionDB Record

Expand ProductionDB Record

652a98546b662900421d5767

state

ready

stateTs

2023-10-14T13:32:04.047Z

stateUserIdentity

2865-6305-1

date

2023-10-14T13:30:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5cafa142bc16510009bd660b
code	MPP
name	Max Planck Institute for Physics

user

id	649a89f4fe92c20042f7c2dc
userIdentity	2865-6305-1
firstName	Giacinto
middleName
lastName	Piacquadio

runNumber

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	None	None	None

results

code

DEFECTS

name

Defect source

dataType

codeTable

valueType

single

arrayDimensions

None

additional

False

value

associateChild

None

codeTable

code	value
0	no defect
1	Sensor systematic rough edge or dicing defect
2	Sensor tooling marks
3	Sensor scratch (random)
4	Sensor dot-like contamination
5	Sensor chipped corner
6	FE chip chipped outer corner
7	FE chip bond pad contamination
8	FE chip irregular dicing
9	FE chip scratch on back side
10	FE chip scratch on top side (pad side)
11	FE chip chipped inner corner
12	FE chip excess material (not diced near FE border)
13	Other defect

code FE_CHIP_CONDITION_PASSED_QC
name FE chip condition passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional False
value 3
associateChild None

code	GLUE_DISTRIBUTION_PASSED_QC
name	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	PARYLENE_COATING_PASSED_QC
name	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code SENSOR_CONDITION_PASSED_QC
name Sensor condition passed QC (1: good, 2: issues, 3: bad)
dataType integer
valueType single
arrayDimensions None
additional False
value 2
associateChild None

code	SMD_COMPONENTS_PASSED_QC
name	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

code	WIREBONDING_PASSED_QC
name	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)
dataType	integer
valueType	single
arrayDimensions	None
additional	False
value	None
associateChild	None

cts

2023-10-14T13:32:04.047Z

sys

cts	2023-10-14T13:32:04.047Z
mts	2024-04-02T13:03:59.675Z
rev	2

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

url

urlCernbox

filename

user

85b457e5054955d0253a89ec607d8b72

2024-04-02T13:03:51.807Z

20UPGB42200117 front

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/8/5/b/85b457e5054955d0253a89ec607d8b72?authz=zteos64:MDAwMDAyOWJ4nO1QMUvDQBilBR06ieDSQQ5xcDDJfUkuvXyDODkILjqWDEnv0oba3JFcEbq5KIiLDg4VOjgLHRw6OAgKjvpvdBKMxcHBydlv-Pi-x3uPx2vM6o1asTS5f54tNhcy09dirT7SGzXXc6Qqndgcxt-7I4u8W6ihFlnZd4Q0VkV3dKGEJRKHO8xJdtf9lHpBCNxqhZ3EApCpFTKeWrGfpBRaIRNuuP9Ua--pnBxITVyPAEefIePEpa4fkWEmEHwIOLTncSLS_UI82mqPdERMJmRusFDK2C71OFAEgCDYbiOm1SADu_rtkNtAI5LHA4lzHyJyJFVag_0iYSTWGklPlQZ_Fwo1iLMcfyBdqZAy8Eg5FNW1TDa3rvFm9Wr6dnz68HrpTl9WxieT27sz3jv_GO8cvTf_u_1jt-Tx4sT7BNJ_zuM%3d

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/8/5/b/85b457e5054955d0253a89ec607d8b72

85b457e5054955d0253a89ec607d8b72

id	64d629ee130e6600422b0eba
userIdentity	7544-6134-1
firstName	Shudhashil
middleName
lastName

c97aaeaa28862f1a7f4e420ca20f42bd

2024-04-02T13:03:59.675Z

20UPGB42200117 back

None

eos

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/c/9/7/c97aaeaa28862f1a7f4e420ca20f42bd?authz=zteos64:MDAwMDAyOWF4nO1QPUvDUBSlBUU7iWNxuIiIiPl4yUuT3EkQHAQXHUOGl7yXGmrzHsmrQymI4Kw_QOhvEASrdOvgb3Dt6ObibiwODk7O3uFwOZxzOJzWY7PVKNfG05fJcnsp1z3FN5tDtdNwXEvIymL6nH1jKsqiW8qB4nnVs7jQRi23VCm5wRMrtULLP9qiGaV-yJnhh2liECIyg3FGDUaTzCZ-6HEnPJk1omNZwKlQ4LhAAqQeegE4tkNjGOQcCSWdgESLOjF0vxjX9qOhikHnXBQaSym16dhuQB2kdfB-hJjVhx4xCemYYWASO4aC9QUuYoAXCHVZjb0y8YAphXAmK42_G7nss7zAH0xXSLQ94kI14PW3DlcX1yP5ME7vphu7B6vDlY-9yfbN5fto-PrkzQ7f7tv_0_5tWridz5-XPgGopc-F

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/c/9/7/c97aaeaa28862f1a7f4e420ca20f42bd

c97aaeaa28862f1a7f4e420ca20f42bd

id	64d629ee130e6600422b0eba
userIdentity	7544-6134-1
firstName	Shudhashil
middleName
lastName

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

650c418d4203f000423f318e

fcca30e5520b86ff45340acc8304839c

ready

2023-09-21T13:13:49.904Z

23-6780-1

False

None

False

None

20UPGB42200117

None

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

IZM

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	IZM
name	Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)

Current Stage: Module Complete

No tests are allocated for this stage.

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
652a98…1d5767	BAREMODULERECEPTION	VISUAL_INSPECTION	GiacintoPiacquadio	N/A	a year ago	No tags	Selected
653147…e07eb5	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	ShudhashilBharthuar	N/A	2 years ago	No tags	Selected
652a99…f3f286	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	GiacintoPiacquadio	N/A	2 years ago	No tags	Selected
65299a…356a66	BAREMODULERECEPTION	MASS_MEASUREMENT	GiacintoPiacquadio	N/A	2 years ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42200117

MODULE/COMPLETE

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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