Database for ITk Pixel Module

Serial Number	20UPGM22601067
ProdDB ID	f0dd42…8ea3a1
LocalDB ID	64ed37e6c96c32004230ef1f
Component Type	MODULE
Parents	No match.
Children	20UPGB42307034 Bare Module 20UPGPQ2601067 PCB 20UPGFC0099706 FE Chip 20UPGFC0099686 FE Chip 20UPGFC0099675 FE Chip 20UPGFC0099668 FE Chip
Flags

Item	Value
FE chip version	2
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
Alternative ID	None
Rank	None
Is preproduction module	None

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	64ed37e6c96c32004230ef1f
Stage	MODULE/ASSEMBLY
Test Type	QUAD_MODULE_METROLOGY
Institute ObjectId
User Name	Shift-LeaderHayashi-REPIC-KEK
ObjectId of this record	673ffcd9243080c1c954e552
ObjectId of RAW record	64ee92d6414654294774ca65
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat v2.2.10.dev5
MEASUREMENT_DATE	2023-08-29T15:52:38.518+00:00
OPERATOR_IDENTITY	None
AVERAGE_THICKNESS	[589.4, 592.7, 594.4, 597.3]
DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT	[2265, 766]
DISTANCE_PCB_BARE_MODULE_TOP_LEFT	[2223, 694]
HV_CAPACITOR_THICKNESS	2258
STD_DEVIATION_THICKNESS	[2000, 2000, 2000, 2000]
THICKNESS_INCLUDING_POWER_CONNECTOR	1925
THICKNESS_VARIATION_PICKUP_AREA	8

Expand ProductionDB Record

674028fe7423cbcf977d374a

state

ready

stateTs

2024-11-22T06:47:26.960Z

stateUserIdentity

9833-9995-1

date

2023-08-30T00:52:00.000Z

testType

id	627a356dba163f000ab63233
code	QUAD_MODULE_METROLOGY
name	Quad Module Metrology
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

runNumber

673ffcd9243080c1c954e552

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	2.2.10.dev5	None	None
MEASUREMENT_DATE	Date measurement performed	datetime	None	False	2023-08-29T15:52:38.518+00:00	None	None
OPERATOR_IDENTITY	Operator identity	string	single	False	None	None	None

results

code AVERAGE_THICKNESS
name Average module thickness at FE chip pick-up areas, 1 per FE [μm]
dataType float
valueType array
arrayDimensions 1
additional False
value
589.4
592.7
594.4
597.3
associateChild None

code	DISTANCE_PCB_BARE_MODULE_BOTTOM_RIGHT
name	Distance of PCB fiducial to bare module fiducial bottom right (x and y) [µm]
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2265 766
associateChild	None

code	DISTANCE_PCB_BARE_MODULE_TOP_LEFT
name	Distance of PCB fiducial to bare module fiducial top left (x and y) [µm]
dataType	float
valueType	array
arrayDimensions	1
additional	False
rangeMin	None
rangeMax	None
value	2223 694
associateChild	None

code HV_CAPACITOR_THICKNESS
name HV capacitor thickness [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 2258
associateChild None

code	STD_DEVIATION_THICKNESS
name	Std deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
dataType	float
valueType	array
arrayDimensions	1
additional	False
value	2000 2000 2000 2000
associateChild	None

code	THICKNESS_INCLUDING_POWER_CONNECTOR
name	Thickness including the black body of power connector (excluding pins) [µm]
dataType	float
valueType	single
arrayDimensions	None
additional	False
value	1925
associateChild	None

code THICKNESS_VARIATION_PICKUP_AREA
name Thickness variation of the 4 pick-up areas [µm]
dataType float
valueType single
arrayDimensions None
additional False
value 8
associateChild None

cts

2024-11-22T06:47:26.960Z

sys

cts	2024-11-22T06:47:26.960Z
mts	2024-11-22T06:47:27.512Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

e37500bf55984cd63919705be0369105

2024-11-22T06:47:27.355Z

RAW

application/json

file

True

20UPGM22601067_MODULE__ASSEMBLY_QUAD_MODULE_METROLOGY_674028fe7423cbcf977d374a_64ee92d6414654294774ca65.json

id	6704b3f3f081870042f075da
userIdentity	9833-9995-1
firstName	Shift-Leader
middleName
lastName	Hayashi-REPIC-KEK

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

64ed37e6c96c32004230ef1f

f0dd42cb70997a03eb37b202e98ea3a1

ready

2023-08-29T00:12:22.218Z

24-779-1

False

None

False

None

20UPGM22601067

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	False
final	False

code	HR
name	Hayashi-Repic Co.

Past QC Stages and Results

Module graveyard - damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Test	Local Result	ProdDB Record
Module ranking (RANKING)	No result	N/A

Final flatness measurement (MODULE/FINAL_METROLOGY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Final Cold (MODULE/FINAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Final Warm (MODULE/FINAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered
Longterm stability DCS (LONG_TERM_STABILITY_DCS)	Registered	Registered

Thermal Cycles (MODULE/THERMAL_CYCLES)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
Flatness (FLATNESS)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered
Thermal Cycling (THERMAL_CYCLING)	Registered	Registered
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A
Wire bonding protection roof envelope (WP_ENVELOPE)	No result	N/A

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
Flatness (FLATNESS)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Coating (MODULE/PARYLENE_COATING)

Test	Local Result	ProdDB Record
Parylene Properties (PARYLENE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Parylene Masking (MODULE/PARYLENE_MASKING)

Test	Local Result	ProdDB Record
Parylene (de-)masking (DE_MASKING)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

Initial Cold (MODULE/INITIAL_COLD)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

Initial Warm (MODULE/INITIAL_WARM)

Test	Local Result	ProdDB Record
Electrical Test (e-test) Module Summary (E_SUMMARY)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

Wire Bonding (MODULE/WIREBONDING)

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Initial state to associate flex to bare module (MODULE/INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
673ffc…54e552	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
671b2b…6c0045	MODULE/FINAL_COLD	IV_MEASURE	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
673cd1…66c404	MODULE/FINAL_COLD	E_SUMMARY	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
6719d8…6bffe7	MODULE/FINAL_WARM	IV_MEASURE	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
673cd1…66c29e	MODULE/FINAL_WARM	E_SUMMARY	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
6719d3…6bffdc	MODULE/LONG_TERM_STABILITY_TEST	LONG_TERM_STABILITY_DCS	Shift-LeaderHayashi-REPIC-KEK	a year ago	a year ago	No tags	Selected
6719b4…6bffc4	MODULE/LONG_TERM_STABILITY_TEST	IV_MEASURE	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
673cd1…66c11c	MODULE/LONG_TERM_STABILITY_TEST	E_SUMMARY	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
6719a0…6bffae	MODULE/THERMAL_CYCLES	IV_MEASURE	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
67199c…6bffa8	MODULE/THERMAL_CYCLES	FLATNESS	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
671709…14715f	MODULE/THERMAL_CYCLES	THERMAL_CYCLING	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
673cd1…66c0f2	MODULE/THERMAL_CYCLES	E_SUMMARY	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
673d7f…f0e700	MODULE/WIREBONDING	WIREBOND_PULL_TEST	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
64eee2…74db3f	MODULE/WIREBONDING	WIREBONDING	Shift-LeaderHayashi-REPIC-KEK	N/A	a year ago	No tags	Selected
66784b…d1d752	MODULE/INITIAL_WARM	IV_MEASURE	HideyukiOide	N/A	a year ago	No tags	Selected
64eee5…74db58	MODULE/WIREBONDING	VISUAL_INSPECTION	HideyukiOide	N/A	a year ago	No tags	Selected
64ee92…74ca61	MODULE/ASSEMBLY	VISUAL_INSPECTION	HideyukiOide	N/A	a year ago	No tags	Selected
64eee1…74db19	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	HideyukiOide	N/A	a year ago	No tags	Selected
64eee0…74db15	MODULE/ASSEMBLY	MASS_MEASUREMENT	HideyukiOide	N/A	a year ago	No tags	Selected
66784b…d1d74d	MODULE/INITIAL_WARM	E_SUMMARY	HideyukiOide	N/A	a year ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22601067

MODULE/COMPLETE

Component Information

Distribution of chips on wafer

Properties

Comments

Test: QUAD_MODULE_METROLOGY QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Module graveyard - damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Module unhappy - failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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