Database for ITk Pixel Module

Serial Number	20UPGS33300780
ProdDB ID	50a062…595aea
LocalDB ID	64b93d270ca4ae004203b645
Component Type	SENSOR_TILE
Parents	20UPGB42900046
Children	No match.
Flags

Item	Value
Main Vendor readonly	3
Sensor Type or Test Structure readonly	3
Version of component	pre-production
Scratch id (to be used if not the same as agreed manufacturer ID)
Alternative Identifier	V4-1-143822-3-005
Original Manufacturer ID	Q5
Depletion Voltage (V)	51.75796428003089
Breakdown Voltage (-999 if no breakdown occurred)	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	64b93d270ca4ae004203b645
Stage	BAREMODULERECEPTION
Test Type	IV_MEASURE
Institute ObjectId
User Name	JennyLunde
ObjectId of this record	655dcbc05f9f88003848bbb0
ObjectId of RAW record	None
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat vwebApp
HUM	47.400000000000006
TEMP	20.700000000000003
BREAKDOWN_VOLTAGE	-999
IV_ARRAY	{'voltage': [0, 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 105, 110, 115, 120, 125, 130, 135, 140, 145, 150, 155, 160, 165, 170, 175, 180, 185, 190, 195, 200], 'current': [0.0008188382, 0.34085276999999997, 0.37596295, 0.39404834000000005, 0.40593202, 0.41381723, 0.4211276, 0.42634373000000003, 0.42954386, 0.43316266999999997, 0.43624702, 0.43881148000000003, 0.44107542, 0.44380492, 0.44595589, 0.44822298, 0.45039502, 0.45253214, 0.45460322, 0.45637973, 0.45767175, 0.4592241, 0.46104254, 0.46263261, 0.46367002, 0.46468348, 0.46638666, 0.46731429, 0.46943717, 0.46979018, 0.47142185000000003, 0.47252689, 0.47395708, 0.47469246, 0.47576261000000003, 0.47727186000000005, 0.47849690999999994, 0.47926191999999995, 0.48088251, 0.48245759000000005, 0.4837885], 'sigma current': [0.00020735375139965785, 0.001129326993341121, 0.0005344210351190978, 0.0003529144535940073, 0.0014006057259470133, 0.0013435524428833247, 0.0010641172564880015, 0.0009516194606505722, 0.0009755808323478051, 0.0012433778884331245, 0.001031202792643404, 0.0009130890814519002, 0.0009486872740792914, 0.000859053238293316, 0.0008233989952899266, 0.000781638948762291, 0.0008389637242853108, 0.0008307721712024509, 0.0013614016239808814, 0.0008261952231632521, 0.0010006070660132035, 0.0009020168709927633, 0.0009570503483795125, 0.0009682870562091732, 0.0008676655138934651, 0.0008576005723982382, 0.0009051969966071827, 0.0009178126200071779, 0.000910799585285122, 0.0009039552235715083, 0.0008184525062579931, 0.0008664378370341583, 0.0008240226922441731, 0.0009205094799439355, 0.0009029749331453642, 0.0008066375520916708, 0.0009543508770654127, 0.0008527854905478245, 0.0008462056112763379, 0.0009501671226684293, 0.0009363609050171115], 'temperature': [20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7, 20.7], 'humidity': [47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4, 47.4]}
LEAK_CURRENT	0.46367002
MAXIMUM_VOLTAGE	200
NO_BREAKDOWN_VOLTAGE_OBSERVED	True

ProductionDB Record

Current Stage: Final Cold

No tests are allocated for this stage.

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
IV measurement (IV_MEASURE)	Registered	Registered

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A

QA at Institutes (QA)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE)	No result	N/A
Inter-pixel resistance (INTER-PIXEL_RESISTANCE)	No result	N/A
IT measurement (IT_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	No result	N/A
IV measurement (IV_MEASURE)	No result	N/A
Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)	No result	N/A
Visual inspection (VISUAL_INSPECTION)	No result	N/A

Sensor Manufacturer (sensor_manufacturer)

Test	Local Result	ProdDB Record
CV measurement (CV_MEASURE)	Registered	Registered
IV measurement (IV_MEASURE)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
655dcb…48bbb0	BAREMODULERECEPTION	IV_MEASURE	JennyLunde	N/A	2 years ago	No tags	Selected
64ba58…b6bed8	sensor_manufacturer	IV_MEASURE	HuaYe	N/A	2 years ago	No tags	Selected
64ba56…37882d	sensor_manufacturer	CV_MEASURE	HuaYe	N/A	2 years ago	No tags	Selected

Stage	Tests
sensor_manufacturer	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE)
WAFER_PROCESSING	Visual inspection (VISUAL_INSPECTION) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY) IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
QA	CV measurement (CV_MEASURE) IV measurement (IV_MEASURE) IT measurement (IT_MEASURE) Inter-pixel capacitance (INTER-PIXEL_CAPACITANCE) Inter-pixel resistance (INTER-PIXEL_RESISTANCE) Sensor Metrology: Sensor bow and thickness (SENSOR_METROLOGY)
POST_IRRAD	IV measurement (IV_MEASURE) CV measurement (CV_MEASURE)
NOT_USED
BAREMODULEASSEMBLY
BAREMODULERECEPTION	IV measurement (IV_MEASURE)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGS33300780

MODULE/FINAL_COLD

Component Information

Properties

Comments

Test: IV_MEASURE QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Final Cold

Past QC Stages and Results

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Bare module reception at ITk institute (BAREMODULERECEPTION)

Bare Module Assembly (BAREMODULEASSEMBLY)

Not to be used for detector (NOT_USED)

Post Irradiation (POST_IRRAD)

QA at Institutes (QA)

Wafer Processing (dicing, UBM, flip-chip) (WAFER_PROCESSING)

Sensor Manufacturer (sensor_manufacturer)

All Registered QC Tests

Check QC Flow

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