Top Page > Component List > 20UPGM22601022 > QC Result / MODULE/ASSEMBLY / QUAD_MODULE_METROLOGY

20UPGM22601022
Outer-Quad-Module/ITkPix_v1.1
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGM22601022
Production DB Component ID f193185e0439e0b0795d0f4b4fef0a81
LocalDB Component ID 6498f97f6a25bf0042ebdd98
Component Type module
Super-Component No match.
Sub-Components •  20UPGB42302001   Bare Module
•  20UPGFC0088388   FE Chip
•  20UPGFC0088424   FE Chip
•  20UPGFC0088361   FE Chip
•  20UPGFC0088503   FE Chip
•  20UPGB42302001   Bare Module
•  20UPGFC0088388   FE Chip
•  20UPGFC0088424   FE Chip
•  20UPGFC0088361   FE Chip
•  20UPGFC0088503   FE Chip
•  20UPGPQ2601022   PCB
Flags

Properties

Item Data Type Value
FE chip version codeTable 2
PCB-Bare Orientation isNormal boolean True
Wirebond protection roof presence boolean None
IREF Trim Bit FE1 integer None
IREF Trim Bit FE2 integer None
IREF Trim Bit FE3 integer None
IREF Trim Bit FE4 integer None

Comments


Test: QUAD_MODULE_METROLOGY QC Failed

(Stage: MODULE/ASSEMBLY)


Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key Data
QC Passed False
Date 2023-10-11 19:09:19 PDT(-0700)
component ObjectId 6498f97f6a25bf0042ebdd98
Stage MODULE/ASSEMBLY
Test Type QUAD_MODULE_METROLOGY
Institute ObjectId
User Name HideyukiOide
ObjectId of this record 65273aafe7ce7938a6bf23d2
ObjectId of RAW record None

Results

Key Data
ANALYSIS_VERSION mqat v1.0.11
PCB_BAREMODULE_POSITION_BOTTOM_LEFT [2.211700000000004, 0.7922000000000011]
PCB_BAREMODULE_POSITION_TOP_RIGHT [2.243199999999998, 0.7303499999999978]
ANGLE_PCB_BM 0
AVERAGE_THICKNESS [0.5719790333112007, 0.574567051229898, 0.5786590490707595, 0.5769633447892671]
STD_DEVIATION_THICKNESS [0.002, 0.002, 0.002, 0.002]
THICKNESS_VARIATION_PICKUP_AREA 0.007
THICKNESS_INCLUDING_POWER_CONNECTOR 1.895
HV_CAPACITOR_THICKNESS 2.293

ProductionDB Record

id6527554fd2e425004232d300
stateready
stateTs2023-10-12T02:09:19.376Z
stateUserIdentity24-6238-1
date2023-10-10T00:15:00.000Z
testType
id627a356dba163f000ab63233
codeQUAD_MODULE_METROLOGY
nameQuad Module Metrology
stateactive
institution
id64229fe1b8fd040036839f29
codeHR
nameHayashi-Repic Co.
user
id5d14d2eb8c0a21000956c8f6
userIdentity24-6238-1
firstNameHideyuki
middleName
lastNameOide
runNumber65273aafe7ce7938a6bf23d2
passedFalse
problemsFalse
properties
codenamedataTypevalueTyperequiredvaluerangeMinrangeMax
ANALYSIS_VERSIONAnalysis VersionstringsingleFalse1.0.11NoneNone
results
  • codePCB_BAREMODULE_POSITION_BOTTOM_LEFT
    namePCB_BAREMODULE_POSITION_BOTTOM_LEFT
    order0
    dataTypeNone
    valueTypeNone
    arrayDimensionsNone
    additionalNone
    rangeMinNone
    rangeMaxNone
    value
    • 2.211700000000004
    • 0.7922000000000011
    associateChildNone
  • codePCB_BAREMODULE_POSITION_TOP_RIGHT
    namePCB_BAREMODULE_POSITION_TOP_RIGHT
    order0
    dataTypeNone
    valueTypeNone
    arrayDimensionsNone
    additionalNone
    rangeMinNone
    rangeMaxNone
    value
    • 2.243199999999998
    • 0.7303499999999978
    associateChildNone
  • codeANGLE_PCB_BM
    nameAngle between PCB and bare module [deg]
    order3
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value0
    associateChildNone
  • codeAVERAGE_THICKNESS
    nameAverage module thickness at FE chip pick-up areas, 1 per FE [μm]
    order4
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    value
    • 0.5719790333112007
    • 0.574567051229898
    • 0.5786590490707595
    • 0.5769633447892671
    associateChildNone
  • codeSTD_DEVIATION_THICKNESS
    nameStd deviation of module thickness at FE chip pick-up area, 1 per FE [μm]
    order5
    dataTypefloat
    valueTypearray
    arrayDimensions1
    additionalFalse
    value
    • 0.002
    • 0.002
    • 0.002
    • 0.002
    associateChildNone
  • codeTHICKNESS_VARIATION_PICKUP_AREA
    nameThickness variation of the 4 pick-up areas [µm]
    order6
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value0.007
    associateChildNone
  • codeTHICKNESS_INCLUDING_POWER_CONNECTOR
    nameThickness including the black body of power connector (excluding pins) [µm]
    order7
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value1.895
    associateChildNone
  • codeHV_CAPACITOR_THICKNESS
    nameHV capacitor thickness [µm]
    order8
    dataTypefloat
    valueTypesingle
    arrayDimensionsNone
    additionalFalse
    value2.293
    associateChildNone
cts2023-10-12T02:09:19.376Z
sys
cts2023-10-12T02:09:19.376Z
mts2023-10-12T02:09:19.376Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6498f97f6a25bf0042ebdd98f193185e0439e0b0795d0f4b4fef0a81ready2023-06-26T02:35:43.771Z6436-7637-1FalseFalseNoneNoneFalseNoneNone20UPGM22601022None
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v1.1
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueTrue
codeMODULE/ASSEMBLY
nameBare module to module PCB assembly
order1
initialTrue
finalFalse
codeHR
nameHayashi-Repic Co.

Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

LocalDB Object ID TestRun Code QC Passed Inspector Date Analysis Version QC Registration
65273aafe7ce7938a6bf23d2 QUAD_MODULE_METROLOGY Failed HideyukiOide 2023-10-11 19:09:19 PDT(-0700) 1.0.11 Selected
64a22196dbbafc456df90284 VISUAL_INSPECTION Passed HideyukiOide 2023-10-11 19:09:16 PDT(-0700) 1.0.6 Selected
64ab51e82dbd73ae8e916635 GLUE_MODULE_FLEX_ATTACH Passed HideyukiOide 2023-10-11 19:09:13 PDT(-0700) Selected
64ab51bd2dbd73ae8e916632 MASS_MEASUREMENT Passed HideyukiOide 2023-10-11 19:09:10 PDT(-0700) 1.0.6 Selected

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Wirebonding Information
(WIREBONDING)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Mass Measurement
(MASS_MEASUREMENT)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
65273aafe7ce7938a6bf23d2 MODULE/ASSEMBLY QUAD_MODULE_METROLOGY HideyukiOide 2023-10-11 19:09:19 PDT(-0700) Selected
64a22196dbbafc456df90284 MODULE/ASSEMBLY VISUAL_INSPECTION HideyukiOide 2023-10-11 19:09:16 PDT(-0700) Selected
64ab51e82dbd73ae8e916635 MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH HideyukiOide 2023-10-11 19:09:13 PDT(-0700) Selected
64ab51bd2dbd73ae8e916632 MODULE/ASSEMBLY MASS_MEASUREMENT HideyukiOide 2023-10-11 19:09:10 PDT(-0700) Selected
649b96dfed1bcf40e06c2439 MODULE/WIREBONDING VISUAL_INSPECTION HideyukiOide 2023-10-11 17:49:11 PDT(-0700) Selected
64ad6e7f7d6e2b1c4615f44b MODULE/WIREBONDING WIREBOND_PULL_TEST HideyukiOide 2023-10-11 17:49:08 PDT(-0700) Selected
64ad6ec07d6e2b1c4615f44e MODULE/WIREBONDING WIREBONDING HideyukiOide 2023-10-11 17:49:05 PDT(-0700) Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
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