Top Page > Component List > 20UPGM22601022 > QC Result / MODULE/WIREBONDING / WIREBONDING

20UPGM22601022
Outer-Quad-Module/ITkPix_v1.1
  ITkPD Component Page Jump to ITkPD component page

Component Information

Item Value
Serial Number 20UPGM22601022
Production DB Component ID f193185e0439e0b0795d0f4b4fef0a81
LocalDB Component ID 6498f97f6a25bf0042ebdd98
Component Type module
Super-Component No match.
Sub-Components •  20UPGB42302001   Bare Module
•  20UPGFC0088388   FE Chip
•  20UPGFC0088424   FE Chip
•  20UPGFC0088361   FE Chip
•  20UPGFC0088503   FE Chip
•  20UPGB42302001   Bare Module
•  20UPGFC0088388   FE Chip
•  20UPGFC0088424   FE Chip
•  20UPGFC0088361   FE Chip
•  20UPGFC0088503   FE Chip
•  20UPGPQ2601022   PCB
Flags

Properties

Item Data Type Value
FE chip version codeTable 2
PCB-Bare Orientation isNormal boolean True
Wirebond protection roof presence boolean None
IREF Trim Bit FE1 integer None
IREF Trim Bit FE2 integer None
IREF Trim Bit FE3 integer None
IREF Trim Bit FE4 integer None

Comments


Test: WIREBONDING QC Passed

(Stage: MODULE/WIREBONDING)


Result of Wirebonding Information

Scan

Key Data
component id 6498f97f6a25bf0042ebdd98
Stage MODULE/WIREBONDING
test Type WIREBONDING
institute 64657cef8d79bac1f3f005d9
user HideyukiOide

Result

Key Data
properties {'BONDING_JIG': 'n/a', 'BOND_PROGRAM': 'n/a', 'BOND_WIRE_BATCH': 'n/a', 'MACHINE': 'K&S Asterion', 'OPERATOR': 'Suzuki'}
HUMIDITY 50
TEMPERATURE 25

Property

Key Data

ProductionDB Record

id65274281209cd50042472faa
stateready
stateTs2023-10-12T00:49:05.891Z
stateUserIdentity24-6238-1
date2023-10-10T15:01:00.000Z
testType
id5d13255102c38f00090aab47
codeWIREBONDING
nameWirebonding Information
stateactive
institution
id64229fe1b8fd040036839f29
codeHR
nameHayashi-Repic Co.
user
id5d14d2eb8c0a21000956c8f6
userIdentity24-6238-1
firstNameHideyuki
middleName
lastNameOide
runNumber64ad6ec07d6e2b1c4615f44e
passedTrue
problemsFalse
properties
  • codeBONDING_JIG
    nameBonding Jig
    dataTypestring
    valueTypesingle
    requiredFalse
    valuen/a
  • codeBOND_PROGRAM
    nameBond Program
    dataTypestring
    valueTypesingle
    requiredFalse
    valuen/a
  • codeBOND_WIRE_BATCH
    nameBond wire batch
    dataTypestring
    valueTypesingle
    requiredFalse
    valuen/a
  • codeMACHINE
    nameMachine Used
    dataTypestring
    valueTypesingle
    requiredFalse
    valueK&S Asterion
    rangeMinNone
    rangeMaxNone
  • codeOPERATOR
    nameOperator Name
    dataTypestring
    valueTypesingle
    requiredFalse
    valueSuzuki
    rangeMinNone
    rangeMaxNone
results
codenamedataTypevalueTypearrayDimensionsadditionalvalueassociateChild
HUMIDITYHumidity (%)floatsingleNoneFalse50None
TEMPERATURETemperature (degC)floatsingleNoneFalse25None
cts2023-10-12T00:49:05.891Z
sys
cts2023-10-12T00:49:05.891Z
mts2023-10-12T00:49:05.891Z
rev0
defects
commentsNone
attachments
components
idcodestatestateTsstateUserIdentitydummycompletedcompletedTscompletedUserIdentitytrashedtrashedTstrashedUserIdentityserialNumberalternativeIdentifierprojectsubprojectcomponentTypetypepropertiestestedAtStageinstitution
6498f97f6a25bf0042ebdd98f193185e0439e0b0795d0f4b4fef0a81ready2023-06-26T02:35:43.771Z6436-7637-1FalseFalseNoneNoneFalseNoneNone20UPGM22601022None
codeP
namePixels
codePG
namePixel general
codeMODULE
nameModule
codeOUTER_SYSTEM_QUAD_MODULE
nameOuter system quad module
  • codeFECHIP_VERSION
    nameFE chip version
    dataTypecodeTable
    requiredTrue
    defaultFalse
    valueITkpix_v1.1
    codeTable
    codevalue
    0RD53A
    1ITkpix_v1
    2ITkpix_v1.1
    3ITkpix_v2
    9No FE chip
  • codeORIENTATION
    namePCB-Bare Orientation isNormal
    dataTypeboolean
    requiredTrue
    defaultFalse
    valueTrue
codeMODULE/WIREBONDING
nameWire Bonding
order2
initialFalse
finalFalse
codeHR
nameHayashi-Repic Co.

Current Stage: Initial Warm

Test Type Local Result
Electrical Test (e-test) Module Summary
(E_SUMMARY)
No TestRun! TestRun is missing in LocalDB.
IV measurement
(IV_MEASURE)
No TestRun! TestRun is missing in LocalDB.

Candidate TestRuns of this Stage

LocalDB Object ID TestRun Code QC Passed Inspector Date Analysis Version QC Registration
649b96dfed1bcf40e06c2439 VISUAL_INSPECTION Passed HideyukiOide 2023-10-11 17:49:11 PDT(-0700) 1.0.6 Selected
64ad6e7f7d6e2b1c4615f44b WIREBOND_PULL_TEST Passed HideyukiOide 2023-10-11 17:49:08 PDT(-0700) 1.0.6 Selected
64ad6ec07d6e2b1c4615f44e WIREBONDING Passed HideyukiOide 2023-10-11 17:49:05 PDT(-0700) Selected

Past QC Stages and Results

  Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test Local Result ProdDB Record
Visual Inspection
(VISUAL_INSPECTION)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Wirebond pull test
(WIREBOND_PULL_TEST)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Wirebonding Information
(WIREBONDING)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!

  Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Test Local Result ProdDB Record
Flatness
(FLATNESS)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach
(GLUE_MODULE_FLEX_ATTACH)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Mass Measurement
(MASS_MEASUREMENT)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology
(QUAD_MODULE_METROLOGY)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology
(TRIPLET_METROLOGY)
No result Test is missing in LocalDB.
N/A Test is not pushed to ITkPD.
Visual Inspection
(VISUAL_INSPECTION)
Registered Test is registered in LocalDB.
Registered Jump to the ITkPD TestRun Page!

  Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID Stage Test Name Inspector Date QC Registration
65273aafe7ce7938a6bf23d2 MODULE/ASSEMBLY QUAD_MODULE_METROLOGY HideyukiOide 2023-10-11 19:09:19 PDT(-0700) Selected
64a22196dbbafc456df90284 MODULE/ASSEMBLY VISUAL_INSPECTION HideyukiOide 2023-10-11 19:09:16 PDT(-0700) Selected
64ab51e82dbd73ae8e916635 MODULE/ASSEMBLY GLUE_MODULE_FLEX_ATTACH HideyukiOide 2023-10-11 19:09:13 PDT(-0700) Selected
64ab51bd2dbd73ae8e916632 MODULE/ASSEMBLY MASS_MEASUREMENT HideyukiOide 2023-10-11 19:09:10 PDT(-0700) Selected
649b96dfed1bcf40e06c2439 MODULE/WIREBONDING VISUAL_INSPECTION HideyukiOide 2023-10-11 17:49:11 PDT(-0700) Selected
64ad6e7f7d6e2b1c4615f44b MODULE/WIREBONDING WIREBOND_PULL_TEST HideyukiOide 2023-10-11 17:49:08 PDT(-0700) Selected
64ad6ec07d6e2b1c4615f44e MODULE/WIREBONDING WIREBONDING HideyukiOide 2023-10-11 17:49:05 PDT(-0700) Selected
Stage Tests
MODULE/INIT
MODULE/ASSEMBLY
  • Mass Measurement  (MASS_MEASUREMENT)
  • Glue Information Module+Flex Attach  (GLUE_MODULE_FLEX_ATTACH)
  • Triplet Module Metrology  (TRIPLET_METROLOGY)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Flatness  (FLATNESS)
  • Quad Module Metrology  (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING
  • Wirebonding Information  (WIREBONDING)
  • Wirebond pull test  (WIREBOND_PULL_TEST)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/INITIAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/QC_CROSSCHECK
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
MODULE/INITIAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/PARYLENE_MASKING
  • Visual Inspection  (VISUAL_INSPECTION)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/PARYLENE_COATING
  • Parylene Properties  (PARYLENE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Parylene (de-)masking  (DE_MASKING)
MODULE/POST_PARYLENE_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Wire bonding protection roof envelope  (WP_ENVELOPE)
  • Mass Measurement  (MASS_MEASUREMENT)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/THERMAL_CYCLES
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • Thermal Cycling  (THERMAL_CYCLING)
  • Flatness  (FLATNESS)
  • Visual Inspection  (VISUAL_INSPECTION)
  • IV measurement  (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Longterm stability DCS  (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Visual Inspection  (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY
  • Flatness  (FLATNESS)
MODULE/QC_STATUS
  • Module ranking  (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
MODULE/TAB_CUTTING
  • Mass Measurement  (MASS_MEASUREMENT)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
  • Visual Inspection  (VISUAL_INSPECTION)
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM
  • Thermal Measure  (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING
  • Electrical Test (e-test) Module Summary  (E_SUMMARY)
  • IV measurement  (IV_MEASURE)
  • Module PCB Tab Cutting Information  (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION
Back to top page of this component