Database for ITk Pixel Module

Item	Value
Serial Number	20UPGM22601022
Production DB Component ID	f193185e0439e0b0795d0f4b4fef0a81
LocalDB Component ID	6498f97f6a25bf0042ebdd98
Component Type	module
Super-Component	No match.
Sub-Components	• 20UPGB42302001 Bare Module • 20UPGFC0088388 FE Chip • 20UPGFC0088424 FE Chip • 20UPGFC0088361 FE Chip • 20UPGFC0088503 FE Chip • 20UPGB42302001 Bare Module • 20UPGFC0088388 FE Chip • 20UPGFC0088424 FE Chip • 20UPGFC0088361 FE Chip • 20UPGFC0088503 FE Chip • 20UPGPQ2601022 PCB
Flags

Key	Data
QC Passed	True
Date	2023-10-11 17:49:08 PDT(-0700)
component ObjectId	6498f97f6a25bf0042ebdd98
Stage	MODULE/WIREBONDING
Test Type	WIREBOND_PULL_TEST
Institute ObjectId
User Name	HideyukiOide
ObjectId of this record	64ad6e7f7d6e2b1c4615f44b
ObjectId of RAW record	None

Key	Data
ANALYSIS_VERSION	mqat v1.0.6
INSTRUMENT	DAGE 4000
OPERATOR	Otaki
BOND_PEEL	0
HEEL_BREAKS_ON_FE_CHIP	0
HEEL_BREAKS_ON_PCB	0
PULL_STRENGTH	8.45412
PULL_STRENGTH_ERROR	0.3591456668261501
PULL_STRENGTH_GRADING	N/A
PULL_STRENGTH_MAX	9.193
PULL_STRENGTH_MIN	7.721
WIRE_BREAKS_5G	0
WIRE_PULLS	25

Expand ProductionDB Record

65274284209cd50042472fb9

state

ready

stateTs

2023-10-12T00:49:08.819Z

stateUserIdentity

24-6238-1

date

2023-10-10T15:00:00.000Z

testType

id	63fb635d4069b50036d3faac
code	WIREBOND_PULL_TEST
name	Wirebond pull test
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

runNumber

64ad6e7f7d6e2b1c4615f44b

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.6	None	None
INSTRUMENT	Instrument	string	single	False	DAGE 4000	None	None
OPERATOR	Operator	string	single	False	Otaki	None	None

results

code BOND_PEEL
name Percentage of bond peel on FE chip or PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code HEEL_BREAKS_ON_FE_CHIP
name Percentage of heel breaks on FE chips [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code HEEL_BREAKS_ON_PCB
name Percentage of heel breaks on PCB [%]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code PULL_STRENGTH
name Mean pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 8.45412
associateChild None
code PULL_STRENGTH_ERROR
name Std deviation of pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0.3591456668261501
associateChild None
code PULL_STRENGTH_GRADING
name Pull strength grade data array
order 1
dataType float
valueType array
arrayDimensions None
additional False
rangeMin None
rangeMax None
value None
associateChild None
code PULL_STRENGTH_MAX
name Maximum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 9.193
associateChild None
code PULL_STRENGTH_MIN
name Minimum pull strength [g]
dataType float
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 7.721
associateChild None
code WIRE_BREAKS_5G
name Number of wires breaking before 5g
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 0
associateChild None
code WIRE_PULLS
name Number of wires pulled
dataType integer
valueType single
arrayDimensions None
additional False
rangeMin None
rangeMax None
value 25
associateChild None

cts

2023-10-12T00:49:08.820Z

sys

cts	2023-10-12T00:49:08.820Z
mts	2023-10-12T00:49:08.820Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6498f97f6a25bf0042ebdd98

f193185e0439e0b0795d0f4b4fef0a81

ready

2023-06-26T02:35:43.771Z

6436-7637-1

False

None

False

None

20UPGM22601022

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/WIREBONDING
name	Wire Bonding
order	2
initial	False
final	False

code	HR
name	Hayashi-Repic Co.

Current Stage: Initial Warm

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun! TestRun is missing in LocalDB.
IV measurement (IV_MEASURE)	No TestRun! TestRun is missing in LocalDB.

LocalDB Object ID	TestRun Code	QC Passed	Inspector	Date	Analysis Version	QC Registration
649b96dfed1bcf40e06c2439	VISUAL_INSPECTION	Passed	HideyukiOide	2023-10-11 17:49:11 PDT(-0700)	1.0.6	Selected
64ad6e7f7d6e2b1c4615f44b	WIREBOND_PULL_TEST	Passed	HideyukiOide	2023-10-11 17:49:08 PDT(-0700)	1.0.6	Selected
64ad6ec07d6e2b1c4615f44e	WIREBONDING	Passed	HideyukiOide	2023-10-11 17:49:05 PDT(-0700)		Selected

Past QC Stages and Results

Results Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Wirebond pull test (WIREBOND_PULL_TEST)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Wirebonding Information (WIREBONDING)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Mass Measurement (MASS_MEASUREMENT)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!
Triplet Module Metrology (TRIPLET_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Test is registered in LocalDB.	Registered Jump to the ITkPD TestRun Page!

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
65273aafe7ce7938a6bf23d2	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	HideyukiOide	2023-10-11 19:09:19 PDT(-0700)	Selected
64a22196dbbafc456df90284	MODULE/ASSEMBLY	VISUAL_INSPECTION	HideyukiOide	2023-10-11 19:09:16 PDT(-0700)	Selected
64ab51e82dbd73ae8e916635	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	HideyukiOide	2023-10-11 19:09:13 PDT(-0700)	Selected
64ab51bd2dbd73ae8e916632	MODULE/ASSEMBLY	MASS_MEASUREMENT	HideyukiOide	2023-10-11 19:09:10 PDT(-0700)	Selected
649b96dfed1bcf40e06c2439	MODULE/WIREBONDING	VISUAL_INSPECTION	HideyukiOide	2023-10-11 17:49:11 PDT(-0700)	Selected
64ad6e7f7d6e2b1c4615f44b	MODULE/WIREBONDING	WIREBOND_PULL_TEST	HideyukiOide	2023-10-11 17:49:08 PDT(-0700)	Selected
64ad6ec07d6e2b1c4615f44e	MODULE/WIREBONDING	WIREBONDING	HideyukiOide	2023-10-11 17:49:05 PDT(-0700)	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22601022
Outer-Quad-Module/ITkPix_v1.1

ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Results Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

Item	Data Type	Value
FE chip version	codeTable	2
PCB-Bare Orientation isNormal	boolean	True
Wirebond protection roof presence	boolean	None
IREF Trim Bit FE1	integer	None
IREF Trim Bit FE2	integer	None
IREF Trim Bit FE3	integer	None
IREF Trim Bit FE4	integer	None

20UPGM22601022 Outer-Quad-Module/ITkPix_v1.1 ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: WIREBOND_PULL_TEST QC Passed

(Stage: MODULE/WIREBONDING)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Results Stage: Wire Bonding (MODULE/WIREBONDING) Locally Signed Off

Results Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

Stage: Initial state to associate flex to bare module (MODULE/INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

20UPGM22601022
Outer-Quad-Module/ITkPix_v1.1

ITkPD Component Page Jump to ITkPD component page