Database for ITk Pixel Module

Serial Number	20UPGM22601022
ProdDB ID	f19318…ef0a81
LocalDB ID	6498f97f6a25bf0042ebdd98
Component Type	MODULE
Parents	No match.
Children	20UPGB42302001 Bare Module 20UPGFC0088388 FE Chip 20UPGFC0088424 FE Chip 20UPGFC0088361 FE Chip 20UPGFC0088503 FE Chip 20UPGB42302001 Bare Module 20UPGFC0088388 FE Chip 20UPGFC0088424 FE Chip 20UPGFC0088361 FE Chip 20UPGFC0088503 FE Chip 20UPGPQ2601022 PCB
Flags

Item	Value
FE chip version	2
PCB-Bare Orientation isNormal	True
Wirebond protection roof presence	None
IREF Trim Bit FE1 deleted	None
IREF Trim Bit FE2 deleted	None
IREF Trim Bit FE3 deleted	None
IREF Trim Bit FE4 deleted	None

Key	Data
QC Passed	True
Date	2 years ago
component ObjectId	6498f97f6a25bf0042ebdd98
Stage	MODULE/ASSEMBLY
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	HideyukiOide
ObjectId of this record	64a22196dbbafc456df90284
ObjectId of RAW record	None
Tags	No tags

Key	Data
ANALYSIS_VERSION	mqat v1.0.6
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	2
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

Expand ProductionDB Record

6527554c209cd500424803e1

state

ready

stateTs

2023-10-12T02:09:16.469Z

stateUserIdentity

24-6238-1

date

2023-10-10T00:50:00.000Z

testType

id	6418292ae43ca10038f30f84
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

runNumber

64a22196dbbafc456df90284

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.6	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	rangeMin	rangeMax	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	None	None	None	2	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	None	None	None	2	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	None	None	None	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	None	None	None	2	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (1: good, 2: issues, 3: bad)	integer	single	None	None	None	None	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	None	None	None	1	None

cts

2023-10-12T02:09:16.469Z

sys

cts	2023-10-12T02:09:16.469Z
mts	2023-10-12T02:09:16.469Z
rev	0

defects

comments

None

attachments

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6498f97f6a25bf0042ebdd98

f193185e0439e0b0795d0f4b4fef0a81

ready

2023-06-26T02:35:43.771Z

6436-7637-1

False

None

False

None

20UPGM22601022

None

code	P
name	Pixels

code	PG
name	Pixel general

code	MODULE
name	Module

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

code FECHIP_VERSION
name FE chip version
dataType codeTable
required True
default False
value ITkpix_v1.1
codeTable
code value
0 RD53A
1 ITkpix_v1
2 ITkpix_v1.1
3 ITkpix_v2
9 No FE chip
code ORIENTATION
name PCB-Bare Orientation isNormal
dataType boolean
required True
default False
value True

code	MODULE/ASSEMBLY
name	Bare module to module PCB assembly
order	1
initial	True
final	False

code	HR
name	Hayashi-Repic Co.

Test Type	Local Result
Electrical Test (e-test) Module Summary (E_SUMMARY)	No TestRun!
IV measurement (IV_MEASURE)	No TestRun!

LDB ID	TestRun Code	QC Passed	Inspector	Measurement Date	Analysis Date	Analysis Version	Tags	QC Registration
65273a…bf23d2	QUAD_MODULE_METROLOGY	Fail	HideyukiOide	N/A	2 years ago	1.0.11	No tags	Selected
64a221…f90284	VISUAL_INSPECTION	Pass	HideyukiOide	N/A	2 years ago	1.0.6	No tags	Selected
64ab51…916635	GLUE_MODULE_FLEX_ATTACH	Pass	HideyukiOide	N/A	2 years ago		No tags	Selected
64ab51…916632	MASS_MEASUREMENT	Pass	HideyukiOide	N/A	2 years ago	1.0.6	No tags	Selected

Test	Local Result	ProdDB Record
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered
Wirebond pull test (WIREBOND_PULL_TEST)	Registered	Registered
Wirebonding Information (WIREBONDING)	Registered	Registered

Test	Local Result	ProdDB Record
Flatness (FLATNESS)	No result	N/A
Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH)	Registered	Registered
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Module Metrology (QUAD_MODULE_METROLOGY)	Registered	Registered
Triplet Module Metrology (TRIPLET_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
65273a…bf23d2	MODULE/ASSEMBLY	QUAD_MODULE_METROLOGY	HideyukiOide	N/A	2 years ago	No tags	Selected
64a221…f90284	MODULE/ASSEMBLY	VISUAL_INSPECTION	HideyukiOide	N/A	2 years ago	No tags	Selected
64ab51…916635	MODULE/ASSEMBLY	GLUE_MODULE_FLEX_ATTACH	HideyukiOide	N/A	2 years ago	No tags	Selected
64ab51…916632	MODULE/ASSEMBLY	MASS_MEASUREMENT	HideyukiOide	N/A	2 years ago	No tags	Selected
649b96…6c2439	MODULE/WIREBONDING	VISUAL_INSPECTION	HideyukiOide	N/A	2 years ago	No tags	Selected
64ad6e…15f44b	MODULE/WIREBONDING	WIREBOND_PULL_TEST	HideyukiOide	N/A	2 years ago	No tags	Selected
64ad6e…15f44e	MODULE/WIREBONDING	WIREBONDING	HideyukiOide	N/A	2 years ago	No tags	Selected

Stage	Tests
MODULE/INIT
MODULE/ASSEMBLY	Mass Measurement (MASS_MEASUREMENT) Glue Information Module+Flex Attach (GLUE_MODULE_FLEX_ATTACH) Triplet Module Metrology (TRIPLET_METROLOGY) Visual Inspection (VISUAL_INSPECTION) Flatness (FLATNESS) Quad Module Metrology (QUAD_MODULE_METROLOGY)
MODULE/WIREBONDING	Wirebonding Information (WIREBONDING) Wirebond pull test (WIREBOND_PULL_TEST) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/INITIAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/QC_CROSSCHECK	IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Visual Inspection (VISUAL_INSPECTION)
MODULE/INITIAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/PARYLENE_MASKING	Visual Inspection (VISUAL_INSPECTION) Parylene (de-)masking (DE_MASKING) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/PARYLENE_COATING	Parylene Properties (PARYLENE) Visual Inspection (VISUAL_INSPECTION)
MODULE/PARYLENE_UNMASKING	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY) Parylene (de-)masking (DE_MASKING)
MODULE/WIREBOND_PROTECTION	Electrical Test (e-test) Module Summary (E_SUMMARY) Wire bonding protection roof envelope (WP_ENVELOPE) Mass Measurement (MASS_MEASUREMENT) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/POST_PARYLENE_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/POST_PARYLENE_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/THERMAL_CYCLES	Electrical Test (e-test) Module Summary (E_SUMMARY) Thermal Cycling (THERMAL_CYCLING) Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE)
MODULE/LONG_TERM_STABILITY_TEST	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Longterm stability DCS (LONG_TERM_STABILITY_DCS)
MODULE/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Visual Inspection (VISUAL_INSPECTION)
MODULE/FINAL_METROLOGY	Flatness (FLATNESS) Visual Inspection (VISUAL_INSPECTION) IV measurement (IV_MEASURE) Electrical Test (e-test) Module Summary (E_SUMMARY)
MODULE/QC_STATUS	Module ranking (RANKING)
MODULE/UNHAPPY	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION	Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
MODULE/TAB_CUTTING	Mass Measurement (MASS_MEASUREMENT) Module PCB Tab Cutting Information (CUTTER_PCB_TAB) Visual Inspection (VISUAL_INSPECTION) Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
LLS/PRE_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/PRE_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/POST_TC_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY)
LLS/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY)
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/FINAL_COLD	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/THERMAL_COLD	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/THERMAL_WARM	Thermal Measure (THERMAL_PERFORMANCE)
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE)
OB_LOADED_MODULE_CELL/TAB_CUTTING	Electrical Test (e-test) Module Summary (E_SUMMARY) IV measurement (IV_MEASURE) Module PCB Tab Cutting Information (CUTTER_PCB_TAB)
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGM22601022

MODULE/INITIAL_WARM

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: MODULE/ASSEMBLY)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

ProductionDB Record

Current Stage: Initial Warm

Candidate TestRuns of this Stage

Past QC Stages and Results

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

All Registered QC Tests

Check QC Flow

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