Yamashita-Mat-75um

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Component Information

Item	Value
Serial Number	20 U PG PQ 3602054
Production DB Component ID	4197996ac233c1591ac516ef572994bc
LocalDB Component ID	6495f357a0f5c00042212d04
Component Type	module_pcb
Super-Component	20 U PI M1 3602054
Sub-Components	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Data Type	Value
PCB Manufacturer	string	Yamashita
PCB design version	codeTable	3
PCB vendor technology	codeTable	6
SMD population vendor	string	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_POPULATION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2024-03-10 03:22:02 PDT(-0700)
component ObjectId	6495f357a0f5c00042212d04
Stage	PCB_POPULATION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	Burhani Taher Saifuddin
ObjectId of this record	65ed849830d4aef6251df858
ObjectId of RAW record	65ed849730d4aef6251df857

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.11
INSTRUMENT	Keyence
OPERATOR	Burhani Taher Saifuddin
COMPONENT_MISALIGNMENT_GRADE	1
DATA_CONNECTOR_ASSEMBLY_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
OBSERVATION	-
OVERALL_GRADE	2
PARTICULATE_CONTAMINATION_GRADE	1
SCRATCHES_GRADE	2
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	1
SOLDER_SPILLS_GRADE	1
WATERMARKS_GRADE	1
WIREBOND_PADS_CONTAMINATION_GRADE	1

Visual Inspection Defects

Download front_image

Filename	Defects	Comment
front_tile2 Download front_tile2	Scratches_PCB
front_tile4 Download front_tile4	Scratches_PCB
front_tile8 Download front_tile8	Scratches_PCB
front_tile11 Download front_tile11		ink overflow onto the wire bond pads
front_tile18 Download front_tile18		ink overflow onto the wire bond pads
front_tile21 Download front_tile21	Scratches_PCB
front_tile24 Download front_tile24		ink overflow onto the wire bond pads
front_tile25 Download front_tile25		ink overflow onto the probe pads
front_tile27 Download front_tile27	Contamination_PCB
front_tile30 Download front_tile30	Scratches_PCB

RAW Results Record

Download RAW

serialNumber

20UPGPQ3602054

testType

VISUAL_INSPECTION

results

property

OPERATOR	Burhani Taher Saifuddin
INSTRUMENT	Keyence
ANALYSIS_VERSION	None

comment

metadata

QCHELPER_VERSION

4.0.dev1

MODULE_SN

20UPGPQ3602054

front_defects

2	Yellow.Scratches_PCB
4	Yellow.Scratches_PCB
8	Yellow.Scratches_PCB
21	Yellow.Scratches_PCB
27	Yellow.Contamination_PCB
30	Yellow.Scratches_PCB

front_comments

0
1
2
3
4
5
6
7
8
9
10
11	ink overflow onto the wire bond pads
12
13
14
15
16
17
18	ink overflow onto the wire bond pads
19
20
21
22
23
24	ink overflow onto the wire bond pads
25	ink overflow onto the probe pads
26
27
28
29
30
31
32
33
34
35

front_image

6700731c6cd1e9c5a149662f

front_defect_images

2	670073126cd1e9c5a14963af
4	670073116cd1e9c5a1496397
8	670073126cd1e9c5a14963d6
11	670073136cd1e9c5a14963e1
18	670073126cd1e9c5a14963c4
21	670073116cd1e9c5a149639d
24	670073126cd1e9c5a14963bb
25	670073126cd1e9c5a14963c0
27	670073126cd1e9c5a14963d1
30	670073126cd1e9c5a14963db

Metadata

Measurements

WIREBOND_PADS_CONTAMINATION_GRADE

None

PARTICULATE_CONTAMINATION_GRADE

None

WATERMARKS_GRADE

None

SCRATCHES_GRADE

None

TRACES_GRADE

None

SOLDERMASK_IRREGULARITIES_GRADE

None

HV_LV_CONNECTOR_ASSEMBLY_GRADE

None

DATA_CONNECTOR_ASSEMBLY_GRADE

None

SOLDER_SPILLS_GRADE

None

COMPONENT_MISALIGNMENT_GRADE

None

SHORTS_OR_CLOSE_PROXIMITY_GRADE

None

OPENS_TOMBSTONING_GRADE

None

OVERALL_GRADE

None

OBSERVATION

None

stage

PCB_POPULATION

component

6495f357a0f5c00042212d04

dbVersion

1.01

address

64657cef8d79bac1f3f00582

sys

mts	2024-03-10 09:59:51.822000
cts	2024-03-10 09:59:51.822000
rev	0

ProductionDB Record

Expand ProductionDB Record

65ed896957a6a40035a43ba6

state

ready

stateTs

2024-03-10T10:20:25.783Z

stateUserIdentity

277-6873-1

date

2024-03-10T09:59:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d428100f6e07b000a559e87
code	OKLAHOMA
name	University of Oklahoma

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

runNumber

65ed849830d4aef6251df858

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	1.0.11	None	None
INSTRUMENT	Instrument	string	single	False	Keyence	None	None
OPERATOR	Operator	string	single	False	Burhani Taher Saifuddin	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
COMPONENT_MISALIGNMENT_GRADE	Component misalignment (scale 1-3)	integer	single	None	False	1	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue (scale 1-3)	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue (scale 1-3)	integer	single	None	False	1	None
OBSERVATION	Observation	string	single	None	False	-	None
OVERALL_GRADE	Overall grade (scale 1-3)	integer	single	None	False	2	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination on the PCB including pick-up points (scale 1-3)	integer	single	None	False	1	None
SCRATCHES_GRADE	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)	integer	single	None	False	2	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment (scale 1-3)	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single	None	False	1	None
SOLDER_SPILLS_GRADE	Solder spills as part of assembly process on wirebonding pads (scale 1-3)	integer	single	None	False	1	None
WATERMARKS_GRADE	Watermarks on the PCB (scale 1-3)	integer	single	None	False	1	None
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)	integer	single	None	False	1	None

cts

2024-03-10T10:20:25.783Z

sys

cts	2024-03-10T10:20:25.783Z
mts	2024-03-10T10:22:02.045Z
rev	19

defects

code	name	description
7550efb991b381daca1b3106	front_tile2	Yellow.Scratches_PCB
7009b0007131ed21c0bce6ff	front_tile4	Yellow.Scratches_PCB
d18e0af02d476ad5c02a0d0d	front_tile8	Yellow.Scratches_PCB
75d8edce8a025eff917b6a9c	front_tile21	Yellow.Scratches_PCB
14fba7d6e6b681e6cda8e9b9	front_tile27	Yellow.Contamination_PCB
5b4c9362ae73e4dff000d7ca	front_tile30	Yellow.Scratches_PCB

comments

code

dateTime

comment

user

93b055476dc5440c6d72f24c

2024-03-10T10:22:02.045Z

tile_comment::front_tile11 : ink overflow onto the wire bond pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

2c51042921b83bbfa8d27049

2024-03-10T10:22:02.045Z

tile_comment::front_tile18 : ink overflow onto the wire bond pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

9272f3f98196a6eba1808cfa

2024-03-10T10:22:02.045Z

tile_comment::front_tile24 : ink overflow onto the wire bond pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

6a7d9aa2e679fe6857f8dfd6

2024-03-10T10:22:02.045Z

tile_comment::front_tile25 : ink overflow onto the probe pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

attachments

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2023-06-23T19:32:39.366Z

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None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

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required

True

default

False

value

Preproduction IS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code	PCB_POPULATION
name	Population
order	1
initial	False
final	False

code	OKLAHOMA
name	University of Oklahoma

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Alternative

No tests are allocated for this stage.

Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

Results Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test	Local Result	ProdDB Record
Mass (MASS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: PCB ready for module (PCB_READY_FOR_MODULE) Locally Signed Off

No tests are allocated for this stage.

Stage: Test failed, needs investigation (UNHAPPY) Alternative

No tests are allocated for this stage.

Results Stage: QC (PCB_QC) Complete

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
LV and HV Test (HV_LV_TEST)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Results Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Alternative

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Alternative

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Alternative

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
SLDO and precision resistors (SLDO_RESISTORS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wirebond pull test (WIREBOND_PULL_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Alternative

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wirebond pull test (WIREBOND_PULL_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Alternative

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
SLDO and precision resistors (SLDO_RESISTORS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wirebond pull test (WIREBOND_PULL_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Cutting (PCB_CUTTING) Complete

Test	Local Result	ProdDB Record
Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Population (PCB_POPULATION) Complete

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

Results Stage: Reception (PCB_RECEPTION) Complete

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Image capture test (IMAGE_CAPTURE_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Layer thickness measurement (LAYER_THICKNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
66a952d825a1bee822030d5f	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	Daniel	2024-08-14 10:13:32 PDT(-0700)	Selected
66a93804d19fe900438cb69d	PCB_RECEPTION_MODULE_SITE	METROLOGY	Daniel	2024-07-30 11:59:16 PDT(-0700)	Selected
66030deea450ce00351a7ba6	PCB_QC	HV_LV_TEST	AchmadAditya	2024-03-26 11:03:26 PDT(-0700)	Selected
65ed849830d4aef6251df858	PCB_POPULATION	VISUAL_INSPECTION	Burhani Taher Saifuddin	2024-03-10 03:22:02 PDT(-0700)	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
PCB_CUTTING	Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20 U PG PQ 3602054 Quad-PCB/Inner Pre-prod./Yamashita-Mat-75um ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_POPULATION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Initial Cold

No tests are allocated for this stage.

Past QC Stages and Results

Stage: QC cross-check (module swapping) (MODULE/QC_CROSSCHECK) Alternative

No tests are allocated for this stage.

Stage: Initial Warm (MODULE/INITIAL_WARM) Complete

No tests are allocated for this stage.

Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Complete

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

Results Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Stage: PCB ready for module (PCB_READY_FOR_MODULE) Locally Signed Off

No tests are allocated for this stage.

Stage: Test failed, needs investigation (UNHAPPY) Alternative

No tests are allocated for this stage.

Results Stage: QC (PCB_QC) Complete

Results Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Alternative

Results Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Alternative

Results Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Alternative

Results Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Alternative

Results Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Alternative

Results Stage: Cutting (PCB_CUTTING) Complete

Results Stage: Population (PCB_POPULATION) Complete

Stage: PCB being populated (PCB_BEING_POPULATED) Not signed-off

No tests are allocated for this stage.

Results Stage: Reception (PCB_RECEPTION) Complete

Stage: Bare PCB Initial (PCB_INIT) Not signed-off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

20 U PG PQ 3602054
Quad-PCB/Inner Pre-prod./Yamashita-Mat-75um

ITkPD Component Page Jump to ITkPD component page