Yamashita-Mat-75um

ITkPD Component Page Jump to ITkPD component page

Component Information

Item	Value
Serial Number	20UPGPQ3602031
Production DB Component ID	9d27112e623abb59417a2837aac20f53
LocalDB Component ID	6495f34da0f5c00042212cb9
Component Type	module_pcb
Super-Component	20UPIM13602031
Sub-Components	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Data Type	Value
PCB Manufacturer	string	Yamashita
PCB design version	codeTable	3
PCB vendor technology	codeTable	6
SMD population vendor	string	None
PCB BOM version	codeTable	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_POPULATION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	2024-10-06 12:00:41 PDT(-0700)
component ObjectId	6495f34da0f5c00042212cb9
Stage	PCB_POPULATION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	Burhani Taher Saifuddin
ObjectId of this record	65ed829f30d4aef6251df856
ObjectId of RAW record	65ed829f30d4aef6251df855

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.11
INSTRUMENT	Keyence
OPERATOR	Burhani Taher Saifuddin
COMPONENT_MISALIGNMENT_GRADE	1
DATA_CONNECTOR_ASSEMBLY_GRADE	1
HV_LV_CONNECTOR_ASSEMBLY_GRADE	1
OBSERVATION	-
OVERALL_GRADE	1
PARTICULATE_CONTAMINATION_GRADE	1
SCRATCHES_GRADE	1
SHORTS_OR_CLOSE_PROXIMITY_GRADE	1
SOLDERMASK_IRREGULARITIES_GRADE	1
SOLDER_SPILLS_GRADE	1
WATERMARKS_GRADE	1
WIREBOND_PADS_CONTAMINATION_GRADE	1

Visual Inspection Defects

Download front_image

Filename	Defects	Comment
front_tile5 Download front_tile5	Contamination_PCB
front_tile11 Download front_tile11		ink overflow onto the wire bond pads
front_tile23 Download front_tile23		ink overflow onto the wire bond pads
front_tile25 Download front_tile25		ink overflow onto the probe pads

RAW Results Record

Download RAW

serialNumber

20UPGPQ3602031

testType

VISUAL_INSPECTION

results

property

OPERATOR	Burhani Taher Saifuddin
INSTRUMENT	Keyence
ANALYSIS_VERSION	None

comment

metadata

QCHELPER_VERSION

4.0.dev1

MODULE_SN

20UPGPQ3602031

front_defects

5	Yellow.Contamination_PCB

front_comments

0
1
2
3
4
5
6
7
8
9
10
11	ink overflow onto the wire bond pads
12
13
14
15
16
17
18
19
20
21
22
23	ink overflow onto the wire bond pads
24
25	ink overflow onto the probe pads
26
27
28
29
30
31
32
33
34
35

front_image

67d4b7046b485aa4adf3f922

front_defect_images

5	67d4b68b6b485aa4adf3eef7
11	67d4b68b6b485aa4adf3eefe
23	67d4b68b6b485aa4adf3eeed
25	67d4b68c6b485aa4adf3ef3a

Metadata

Measurements

WIREBOND_PADS_CONTAMINATION_GRADE

None

PARTICULATE_CONTAMINATION_GRADE

None

WATERMARKS_GRADE

None

SCRATCHES_GRADE

None

TRACES_GRADE

None

SOLDERMASK_IRREGULARITIES_GRADE

None

HV_LV_CONNECTOR_ASSEMBLY_GRADE

None

DATA_CONNECTOR_ASSEMBLY_GRADE

None

SOLDER_SPILLS_GRADE

None

COMPONENT_MISALIGNMENT_GRADE

None

SHORTS_OR_CLOSE_PROXIMITY_GRADE

None

OPENS_TOMBSTONING_GRADE

None

OVERALL_GRADE

None

OBSERVATION

None

stage

PCB_POPULATION

component

6495f34da0f5c00042212cb9

dbVersion

1.01

address

64657cef8d79bac1f3f00582

sys

mts	2024-03-10 09:51:27.211000
cts	2024-03-10 09:51:27.211000
rev	0

ProductionDB Record

Expand ProductionDB Record

65ed8a2a57a6a40035a43c12

state

ready

stateTs

2024-03-10T10:23:38.539Z

stateUserIdentity

277-6873-1

date

2024-03-10T09:51:00.000Z

testType

id	5f644fba928ccc000ad1215f
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	5d428100f6e07b000a559e87
code	OKLAHOMA
name	University of Oklahoma

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

runNumber

65ed829f30d4aef6251df856

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis version	string	single	False	1.0.11	None	None
INSTRUMENT	Instrument	string	single	False	Keyence	None	None
OPERATOR	Operator	string	single	False	Burhani Taher Saifuddin	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
COMPONENT_MISALIGNMENT_GRADE	Component misalignment (scale 1-3)	integer	single	None	False	1	None
DATA_CONNECTOR_ASSEMBLY_GRADE	Data connector assembly issue (scale 1-3)	integer	single	None	False	1	None
HV_LV_CONNECTOR_ASSEMBLY_GRADE	HV LV connector assembly issue (scale 1-3)	integer	single	None	False	1	None
OBSERVATION	Observation	string	single	None	False	-	None
OVERALL_GRADE	Overall grade (scale 1-3)	integer	single	None	False	1	None
PARTICULATE_CONTAMINATION_GRADE	Particulate contamination on the PCB including pick-up points (scale 1-3)	integer	single	None	False	1	None
SCRATCHES_GRADE	Scratches on the wirebonding pads and the PCD that can cause issues with wirebonding and/or electrical functionality of the PCB (scale 1-3)	integer	single	None	False	1	None
SHORTS_OR_CLOSE_PROXIMITY_GRADE	Shorts/close proximity of components due to misalignment (scale 1-3)	integer	single	None	False	1	None
SOLDERMASK_IRREGULARITIES_GRADE	Soldermask irregularity/cracks grade (scale 1-3)	integer	single	None	False	1	None
SOLDER_SPILLS_GRADE	Solder spills as part of assembly process on wirebonding pads (scale 1-3)	integer	single	None	False	1	None
WATERMARKS_GRADE	Watermarks on the PCB (scale 1-3)	integer	single	None	False	1	None
WIREBOND_PADS_CONTAMINATION_GRADE	Wirebond pads clear of contamination, discolouring, spills, deposits, particles, etc that can cause issues with wirebonding(scale 1-3)	integer	single	None	False	1	None

cts

2024-03-10T10:23:38.539Z

sys

cts	2024-03-10T10:23:38.539Z
mts	2024-10-06T19:00:41.530Z
rev	9

defects

code	name	description	properties
be9370af11478190311d16b8	front_tile5	Yellow.Contamination_PCB

comments

code

dateTime

comment

user

8ede6d1ec699886bd62adf58

2024-03-10T10:24:40.246Z

tile_comment::front_tile11 : ink overflow onto the wire bond pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

5e0bcb723db2fc12f1753ddd

2024-03-10T10:24:40.246Z

tile_comment::front_tile23 : ink overflow onto the wire bond pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

089a8ea7ab0efc515544436e

2024-03-10T10:24:40.246Z

tile_comment::front_tile25 : ink overflow onto the probe pads

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

attachments

code

424d01a359646b1ac889f63c5b5ceb48

dateTime

2024-03-10T10:23:38.820Z

title

RAW

description

RAW

contentType

text/plain

type

file

binaryStoreg02

True

filename

20UPGPQ3602031_PCB_POPULATION_VISUAL_INSPECTION_65ed8a2a57a6a40035a43c12_65ed829f30d4aef6251df855.json

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

code

7e84d2d2fe243db187047c7ee5137f57

dateTime

2024-03-10T10:23:39.112Z

title

front_image

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/7/e/8/7e84d2d2fe243db187047c7ee5137f57?authz=zteos64:MDAwMDAyYmN4nO2QP0vDUBTFbcEOnaSbna4i6JLkvfzPnZwFFx1DkJe-lza0zQvJ62Bx1UFnF7-DCn4AVyfBKoIuXVxcHAqODsbi4ODo6Bkuhx_3Xg6neVNv1oql6ez-utFeTFU_56v1cb5RMy1DyNJgasC-Z0cUWbeQo5ynZd_gQmnVupEXkms8NjxDGP7WGqHUTBzP1Qg1A43ShGh-Yscas-OEUC9wPTPYeaiFu0zBNiuAOkAIEhdtD0xiOhGMUo7Upq5Pw3mcCLpfxCJeOM4jUCkXmcJCSqVbvllxtCzX2wwRk0roUJ1SVw98nZIIMjYUOH8DPEOowirsF7EDLM8RerJU-Pshl0OWZviDdIVE4lALyhGvHKiCdQSCzGLRY4MEWyCvstb7897jy8Fkdrb_erucXC6sRJO7p_Wjw-n56Vv7v-s_6houPk6OG5_tcdzT

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/7/e/8/7e84d2d2fe243db187047c7ee5137f57

filename

7e84d2d2fe243db187047c7ee5137f57

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

code

ead01e9713ca821ad02f3b023d876e1c

dateTime

2024-03-10T10:24:17.772Z

title

front_tile5

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/e/a/d/ead01e9713ca821ad02f3b023d876e1c?authz=zteos64:MDAwMDAyYmF4nO2QP0sDQRDFSSApIoJYphqChc3d7d7_m8pWQRDF6jhhL7uXHElul7sNQiqt1F6wSGVh7TdIqX2-gCnsxdLOM1hYWFo6xWP48WZ4vM5Ts9Mot17el4t2t5XrkeK95kztNmzHErKymB6zb-2LshiUcqp4Xo0sLrRR2y1VSm7w1BIWs_jBDqFuGLAoNAi1I4PSjBhRxh2DuWlGaBD5gR0dLxvxCdNwyEqgHhCCxEc3AJvYXgLTnCN1qR_SeB0ngcEXcUgQz1QCOuei0FhKqU0ntG3bRRp5ezFiVg961KTUN6PQpCSBgk0Err8ALxDqrBpHZeoBUwphKCuNvx9yOWF5gT_IQEgkHnWgmvJ6A12yvkCQRSqGbJzhNrzNT93W0f7q9urhbrMYqvn5h9O7fp0_bpw9j5c3q-5_1X9TNdxfXizan_Xc2g8%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/e/a/d/ead01e9713ca821ad02f3b023d876e1c

filename

ead01e9713ca821ad02f3b023d876e1c

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

code

88d096e44f4b1c8cba4a17eba85fbdd5

dateTime

2024-03-10T10:24:22.167Z

title

front_tile11

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/8/8/d/88d096e44f4b1c8cba4a17eba85fbdd5?authz=zteos64:MDAwMDAyYmN4nO1QPUvDUBSlBRU6VZdCl17EoUuS9_LV5E4uXQQHdQwZXvpe2tg2L7y8Lv0HToIf4K7g6D8oboKjnVz0N3RxNhYHB0dHz4XD4XDv5XAaT_VGTTXfVy-LzfZGpscF363Pi27NdiwhS4vpCfvmgVD5UMlZwbNybHGhjWrdKpTkBk-soBp-sEdomIZBIgxC7dCgNCVG4lSKuUlKaC_0e3Z4vKxFJ0zDIVNAPSAEiY9uADaxvRhmGUfqUj-g0TpODMMvxyG9aF7EoDMuco1KSm06ge0QF-2Q9vYjxLQCetSk1DfDwKQkhpxNBa7fAM8RqrAaxyrxgBUFwkiWGn8_5HLKshx_OEMhkXjUgXLGKwVasYFAkHkiRmyS4g60zi91_7q53G7ddVYX_OaIdsr7j9OH9jPvXi36b-3_rv-oa3i9PXvc-gSZOtjo

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/8/8/d/88d096e44f4b1c8cba4a17eba85fbdd5

filename

88d096e44f4b1c8cba4a17eba85fbdd5

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

code

bdde14c9ca434faf11d1aa03a427bb5f

dateTime

2024-03-10T10:24:26.151Z

title

front_tile23

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/b/d/d/bdde14c9ca434faf11d1aa03a427bb5f?authz=zteos64:MDAwMDAyYmN4nO2QsUvDQBTGaUGHTsWxgzzEwSW5uySXJm9yFMFFQYcQ8NK7tqFtLqRXhG5uOikU0dHFUf8CcRLqqBYcnFz8A3R1sRYHB0dH3_Dx-PG9x8dXGZcrpaL68vZ4M1-bS00nl0vlYb5SclyidJ8I0xXf2lBF1ir0IJdpv0OkMtbUTvJCS0smJCGSyPVlylSQMN6wKHNCi7EmtRLucUt4SZOyeujXnXBzUoq2hIENUQDjQClSH70AHOrwGAapROYxP2DRLE4MrS_i0no0zGMwqVSZwUJrY7uB49EQ3brvrkaIzekgZzZjvh0GNqMxZKKncPYGZIYwDWuwUyQcRJ4jtHXf4O-HUvdEmuEP0lIaKWcu9AdyuoEpREMh6CxRbdFt4gKsnVcnO9vv-6OL56vrMdm9PToOPxZPLs9eR-Tufu-w9t_1H3UNTw-nB3OfiwXdCw%3d%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/b/d/d/bdde14c9ca434faf11d1aa03a427bb5f

filename

bdde14c9ca434faf11d1aa03a427bb5f

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

code

e3e0c80b17268c6f927e5d1976b21ff9

dateTime

2024-03-10T10:24:33.670Z

title

front_tile25

description

Visual Inspection Image

contentType

None

type

eos

url

https://eosatlas.cern.ch/eos/atlas/atlascerngroupdisk/det-itk/prod-db/e/3/e/e3e0c80b17268c6f927e5d1976b21ff9?authz=zteos64:MDAwMDAyYmN4nO1QPUvDUBSlBR0KgggOdpBLEXRJ8t7LR5OLg6OIgugYAr70vaShbV5IXgX7G4SOgv_B0VFXtw76A3TRXXBUMBYHB0dH73C4HM45HE7rrtlqlMtPr_e3i-2FTA8K0WlOiq0Gsy2pKovrIf_GnizztFTjQmTVwBJSG7XcKkolDBFb0qoNexuE0bjnUm4QygKD0oQYXDqBwZ04IbQbeF0WHD00wmOu4YCXQF0gBImHjg-MMDeCcSaQOtTzaTivE0H6xdikG06KCHQmZK6xVEqbts9c6iHzmbMTIib1oUtNSj0z8E1KIsj5SOI8BkSOUJfVOChjF3hRIPRVpfF3o1AjnuX4g0mlQuJSG6qxqD_QJe9JBJXHss-HCa5AuvZ-uTmZrs4eDzu7S2-nHxvb59f704todsI952y9_b_1H20NL89XN81PNNHZkg%3d%3d

urlCernbox

https://cernbox.cern.ch/files/spaces/eos/atlas/atlascerngroupdisk/det-itk/prod-db/e/3/e/e3e0c80b17268c6f927e5d1976b21ff9

filename

e3e0c80b17268c6f927e5d1976b21ff9

user

id	626da70bba163f000aa52801
userIdentity	277-6873-1
firstName	Burhani Taher
middleName
lastName	Saifuddin

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

project

subproject

componentType

type

properties

testedAtStage

institution

6495f34da0f5c00042212cb9

9d27112e623abb59417a2837aac20f53

ready

2023-06-23T19:32:29.328Z

6795-7859-1

False

None

False

None

20UPGPQ3602031

None

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Preproduction IS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code	PCB_POPULATION
name	Population
order	3
initial	False
final	False

code	OKLAHOMA
name	University of Oklahoma

Current Stage: Initial Warm

No tests are allocated for this stage.

Past QC Stages and Results

Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

Results Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Test	Local Result	ProdDB Record
Mass (MASS)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Metrology (METROLOGY)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: PCB ready for module (PCB_READY_FOR_MODULE) Locally Signed Off

No tests are allocated for this stage.

Stage: Test failed, needs investigation (UNHAPPY) Alternative

No tests are allocated for this stage.

Results Stage: QC (PCB_QC) Complete

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
LV and HV Test (HV_LV_TEST)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!
Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Alternative

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Alternative

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Alternative

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
SLDO and precision resistors (SLDO_RESISTORS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wirebond pull test (WIREBOND_PULL_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Alternative

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wirebond pull test (WIREBOND_PULL_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Alternative

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
NTC Verification (NTC_VERIFICATION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Signal Transmission (SIGNAL_TRANSMISSION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
SLDO and precision resistors (SLDO_RESISTORS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Wirebond pull test (WIREBOND_PULL_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Cutting (PCB_CUTTING) Complete

Test	Local Result	ProdDB Record
Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Results Stage: Population (PCB_POPULATION) Complete

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	Registered Jump to the LocalDB Test Record!	Registered Jump to the ITkPD TestRun Page!

Stage: PCB being populated (PCB_BEING_POPULATED) Locally Signed Off

No tests are allocated for this stage.

Results Stage: Reception (PCB_RECEPTION) Complete

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Image capture test (IMAGE_CAPTURE_TEST)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Layer thickness measurement (LAYER_THICKNESS)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology (METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Via resistance (VIA_RESISTANCE)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.
Visual Inspection (VISUAL_INSPECTION)	No result Test is missing in LocalDB.	N/A Test is not pushed to ITkPD.

Stage: Bare PCB Initial (PCB_INIT) Locally Signed Off

No tests are allocated for this stage.

LocalDB Test ID	Stage	Test Name	Inspector	Date	QC Registration
66a9513d25a1bee822030d5d	PCB_RECEPTION_MODULE_SITE	VISUAL_INSPECTION	Daniel	2024-10-06 23:36:55 PDT(-0700)	Selected
65ed829f30d4aef6251df856	PCB_POPULATION	VISUAL_INSPECTION	Burhani Taher Saifuddin	2024-10-06 12:00:41 PDT(-0700)	Selected
66a9388ad19fe900438cb79a	PCB_RECEPTION_MODULE_SITE	METROLOGY	Daniel	2024-08-15 13:29:50 PDT(-0700)	Selected
66a93cce481d360042b24302	PCB_RECEPTION_MODULE_SITE	MASS	Daniel	2024-08-15 13:29:47 PDT(-0700)	Selected
660309bf31eb120034cdeb6f	PCB_QC	HV_LV_TEST	AchmadAditya	2024-03-26 10:45:35 PDT(-0700)	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
PCB_CUTTING	Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Quick Tab Cutting Inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/WIREBOND_PROTECTION
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
COMPLETE
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ3602031 Quad-PCB/Inner Pre-prod./Yamashita-Mat-75um ITkPD Component Page Jump to ITkPD component page

Component Information

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: PCB_POPULATION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

Visual Inspection Defects

RAW Results Record

ProductionDB Record

Current Stage: Initial Warm

No tests are allocated for this stage.

Past QC Stages and Results

Stage: Wire Bonding (MODULE/WIREBONDING) Complete

No tests are allocated for this stage.

Stage: Bare module to module PCB assembly (MODULE/ASSEMBLY) Locally Signed Off

No tests are allocated for this stage.

Stage: Initial state to associate flex to bare module (MODULE/INIT) Complete

No tests are allocated for this stage.

Results Stage: PCB Reception at module site (PCB_RECEPTION_MODULE_SITE) Complete

Stage: PCB ready for module (PCB_READY_FOR_MODULE) Locally Signed Off

No tests are allocated for this stage.

Stage: Test failed, needs investigation (UNHAPPY) Alternative

No tests are allocated for this stage.

Results Stage: QC (PCB_QC) Complete

Results Stage: QA post radiation cycle (QA_POST_RADIATION_CYCLE) Alternative

Results Stage: QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE) Alternative

Results Stage: QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE) Alternative

Results Stage: QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE) Alternative

Results Stage: QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE) Alternative

Results Stage: Cutting (PCB_CUTTING) Complete

Results Stage: Population (PCB_POPULATION) Complete

Stage: PCB being populated (PCB_BEING_POPULATED) Locally Signed Off

No tests are allocated for this stage.

Results Stage: Reception (PCB_RECEPTION) Complete

Stage: Bare PCB Initial (PCB_INIT) Locally Signed Off

No tests are allocated for this stage.

All Registered QC Tests

Check QC Flow

Back to top page of this component

20UPGPQ3602031
Quad-PCB/Inner Pre-prod./Yamashita-Mat-75um

ITkPD Component Page Jump to ITkPD component page