20UPGB42307034

MODULE/COMPLETE

Component Information

Serial Number	20UPGB42307034
ProdDB ID	f6ff9a…803546
LocalDB ID	649290dfa0f5c00042e4bd40
Component Type	BARE_MODULE
Parents	20UPGM22601067
Children	20UPGFC0099706 FE Chip 20UPGFC0099686 FE Chip 20UPGFC0099675 FE Chip 20UPGFC0099668 FE Chip 20UPGS33300680 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Vendor code readonly	3
Thickness of FE chips (RD53A)	None

Comments

Test: MASS_MEASUREMENT QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	False
Date	a year ago
component ObjectId	649290dfa0f5c00042e4bd40
Stage	BAREMODULERECEPTION
Test Type	MASS_MEASUREMENT
Institute ObjectId
User Name	HideyukiOide
ObjectId of this record	66a32c1a6303b43c546a889c
ObjectId of RAW record	66a32c1a6303b43c546a889b
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.14
SCALE_ACCURACY	1
MASS	1272

RAW Results Record

Download RAW

_id

66a32c1a6303b43c546a889b

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGB42307034

MASS_MEASUREMENT

property

SCALE_ACCURACY	1.0
ANALYSIS_VERSION	None

comment

metadata

QCHELPER_VERSION	4.0.dev1
MODULE_SN	20UPGB42307034
MASS_UNIT	mg
SCALE_ACCURACY_UNIT	mg

Metadata

Measurements

MASS	1272.0

MASS

1272.0

BAREMODULERECEPTION

649290dfa0f5c00042e4bd40

1.01

64657cef8d79bac1f3f005d9

mts	2024-07-26 04:54:50.091000
cts	2024-07-26 04:54:50.091000
rev	0

rawHash

d6626cd559b57c5f95f3dc1440a09c92

stage

BAREMODULERECEPTION

ProductionDB Record

Expand ProductionDB Record

66a4c0a4234ff50043d2ad36

state

ready

stateTs

2024-07-27T09:40:52.252Z

stateUserIdentity

24-6238-1

date

2024-07-26T04:54:00.000Z

testType

id	5f87daff50d75e000a335805
code	MASS_MEASUREMENT
name	Mass Measurement
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

runNumber

66a32c1a6303b43c546a889c

passed

False

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.14	None	None
SCALE_ACCURACY	Scale Accuracy [mg]	float	single	False	1	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
MASS	Mass [mg]	float	single	None	False	1272	None

cts

2024-07-27T09:40:52.252Z

sys

cts	2024-07-27T09:40:52.252Z
mts	2024-10-07T05:43:36.128Z
rev	2

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

ca57506babf46d874c5b22a9e4821f6b

2024-07-27T09:40:52.546Z

RAW

application/json

file

True

20UPGB42307034_BAREMODULERECEPTION_MASS_MEASUREMENT_66a4c0a4234ff50043d2ad36_66a32c1a6303b43c546a889b.json

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

649290dfa0f5c00042e4bd40

f6ff9a952249c40fd03bd6418a803546

ready

2023-06-21T05:55:43.968Z

24-6238-1

False

None

False

None

20UPGB42307034

None

parent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

highestLevelParent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

HPK (in-kind)

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Module Complete

No tests are allocated for this stage.

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
66a0f6…cd4128	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	HideyukiOide	N/A	a year ago	No tags	Selected
66a313…6a8620	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	HideyukiOide	N/A	a year ago	No tags	Selected
66a32c…6a889c	BAREMODULERECEPTION	MASS_MEASUREMENT	HideyukiOide	N/A	a year ago	No tags	Selected
66a0ca…051ab4	BAREMODULERECEPTION	VISUAL_INSPECTION	HideyukiOide	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42307034

MODULE/COMPLETE

Component Information

Distribution of chips on wafer

Properties

Comments

Test: MASS_MEASUREMENT QC Failed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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