20UPGB42307034

MODULE/COMPLETE

Component Information

Serial Number	20UPGB42307034
ProdDB ID	f6ff9a…803546
LocalDB ID	649290dfa0f5c00042e4bd40
Component Type	BARE_MODULE
Parents	20UPGM22601067
Children	20UPGFC0099706 FE Chip 20UPGFC0099686 FE Chip 20UPGFC0099675 FE Chip 20UPGFC0099668 FE Chip 20UPGS33300680 Sensor Tile
Flags

Broken at FE chip level

Broken during handling

Broken at sensor level

FE chip or chips fell off

Other issues

Inner pixel

Used for bare module QA

Distribution of chips on wafer

Properties

Item	Value
FE chip version readonly	2
Sensor Type	5
Vendor code readonly	3
Thickness of FE chips (RD53A)	None

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	649290dfa0f5c00042e4bd40
Stage	BAREMODULERECEPTION
Test Type	VISUAL_INSPECTION
Institute ObjectId
User Name	HideyukiOide
ObjectId of this record	66a0ca0155a58a9302051ab4
ObjectId of RAW record	66a0ca0155a58a9302051ab3
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.14
FE_CHIP_CONDITION_PASSED_QC	2
GLUE_DISTRIBUTION_PASSED_QC	1
PARYLENE_COATING_PASSED_QC	1
SENSOR_CONDITION_PASSED_QC	2
SMD_COMPONENTS_PASSED_QC	1
WIREBONDING_PASSED_QC	1

RAW Results Record

Download RAW

serialNumber

20UPGB42307034

testType

VISUAL_INSPECTION

subtestType

results

property

ANALYSIS_VERSION	None

comment

metadata

QCHELPER_VERSION

4.0.dev1

MODULE_SN

20UPGB42307034

front_defects

0	Yellow.Scratches_Sensor
1	Yellow.Contamination_Sensor
5	Yellow.Scratches_Sensor
6	Yellow.Scratches_Sensor
8	Yellow.Scratches_Sensor
10	Yellow.Scratches_Sensor Yellow.Contamination_Sensor
16	Yellow.Scratches_Sensor
17	Yellow.Scratches_Sensor
25	Yellow.Scratches_Sensor
28	Yellow.Scratches_Sensor
30	Yellow.Scratches_Sensor Yellow.Contamination_Sensor
35	Yellow.Contamination_Sensor

front_comments

0	alignment pins are left
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

front_image

66a0c8fafa7bbf16fe8e7274

front_defect_images

0	66a0c8fafa7bbf16fe8e729c
1	66a0c8fafa7bbf16fe8e729f
5	66a0c8fafa7bbf16fe8e72a2
6	66a0c8fafa7bbf16fe8e72a5
8	66a0c8fafa7bbf16fe8e72a8
10	66a0c8fafa7bbf16fe8e72ab
16	66a0c8fafa7bbf16fe8e72ae
17	66a0c8fafa7bbf16fe8e72b1
25	66a0c8fafa7bbf16fe8e72b4
28	66a0c8fafa7bbf16fe8e72b7
30	66a0c8fafa7bbf16fe8e72ba
35	66a0c8fafa7bbf16fe8e72bd

back_defects

3	Yellow.Scratches_backside_FE
12	Yellow.Dust_FE
15	Yellow.Dust_FE
30	Yellow.Scratches_backside_FE

back_comments

0	alignment pnis are left
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35

back_image

66a0ca00fa7bbf16fe8e72c0

back_defect_images

0	66a0ca00fa7bbf16fe8e72ca
3	66a0ca00fa7bbf16fe8e72cc
12	66a0ca00fa7bbf16fe8e72ce
15	66a0ca00fa7bbf16fe8e72d0
30	66a0ca00fa7bbf16fe8e72d2

Metadata

Measurements

DEFECTS

None

SMD_COMPONENTS_PASSED_QC

None

SENSOR_CONDITION_PASSED_QC

None

FE_CHIP_CONDITION_PASSED_QC

None

GLUE_DISTRIBUTION_PASSED_QC

None

WIREBONDING_PASSED_QC

None

PARYLENE_COATING_PASSED_QC

None

stage

BAREMODULERECEPTION

component

649290dfa0f5c00042e4bd40

dbVersion

1.01

address

64657cef8d79bac1f3f005d9

sys

mts	2024-07-24 09:31:45.488000
cts	2024-07-24 09:31:45.488000
rev	0

ProductionDB Record

Expand ProductionDB Record

66a4c09a5bb02600438666b1

state

ready

stateTs

2024-07-27T09:40:42.942Z

stateUserIdentity

24-6238-1

date

2024-07-24T09:31:00.000Z

testType

id	5f869f6646cd14000b5108c6
code	VISUAL_INSPECTION
name	Visual Inspection
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

runNumber

66a0ca0155a58a9302051ab4

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.14	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
FE_CHIP_CONDITION_PASSED_QC	FE chip condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
GLUE_DISTRIBUTION_PASSED_QC	Glue distribution passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
PARYLENE_COATING_PASSED_QC	Parylene coating passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
SENSOR_CONDITION_PASSED_QC	Sensor condition passed QC (1: good, 2: issues, 3: bad)	integer	single	None	False	2	None
SMD_COMPONENTS_PASSED_QC	SMD components passed QC (not required for bare modules) (1: good, 2: issues, 3: bad)	integer	single	None	False	1	None
WIREBONDING_PASSED_QC	Wirebonding passed QC (not applicable for bare module reception, 1: good, 2: issues, 3: bad)	integer	single	None	False	1	None

cts

2024-07-27T09:40:42.942Z

sys

cts	2024-07-27T09:40:42.942Z
mts	2024-10-07T05:43:35.926Z
rev	20

defects

code	name	description
e1030cabd1b30039255c1151	front_tile0	Yellow.Scratches_Sensor
c6721dcdbb26e8cade9662e8	front_tile1	Yellow.Contamination_Sensor
e8fcc9e345d91ae71ebfed19	front_tile5	Yellow.Scratches_Sensor
a195eb7133660f9f203ee04a	front_tile6	Yellow.Scratches_Sensor
4fe866de5e7ab89db512fc42	front_tile8	Yellow.Scratches_Sensor
c8e40179ef7e6112e3d60640	front_tile10	Yellow.Scratches_Sensor
b4e76eeb304d70fbe2f29319	front_tile10	Yellow.Contamination_Sensor
3306d633bf414c2715240d17	front_tile16	Yellow.Scratches_Sensor
263e0e36385926744b87cc63	front_tile17	Yellow.Scratches_Sensor
cfacd4bc7bddc6412686b097	front_tile25	Yellow.Scratches_Sensor
075e68f472c4fe5eb6859706	front_tile28	Yellow.Scratches_Sensor
203c38b2feff03aebd5d4e3f	front_tile30	Yellow.Scratches_Sensor
db14baeedcfd71db3957e7a6	front_tile30	Yellow.Contamination_Sensor
624e3ed14617f0d7c70dae14	front_tile35	Yellow.Contamination_Sensor
21e775c3062c8ba6fe700d05	back_tile3	Yellow.Scratches_backside_FE
d3d55ff8faf6c443d389c36f	back_tile12	Yellow.Dust_FE
7a5acd624031e65e5145d3e1	back_tile15	Yellow.Dust_FE
41e48ff1e7b1f71f988eaade	back_tile30	Yellow.Scratches_backside_FE

comments

code

dateTime

comment

user

6c32bc16a722102e6ed77f24

2024-07-27T09:40:47.726Z

tile_comment::front_tile0 : alignment pins are left

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

383cd87c833f078b84eb95e5

2024-07-27T09:40:47.985Z

tile_comment::back_tile0 : alignment pnis are left

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

adb10e19883838f1b5371ae502c7cddf

2024-07-27T09:40:43.276Z

RAW

text/plain

file

True

20UPGB42307034_BAREMODULERECEPTION_VISUAL_INSPECTION_66a4c09a5bb02600438666b1_66a0ca0155a58a9302051ab3.json

id	5d14d2eb8c0a21000956c8f6
userIdentity	24-6238-1
firstName	Hideyuki
middleName
lastName	Oide

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

649290dfa0f5c00042e4bd40

f6ff9a952249c40fd03bd6418a803546

ready

2023-06-21T05:55:43.968Z

24-6238-1

False

None

False

None

20UPGB42307034

None

parent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

highestLevelParent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

code	P
name	Pixels

code	PG
name	Pixel general

code	BARE_MODULE
name	Bare Module

code	QUAD_BARE_MODULE
name	Quad bare module

code

name

dataType

required

default

value

codeTable

FECHIP_VERSION

FE chip version

codeTable

True

False

ITkpix_v1.1

code	value
0	RD53A
1	ITkpix_v1
2	ITkpix_v1.1
3	ITkpix_v2
9	No FE chip

SENSOR_TYPE

Sensor Type

codeTable

True

False

Outer pixel quad sensor tile

code	value
0	No sensor
1	Market survey sensor tile
2	L0 inner pixel 3D sensor tile
3	L0 inner pixel planar sensor tile
4	L1 inner pixel quad sensor tile
5	Outer pixel quad sensor tile
9	Dummy sensor tile

VENDOR

Vendor code

codeTable

True

False

HPK (in-kind)

code	value
0	Advacam
1	Leonardo
2	IZM
3	HPK (in-kind)
4	HPK (CERN order)
5	RAL (in-house)
6	Glasgow (in-house)
9	ITk institute

code	BAREMODULERECEPTION
name	Reception at ITk institute
order	3
initial	False
final	False

code	HPK
name	Hamamatsu Photonics K.K (HPK)

Current Stage: Module Complete

No tests are allocated for this stage.

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Test	Local Result	ProdDB Record
Sensor IV on bare module (BARE_MODULE_SENSOR_IV)	Registered	Registered
Flatness (FLATNESS)	No result	N/A
Mass Measurement (MASS_MEASUREMENT)	Registered	Registered
Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY)	Registered	Registered
Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
66a0f6…cd4128	BAREMODULERECEPTION	QUAD_BARE_MODULE_METROLOGY	HideyukiOide	N/A	a year ago	No tags	Selected
66a313…6a8620	BAREMODULERECEPTION	BARE_MODULE_SENSOR_IV	HideyukiOide	N/A	a year ago	No tags	Selected
66a32c…6a889c	BAREMODULERECEPTION	MASS_MEASUREMENT	HideyukiOide	N/A	a year ago	No tags	Selected
66a0ca…051ab4	BAREMODULERECEPTION	VISUAL_INSPECTION	HideyukiOide	N/A	a year ago	No tags	Selected

Stage	Tests
BAREMODULEASSEMBLY
UNHAPPY
NOT_USED
BAREMODULERECEPTION	Visual Inspection (VISUAL_INSPECTION) Mass Measurement (MASS_MEASUREMENT) Quad Bare Module Metrology (QUAD_BARE_MODULE_METROLOGY) Flatness (FLATNESS) Sensor IV on bare module (BARE_MODULE_SENSOR_IV) Single Bare Module Metrology (SINGLE_BARE_MODULE_METROLOGY)
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGB42307034

MODULE/COMPLETE

Component Information

Distribution of chips on wafer

Properties

Comments

Test: VISUAL_INSPECTION QC Passed

(Stage: BAREMODULERECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Reception at ITk institute (BAREMODULERECEPTION)

Not to be used for the detector (NOT_USED)

Bare module failed test, needs investigation (UNHAPPY)

Bare module assembly (BAREMODULEASSEMBLY)

All Registered QC Tests

Check QC Flow

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