20UPGPQ2601067

MODULE/COMPLETE

Component Information

Serial Number	20UPGPQ2601067
ProdDB ID	7f7677…ed57aa
LocalDB ID	647c51cf0722460042c4ed24
Component Type	MODULE_PCB
Parents	20UPGM22601067
Children	No match.
Flags

Damaged during handling

Other issues

Too dirty to be used

Brown marks on traces

Additional cleaning done

Has misplaced pads due to solder mask issue

Used for dummy modules

Used for PCB QA

Properties

Item	Value
PCB Manufacturer	Yamashita Material
PCB design version readonly	2
PCB vendor technology readonly	6
SMD population vendor	Hayashi REPIC Co.
PCB BOM version	12

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Key	Data
QC Passed	True
Date	a year ago
component ObjectId	647c51cf0722460042c4ed24
Stage	PCB_RECEPTION
Test Type	METROLOGY
Institute ObjectId
User Name	TakumiKumayama
ObjectId of this record	672c69d795d9830493747cfd
ObjectId of RAW record	672c69d795d9830493747cfc
Tags	No tags

Results

Key	Data
ANALYSIS_VERSION	mqat v1.0.17
INSTRUMENT	None
OPERATOR	None
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.209
AVERAGE_THICKNESS_POWER_CONNECTOR	0
DIAMETER_DOWEL_HOLE_A	3.022
HV_CAPACITOR_THICKNESS	0
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	True
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.002
WIDTH_DOWEL_SLOT_B	3.055
X-Y_DIMENSION_WITHIN_ENVELOP	True
X_DIMENSION	39.557
Y_DIMENSION	40.351

RAW Results Record

Download RAW

_id

672c69d795d9830493747cfc

raw

serialNumber

testType

subtestType

results

stage

component

dbVersion

address

sys

20UPGPQ2601067

METROLOGY

property

OPERATOR	None
INSTRUMENT	None
ANALYSIS_VERSION	None
METROLOGY_MEASUREMENT_VERSION	4.0.dev1

comment

Metadata

QCHELPER_VERSION	4.0.dev1
ModuleSN	20UPGPQ2601067

Measurements

X_DIMENSION	39.557
Y_DIMENSION	40.351
X-Y_DIMENSION_WITHIN_ENVELOP	True
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	0.209
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	0.002
HV_CAPACITOR_THICKNESS	0.0
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	True
AVERAGE_THICKNESS_POWER_CONNECTOR	0.0
DIAMETER_DOWEL_HOLE_A	3.022
WIDTH_DOWEL_SLOT_B	3.055

X_DIMENSION

None

Y_DIMENSION

None

X-Y_DIMENSION_WITHIN_ENVELOP

None

DIAMETER_DOWEL_HOLE_A

None

WIDTH_DOWEL_SLOT_B

None

AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS

None

STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS

None

HV_CAPACITOR_THICKNESS

None

HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP

None

AVERAGE_THICKNESS_POWER_CONNECTOR

None

PCB_RECEPTION

647c51cf0722460042c4ed24

1.01

64657cef8d79bac1f3f005d9

mts	2024-11-07 07:18:47.239000
cts	2024-11-07 07:18:47.239000
rev	0

rawHash

225184db384a7d0dc4f574135deceee3

stage

PCB_RECEPTION

ProductionDB Record

Expand ProductionDB Record

672c6aa2c9d514897dd46467

state

ready

stateTs

2024-11-07T07:22:10.194Z

stateUserIdentity

2983-7671-1

date

2024-11-07T07:18:00.000Z

testType

id	60255faf86dec3000ad0330d
code	METROLOGY
name	Metrology
state	active

institution

id	64229fe1b8fd040036839f29
code	HR
name	Hayashi-Repic Co.

user

id	64e887fd9d1c7e00428f4775
userIdentity	2983-7671-1
firstName	Takumi
middleName
lastName	Kumayama

runNumber

672c69d795d9830493747cfd

passed

True

problems

False

properties

code	name	dataType	valueType	required	value	rangeMin	rangeMax
ANALYSIS_VERSION	Analysis Version	string	single	False	1.0.17	None	None
INSTRUMENT	Instrument	string	single	False	None	None	None
OPERATOR	Operator	string	single	False	None	None	None

results

code	name	dataType	valueType	arrayDimensions	additional	value	associateChild
AVERAGE_THICKNESS_FECHIP_PICKUP_AREAS	Average thickness of all pick-up areas [mm]	float	single	1	False	0.209	None
AVERAGE_THICKNESS_POWER_CONNECTOR	Thickness including the black body of power connector (excluding pins) [mm]	float	single	None	False	0	None
DIAMETER_DOWEL_HOLE_A	Diameter of dowel hole A (top left) (for PCB reception from vendor only) [mm]	float	single	None	False	3.022	None
HV_CAPACITOR_THICKNESS	HV capacitor thickness [mm]	float	single	None	False	0	None
HV_CAPACITOR_THICKNESS_WITHIN_ENVELOP	HV capacitor thickness within envelop	boolean	single	None	False	True	None
STD_DEVIATION_THICKNESS_FECHIP_PICKUP_AREAS	Std deviation of thickness of all pick-up area [mm]	float	single	1	False	0.002	None
WIDTH_DOWEL_SLOT_B	Width of dowel slot B (bottom right) (for PCB reception from vendor only) [mm]	float	single	None	False	3.055	None
X-Y_DIMENSION_WITHIN_ENVELOP	X-Y dimension within envelope	boolean	single	None	False	True	None
X_DIMENSION	X dimension [mm]	float	single	None	False	39.557	None
Y_DIMENSION	Y dimension [mm]	float	single	None	False	40.351	None

cts

2024-11-07T07:22:10.195Z

sys

cts	2024-11-07T07:22:10.195Z
mts	2024-11-07T07:22:10.950Z
rev	1

defects

comments

None

attachments

code

dateTime

title

description

contentType

type

binaryStoreg02

filename

user

aeb037825de77f9021b988910ed4edba

2024-11-07T07:22:10.652Z

RAW

text/plain

file

True

20UPGPQ2601067_PCB_RECEPTION_METROLOGY_672c6aa2c9d514897dd46467_672c69d795d9830493747cfc.json

id	64e887fd9d1c7e00428f4775
userIdentity	2983-7671-1
firstName	Takumi
middleName
lastName	Kumayama

components

code

state

stateTs

stateUserIdentity

dummy

completed

completedTs

completedUserIdentity

trashed

trashedTs

trashedUserIdentity

serialNumber

alternativeIdentifier

ancestorMap

project

subproject

componentType

type

properties

testedAtStage

institution

647c51cf0722460042c4ed24

7f767755c3e63c1152f082588bed57aa

ready

2023-06-04T08:56:47.020Z

24-6238-1

False

None

False

None

20UPGPQ2601067

None

parent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

highestLevelParent

component

64ed37e6c96c32004230ef1f

code

f0dd42cb70997a03eb37b202e98ea3a1

state

ready

stateTs

2023-08-29T00:12:22.218Z

stateUserIdentity

24-779-1

dummy

False

completed

False

completedTs

None

completedUserIdentity

None

trashed

False

trashedTs

None

trashedUserIdentity

None

serialNumber

20UPGM22601067

alternativeIdentifier

None

project

code	P
name	Pixels

subproject

code	PG
name	Pixel general

componentType

code	MODULE
name	Module

type

code	OUTER_SYSTEM_QUAD_MODULE
name	Outer system quad module

testedAtStage

code	MODULE/INITIAL_WARM
name	Initial Warm

code	P
name	Pixels

code	PG
name	Pixel general

code	PCB
name	Module PCB

code	QUAD_PCB
name	Quad PCB

code PCB_MANUFACTURER
name PCB Manufacturer
dataType string
required True
default False
value Yamashita Material

code

PCB_DESIGN_VERSION

name

PCB design version

dataType

codeTable

required

True

default

False

value

Preproduction OS

codeTable

code	value
0	RD53A
1	Prototype
2	Preproduction OS
3	Preproduction IS
4	Production OS
5	Production IS
9	No chip

code

PCB_VENDOR_TECHNOLOGY

name

PCB vendor technology

dataType

codeTable

required

True

default

False

value

Yamashita Material (75 mum trace)

codeTable

code	value
1	EPEC (100 mum trace)
2	NCAB (100 mum trace)
3	ALTAFLEX (75 mum trace)
4	SFCircuits (100 mum trace)
5	PHOENIX (100 mum trae)
6	Yamashita Material (75 mum trace)
7	NCAB (75 mum trace)
8	Tecnomec (100 mum trace)

code SMD_POPULATION_VENDOR
name SMD population vendor
dataType string
required False
default False
value Hayashi REPIC Co.
code PCB_BOM_VERSION
name PCB BOM version
dataType codeTable
required False
default False
value V1.1 L2
codeTable
code value
10 V1.1 L0
11 V1.1 L1
12 V1.1 L2
20 V2 L0
21 V2 L1
22 V2 L2

code	PCB_RECEPTION
name	Reception
order	1
initial	False
final	False

code	KEK
name	High Energy Accelerator Research Organization (KEK)

Current Stage: Module Complete

No tests are allocated for this stage.

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

Test	Local Result	ProdDB Record
Mass (MASS)	Registered	Registered
Metrology (METROLOGY)	No result	N/A
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
LV and HV Test (HV_LV_TEST)	No result	N/A
Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)	No result	N/A

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Test	Local Result	ProdDB Record
LV and HV Test (HV_LV_TEST)	No result	N/A
Metrology (METROLOGY)	No result	N/A
NTC Verification (NTC_VERIFICATION)	No result	N/A
Signal Transmission (SIGNAL_TRANSMISSION)	No result	N/A
SLDO and precision resistors (SLDO_RESISTORS)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Wirebond pull test (WIREBOND_PULL_TEST)	No result	N/A

Population (PCB_POPULATION)

Test	Local Result	ProdDB Record
Component Position Check (COMPONENT_POSITION_CHECK)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	No result	N/A

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Test	Local Result	ProdDB Record
Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK)	No result	N/A
Image capture test (IMAGE_CAPTURE_TEST)	No result	N/A
Layer thickness measurement (LAYER_THICKNESS)	Registered	Registered
Metrology (METROLOGY)	Registered	Registered
Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY)	No result	N/A
Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)	No result	N/A
Via resistance (VIA_RESISTANCE)	No result	N/A
Visual Inspection (VISUAL_INSPECTION)	Registered	Registered

Bare PCB Initial (PCB_INIT)

LocalDB Test ID	Stage	Test Name	Inspector	Measurement Date	Analysis Date	Tags	QC Registration
66aa5f…5c9fe9	PCB_RECEPTION	LAYER_THICKNESS	TakumiKumayama	N/A	a year ago	No tags	Selected
672c69…747cfd	PCB_RECEPTION	METROLOGY	TakumiKumayama	N/A	a year ago	No tags	Selected
66ab50…5ca121	PCB_RECEPTION	VISUAL_INSPECTION	TakumiKumayama	N/A	a year ago	No tags	Selected
66a33c…6a8a02	PCB_RECEPTION_MODULE_SITE	MASS	HideyukiOide	N/A	a year ago	No tags	Selected

Stage	Tests
PCB_INIT
PCB_RECEPTION	Visual Inspection (VISUAL_INSPECTION) Metrology (METROLOGY) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Layer thickness measurement (LAYER_THICKNESS) Image capture test (IMAGE_CAPTURE_TEST) Via resistance (VIA_RESISTANCE) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
PCB_BEING_POPULATED
PCB_POPULATION	Visual Inspection (VISUAL_INSPECTION) Component Position Check (COMPONENT_POSITION_CHECK)
QA_PRE_THERMAL_CYCLE	SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_POST_THERMAL_CYCLE	NTC Verification (NTC_VERIFICATION) Via resistance (VIA_RESISTANCE) LV and HV Test (HV_LV_TEST) Wirebond pull test (WIREBOND_PULL_TEST)
QA_PRE_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE) Metrology (METROLOGY) SLDO and precision resistors (SLDO_RESISTORS) NTC Verification (NTC_VERIFICATION) Wirebond pull test (WIREBOND_PULL_TEST) LV and HV Test (HV_LV_TEST)
QA_POST_RADIATION_POST_THERMAL_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
QA_POST_RADIATION_CYCLE	Signal Transmission (SIGNAL_TRANSMISSION) Via resistance (VIA_RESISTANCE)
PCB_QC	LV and HV Test (HV_LV_TEST) Dowel Tolerance Check (DOWEL_TOLERANCE_CHECK) Tab cutting and gross defect inspection (QUICK_TAB_CUTTING_INSPECTION)
UNHAPPY
PCB/GRAVEYARD
PCB_READY_FOR_MODULE
PCB_RECEPTION_MODULE_SITE	Visual Inspection (VISUAL_INSPECTION) Mass (MASS) Metrology (METROLOGY) Metrology Triplet Linear (TRIPLET_PCB_LINEAR_METROLOGY) Metrology Triplet Ring (TRIPLET_PCB_RING_METROLOGY)
COMPLETE
MODULE/INIT
MODULE/ASSEMBLY
MODULE/WIREBONDING
MODULE/INITIAL_WARM
MODULE/QC_CROSSCHECK
MODULE/INITIAL_COLD
MODULE/PARYLENE_MASKING
MODULE/PARYLENE_COATING
MODULE/PARYLENE_UNMASKING
MODULE/WIREBOND_PROTECTION
MODULE/POST_PARYLENE_WARM
MODULE/POST_PARYLENE_COLD
MODULE/THERMAL_CYCLES
MODULE/LONG_TERM_STABILITY_TEST
MODULE/FINAL_WARM
MODULE/FINAL_COLD
MODULE/FINAL_METROLOGY
MODULE/QC_STATUS
MODULE/UNHAPPY
MODULE/NOTCONSIDEREDINYIELDS
MODULE/GRAVEYARD
MODULE/COMPLETE
MODULE/RECEPTION
MODULE/TAB_CUTTING
LLS/PRE_TC_WARM
LLS/PRE_TC_COLD
LLS/POST_TC_WARM
LLS/POST_TC_COLD
LLS/RECEPTION
OB_LOADED_MODULE_CELL/INIT
OB_LOADED_MODULE_CELL/ASSEMBLY
OB_LOADED_MODULE_CELL/THERMAL_CYCLES
OB_LOADED_MODULE_CELL/FINAL_WARM
OB_LOADED_MODULE_CELL/FINAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_COLD
OB_LOADED_MODULE_CELL/THERMAL_WARM
OB_LOADED_MODULE_CELL/ENVELOPE_CHECK
OB_LOADED_MODULE_CELL/QC_STATUS
OB_LOADED_MODULE_CELL/UNHAPPY
OB_LOADED_MODULE_CELL/COMPLETE
OB_LOADED_MODULE_CELL/RECEPTION
OB_LOADED_MODULE_CELL/TAB_CUTTING
OB_LOADED_MODULE_CELL/PIGTAIL_INSERTION

20UPGPQ2601067

MODULE/COMPLETE

Component Information

Properties

Comments

Test: METROLOGY QC Passed

(Stage: PCB_RECEPTION)

Basic View Only: custom view for this TestRun is not prepared.

Metadata

Results

RAW Results Record

ProductionDB Record

Current Stage: Module Complete

Past QC Stages and Results

Modules damaged, impossible to recover (MODULE/GRAVEYARD)

Stage for QA modules and others not to be considered in yield calculation (MODULE/NOTCONSIDEREDINYIELDS)

Modules failed test, needs investigation (MODULE/UNHAPPY)

Ranking of the module (MODULE/QC_STATUS)

Final flatness measurement (MODULE/FINAL_METROLOGY)

Final Cold (MODULE/FINAL_COLD)

Final Warm (MODULE/FINAL_WARM)

Long Term Stability Test (MODULE/LONG_TERM_STABILITY_TEST)

Thermal Cycles (MODULE/THERMAL_CYCLES)

Post-Parylene Cold (MODULE/POST_PARYLENE_COLD)

Post-Parylene Warm (MODULE/POST_PARYLENE_WARM)

Wirebond Protection (alt) (MODULE/WIREBOND_PROTECTION)

Parylene Unmasking (MODULE/PARYLENE_UNMASKING)

Parylene Coating (MODULE/PARYLENE_COATING)

Parylene Masking (MODULE/PARYLENE_MASKING)

Initial Cold (MODULE/INITIAL_COLD)

QC cross-check (module swapping) (MODULE/QC_CROSSCHECK)

Initial Warm (MODULE/INITIAL_WARM)

Wire Bonding (MODULE/WIREBONDING)

Bare module to module PCB assembly (MODULE/ASSEMBLY)

Initial state to associate flex to bare module (MODULE/INIT)

Complete (COMPLETE)

PCB Reception at module site (PCB_RECEPTION_MODULE_SITE)

PCB ready for module (PCB_READY_FOR_MODULE)

PCB impossible to recover (PCB/GRAVEYARD)

Test failed, needs investigation (UNHAPPY)

QC (PCB_QC)

QA post radiation cycle (QA_POST_RADIATION_CYCLE)

QA post radiation post thermal cycle QC (QA_POST_RADIATION_POST_THERMAL_CYCLE)

QA pre-radiation cycle (QA_PRE_RADIATION_CYCLE)

QA post-thermal cycle / thermal shock (QA_POST_THERMAL_CYCLE)

QA pre-thermal cycle / thermal shock (QA_PRE_THERMAL_CYCLE)

Population (PCB_POPULATION)

PCB being populated (PCB_BEING_POPULATED)

Reception (PCB_RECEPTION)

Bare PCB Initial (PCB_INIT)

All Registered QC Tests

Check QC Flow

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